Mixed signal design flow, a mixed signal PLL case study

Mixed-signal designs are becoming more and more complex every day. In order to adapt to the new market requirements, a formal process for design and verification of mixed signal systems i. e. top-down design and bottom-up verification methodology is required. This methodology has already been established for digital design. The goal of this research is to propose a new design methodology for mixed signal systems. In the first two chapters of this thesis, the need for a mixed signal design flow based on top-down design methodology will be discussed. The proposed design flow is based on behavioral modeling of the mixed signal system using one of the mixed signal behavioral modeling languages. These models can be used for design and verification through different steps of the design from system level modeling to final physical design. The other advantage of the proposed flow is analog and digital co-design. In the remaining chapters of this thesis, the proposed design flow was verified by designing an 800 MHz mixed signal PLL. The PLL uses a charge pump phase frequency detector, a single capacitor loop filter, and a feed forward error correction architecture using an active damping control circuit instead of passive resistor in loop filter. The design was done in 0. 18- µ m CMOS process technology

Layout-accurate Ultra-fast System-level Design Exploration Through Verilog-ams

This research addresses problems in designing analog and mixed-signal (AMS) systems by bridging the gap between system-level and circuit-level simulation by making simulations fast like system-level and accurate like circuit-level. The tools proposed include metamodel integrated Verilog-AMS based design exploration flows. The research involves design centering, metamodel generation flows for creating efficient behavioral models, and Verilog-AMS integration techniques for model realization. The core of the proposed solution is transistor-level and layout-level metamodeling and their incorporation in Verilog-AMS. Metamodeling is used to construct efficient and layout-accurate surrogate models for AMS system building blocks. Verilog-AMS, an AMS hardware description language, is employed to build surrogate model implementations that can be simulated with industrial standard simulators. The case-study circuits and systems include an operational amplifier (OP-AMP), a voltage-controlled oscillator (VCO), a charge-pump phase-locked loop (PLL), and a continuous-time delta-sigma modulator (DSM). The minimum and maximum error rates of the proposed OP-AMP model are 0.11 % and 2.86 %, respectively. The error rates for the PLL lock time and power estimation are 0.7 % and 3.0 %, respectively. The OP-AMP optimization using the proposed approach is ~17000× faster than the transistor-level model based approach. The optimization achieves a ~4× power reduction for the OP-AMP design. The PLL parasitic-aware optimization achieves a 10× speedup and a 147 µW power reduction. Thus the experimental results validate the effectiveness of the proposed solution

Platform-based design, test and fast verification flow for mixed-signal systems on chip

This research is providing methodologies to enhance the design phase from architectural space exploration and system study to verification of the whole mixed-signal system. At the beginning of the work, some innovative digital IPs have been designed to develop efficient signal conditioning for sensor systems on-chip that has been included in commercial products. After this phase, the main focus has been addressed to the creation of a re-usable and versatile test of the device after the tape-out which is close to become one of the major cost factor for ICs companies, strongly linking it to model’s test-benches to avoid re-design phases and multi-environment scenarios, producing a very effective approach to a single, fast and reliable multi-level verification environment. All these works generated different publications in scientific literature. The compound scenario concerning the development of sensor systems is presented in Chapter 1, together with an overview of the related market with a particular focus on the latest MEMS and MOEMS technology devices, and their applications in various segments. Chapter 2 introduces the state of the art for sensor interfaces: the generic sensor interface concept (based on sharing the same electronics among similar applications achieving cost saving at the expense of area and performance loss) versus the Platform Based Design methodology, which overcomes the drawbacks of the classic solution by keeping the generality at the highest design layers and customizing the platform for a target sensor achieving optimized performances. An evolution of Platform Based Design achieved by implementation into silicon of the ISIF (Intelligent Sensor InterFace) platform is therefore presented. ISIF is a highly configurable mixed-signal chip which allows designers to perform an effective design space exploration and to evaluate directly on silicon the system performances avoiding the critical and time consuming analysis required by standard platform based approach. In chapter 3 we describe the design of a smart sensor interface for conditioning next generation MOEMS. The adoption of a new, high performance and high integrated technology allow us to integrate not only a versatile platform but also a powerful ARM processor and various IPs providing the possibility to use the platform not only as a conditioning platform but also as a processing unit for the application. In this chapter a description of the various blocks is given, with a particular emphasis on the IP developed in order to grant the highest grade of flexibility with the minimum area occupation. The architectural space evaluation and the application prototyping with ISIF has enabled an effective, rapid and low risk development of a new high performance platform achieving a flexible sensor system for MEMS and MOEMS monitoring and conditioning. The platform has been design to cover very challenging test-benches, like a laser-based projector device. In this way the platform will not only be able to effectively handle the sensor but also all the system that can be built around it, reducing the needed for further electronics and resulting in an efficient test bench for the algorithm developed to drive the system. The high costs in ASIC development are mainly related to re-design phases because of missing complete top-level tests. Analog and digital parts design flows are separately verified. Starting from these considerations, in the last chapter a complete test environment for complex mixed-signal chips is presented. A semi-automatic VHDL-AMS flow to provide totally matching top-level is described and then, an evolution for fast self-checking test development for both model and real chip verification is proposed. By the introduction of a Python interface, the designer can easily perform interactive tests to cover all the features verification (e.g. calibration and trimming) into the design phase and check them all with the same environment on the real chip after the tape-out. This strategy has been tested on a consumer 3D-gyro for consumer application, in collaboration with SensorDynamics AG

Learning Approaches to Analog and Mixed Signal Verification and Analysis

The increased integration and interaction of analog and digital components within a system has amplified the need for a fast, automated, combined analog, and digital verification methodology. There are many automated characterization, test, and verification methods used in practice for digital circuits, but analog and mixed signal circuits suffer from long simulation times brought on by transistor-level analysis. Due to the substantial amount of simulations required to properly characterize and verify an analog circuit, many undetected issues manifest themselves in the manufactured chips. Creating behavioral models, a circuit abstraction of analog components assists in reducing simulation time which allows for faster exploration of the design space. Traditionally, creating behavioral models for non-linear circuits is a manual process which relies heavily on design knowledge for proper parameter extraction and circuit abstraction. Manual modeling requires a high level of circuit knowledge and often fails to capture critical effects stemming from block interactions and second order device effects. For this reason, it is of interest to extract the models directly from the SPICE level descriptions so that these effects and interactions can be properly captured. As the devices are scaled, process variations have a more profound effect on the circuit behaviors and performances. Creating behavior models from the SPICE level descriptions, which include input parameters and a large process variation space, is a non-trivial task. In this dissertation, we focus on addressing various problems related to the design automation of analog and mixed signal circuits. Analog circuits are typically highly specialized and fined tuned to fit the desired specifications for any given system reducing the reusability of circuits from design to design. This hinders the advancement of automating various aspects of analog design, test, and layout. At the core of many automation techniques, simulations, or data collection are required. Unfortunately, for some complex analog circuits, a single simulation may take many days. This prohibits performing any type of behavior characterization or verification of the circuit. This leads us to the first fundamental problem with the automation of analog devices. How can we reduce the simulation cost while maintaining the robustness of transistor level simulations? As analog circuits can vary vastly from one design to the next and are hardly ever comprised of standard library based building blocks, the second fundamental question is how to create automated processes that are general enough to be applied to all or most circuit types? Finally, what circuit characteristics can we utilize to enhance the automation procedures? The objective of this dissertation is to explore these questions and provide suitable evidence that they can be answered. We begin by exploring machine learning techniques to model the design space using minimal simulation effort. Circuit partitioning is employed to reduce the complexity of the machine learning algorithms. Using the same partitioning algorithm we further explore the behavior characterization of analog circuits undergoing process variation. The circuit partitioning is general enough to be used by any CMOS based analog circuit. The ideas and learning gained from behavioral modeling during behavior characterization are used to improve the simulation through event propagation, input space search, complexity and information measurements. The reduction of the input space and behavioral modeling of low complexity, low information primitive elements reduces the simulation time of large analog and mixed signal circuits by 50-75%. The method is extended and applied to assist in analyzing analog circuit layout. All of the proposed methods are implemented on analog circuits ranging from small benchmark circuits to large, highly complex and specialized circuits. The proposed dependency based partitioning of large analog circuits in the time domain allows for fast identification of highly sensitive transistors as well as provides a natural division of circuit components. Modeling analog circuits in the time domain with this partitioning technique and SVM learning algorithms allows for very fast transient behavior predictions, three orders of magnitude faster than traditional simulators, while maintaining 95% accuracy. Analog verification can be explored through a reduction of simulation time by utilizing the partitions, information and complexity measures, and input space reduction. Behavioral models are created using supervised learning techniques for detected primitive elements. We will show the effectiveness of the method on four analog circuits where the simulation time is decreased by 55-75%. Utilizing the reduced simulation method, critical nodes can be found quickly and efficiently. The nodes found using this method match those found by an experienced layout engineer, but are detected automatically given the design and input specifications. The technique is further extended to find the tolerance of transistors to both process variation and power supply fluctuation. This information allows for corrections in layout overdesign or guidance in placing noise reducing components such as guard rings or decoupling capacitors. The proposed approaches significantly reduce the simulation time required to perform the tasks traditionally, maintain high accuracy, and can be automated

Rapid SoC Design: On Architectures, Methodologies and Frameworks

Modern applications like machine learning, autonomous vehicles, and 5G networking require an order of magnitude boost in processing capability. For several decades, chip designers have relied on Moore’s Law - the doubling of transistor count every two years to deliver improved performance, higher energy efficiency, and an increase in transistor density. With the end of Dennard’s scaling and a slowdown in Moore’s Law, system architects have developed several techniques to deliver on the traditional performance and power improvements we have come to expect. More recently, chip designers have turned towards heterogeneous systems comprised of more specialized processing units to buttress the traditional processing units. These specialized units improve the overall performance, power, and area (PPA) metrics across a wide variety of workloads and applications. While the GPU serves as a classical example, accelerators for machine learning, approximate computing, graph processing, and database applications have become commonplace. This has led to an exponential growth in the variety (and count) of these compute units found in modern embedded and high-performance computing platforms. The various techniques adopted to combat the slowing of Moore’s Law directly translates to an increase in complexity for modern system-on-chips (SoCs). This increase in complexity in turn leads to an increase in design effort and validation time for hardware and the accompanying software stacks. This is further aggravated by fabrication challenges (photo-lithography, tooling, and yield) faced at advanced technology nodes (below 28nm). The inherent complexity in modern SoCs translates into increased costs and time-to-market delays. This holds true across the spectrum, from mobile/handheld processors to high-performance data-center appliances. This dissertation presents several techniques to address the challenges of rapidly birthing complex SoCs. The first part of this dissertation focuses on foundations and architectures that aid in rapid SoC design. It presents a variety of architectural techniques that were developed and leveraged to rapidly construct complex SoCs at advanced process nodes. The next part of the dissertation focuses on the gap between a completed design model (in RTL form) and its physical manifestation (a GDS file that will be sent to the foundry for fabrication). It presents methodologies and a workflow for rapidly walking a design through to completion at arbitrary technology nodes. It also presents progress on creating tools and a flow that is entirely dependent on open-source tools. The last part presents a framework that not only speeds up the integration of a hardware accelerator into an SoC ecosystem, but emphasizes software adoption and usability.PHDElectrical and Computer EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttp://deepblue.lib.umich.edu/bitstream/2027.42/168119/1/ajayi_1.pd

Development and validation of a microcontroller emissions model

A model of the power delivery network of a microcontroller was developed to predict the radiated and conducted emissions from the integrated circuit (IC). A SPICE model of the power delivery network, similar to the ICEM model, was developed for a microcontroller running a typical program and used to predict the noise voltage between the power and return planes of a printed circuit board (PCB)

Characterization of process variability and robust optimization of analog circuits

Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2008.Includes bibliographical references (p. 161-174).Continuous scaling of CMOS technology has enabled dramatic performance enhancement of CMOS devices and has provided speed, power, and density improvement in both digital and analog circuits. CMOS millimeter-wave applications operating at more than 50GHz frequencies has become viable in sub-100nm CMOS technologies, providing advantages in cost and high density integration compared to other heterogeneous technologies such as SiGe and III-V compound semiconductors. However, as the operating frequency of CMOS circuits increases, it becomes more difficult to obtain sufficiently wide operating ranges for robust operation in essential analog building blocks such as voltage-controlled oscillators (VCOs) and frequency dividers. The fluctuations of circuit parameters caused by the random and systematic variations in key manufacturing steps become more significant in nano-scale technologies. The process variation of circuit performance is quickly becoming one of the main concerns in high performance analog design. In this thesis, we show design and analysis of a VCO and frequency divider operating beyond 70GHz in a 65nm SOI CMOS technology. The VCO and frequency divider employ design techniques enlarging frequency operating ranges to improve the robustness of circuit operation. Circuit performance is measured from a number of die samples to identify the statistical properties of performance variation. A back-propagation of variation (BPV) scheme based on sensitivity analysis of circuit performance is proposed to extract critical circuit parameter variation using statistical measurement results of the frequency divider. We analyze functional failure caused by performance variability, and propose dynamic and static optimization methods to improve parametric yield. An external bias control is utilized to dynamically tune the divider operating range and to compensate for performance variation. A novel time delay model of a differential CML buffer is proposed to functionally approximate the maximum operating frequency of the frequency divider, which dramatically reduces computational cost of parametric yield estimation. The functional approximation enables the optimization of the VCO and frequency divider parametric yield with a reasonable amount of simulation time.by Daihyun Lim.Ph.D

A Low-Power DSP Architecture for a Fully Implantable Cochlear Implant System-on-a-Chip.

The National Science Foundation Wireless Integrated Microsystems (WIMS) Engineering Research Center at the University of Michigan developed Systems-on-a-Chip to achieve biomedical implant and environmental monitoring functionality in low-milliwatt power consumption and 1-2 cm3 volume. The focus of this work is implantable electronics for cochlear implants (CIs), surgically implanted devices that utilize existing nerve connections between the brain and inner-ear in cases where degradation of the sensory hair cells in the cochlea has occurred. In the absence of functioning hair cells, a CI processes sound information and stimulates the nderlying nerve cells with currents from implanted electrodes, enabling the patient to understand speech. As the brain of the WIMS CI, the WIMS microcontroller unit (MCU) delivers the communication, signal processing, and storage capabilities required to satisfy the aggressive goals set forth. The 16-bit MCU implements a custom instruction set architecture focusing on power-efficient execution by providing separate data and address register windows, multi-word arithmetic, eight addressing modes, and interrupt and subroutine support. Along with 32KB of on-chip SRAM, a low-power 512-byte scratchpad memory is utilized by the WIMS custom compiler to obtain an average of 18% energy savings across benchmarks. A synthesizable dynamic frequency scaling circuit allows the chip to select a precision on-chip LC or ring oscillator, and perform clock scaling to minimize power dissipation; it provides glitch-free, software-controlled frequency shifting in 100ns, and dissipates only 480μW. A highly flexible and expandable 16-channel Continuous Interleaved Sampling Digital Signal Processor (DSP) is included as an MCU peripheral component. Modes are included to process data, stimulate through electrodes, and allow experimental stimulation or processing. The entire WIMS MCU occupies 9.18mm2 and consumes only 1.79mW from 1.2V in DSP mode. This is the lowest reported consumption for a cochlear DSP. Design methodologies were analyzed and a new top-down design flow is presented that encourages hardware and software co-design as well as cross-domain verification early in the design process. An O(n) technique for energy-per-instruction estimations both pre- and post-silicon is presented that achieves less than 4% error across benchmarks. This dissertation advances low-power system design while providing an improvement in hearing recovery devices.Ph.D.Electrical EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttp://deepblue.lib.umich.edu/bitstream/2027.42/91488/1/emarsman_1.pd