An approach to dynamic power consumption current testing of CMOS ICs

© 1995 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes,creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.I/sub DDQ/ testing is a powerful strategy for detecting defects that do not alter the logic behavior of CMOS ICs. Such a technique is very effective especially in the detection of bridging defects although some opens can be also detected. However, an important set of open and parametric defects escape quiescent power supply current testing because they prevent current elevation. Extending the consumption current testing time, from the static period to the dynamic one (i.e. considering the transient current), defects not covered with I/sub DDQ/ can be detected. Simulations using an on-chip sensor show that this technique can reach a high coverage for defects preventing current and also for those raising the static power consumption.Peer ReviewedPostprint (published version

Concepts for on-board satellite image registration. Volume 3: Impact of VLSI/VHSIC on satellite on-board signal processing

Anticipated major advances in integrated circuit technology in the near future are described as well as their impact on satellite onboard signal processing systems. Dramatic improvements in chip density, speed, power consumption, and system reliability are expected from very large scale integration. Improvements are expected from very large scale integration enable more intelligence to be placed on remote sensing platforms in space, meeting the goals of NASA's information adaptive system concept, a major component of the NASA End-to-End Data System program. A forecast of VLSI technological advances is presented, including a description of the Defense Department's very high speed integrated circuit program, a seven-year research and development effort

Asynchronous Circuit Stacking for Simplified Power Management

As digital integrated circuits (ICs) continue to increase in complexity, new challenges arise for designers. Complex ICs are often designed by incorporating multiple power domains therefore requiring multiple voltage converters to produce the corresponding supply voltages. These converters not only take substantial on-chip layout area and/or off-chip space, but also aggregate the power loss during the voltage conversions that must occur fast enough to maintain the necessary power supplies. This dissertation work presents an asynchronous Multi-Threshold NULL Convention Logic (MTNCL) “stacked” circuit architecture that alleviates this problem by reducing the number of voltage converters needed to supply the voltage the ICs operate at. By stacking multiple MTNCL circuits between power and ground, supplying a multiple of VDD to the entire stack and incorporating simple control mechanisms, the dynamic range fluctuation problem can be mitigated. A 130nm Bulk CMOS process and a 32nm Silicon-on-Insulator (SOI) CMOS process are used to evaluate the theoretical effect of stacking different circuitry while running different workloads. Post parasitic physical implementations are then carried out in the 32nm SOI process for demonstrating the feasibility and analyzing the advantages of the proposed MTNCL stacking architecture

Single-Event Upset Analysis and Protection in High Speed Circuits

The effect of single-event transients (SETs) (at a combinational node of a design) on the system reliability is becoming a big concern for ICs manufactured using advanced technologies. An SET at a node of combinational part may cause a transient pulse at the input of a flip-flop and consequently is latched in the flip-flop and generates a soft-error. When an SET conjoined with a transition at a node along a critical path of the combinational part of a design, a transient delay fault may occur at the input of a flip-flop. On the other hand, increasing pipeline depth and using low power techniques such as multi-level power supply, and multi-threshold transistor convert almost all paths in a circuit to critical ones. Thus, studying the behavior of the SET in these kinds of circuits needs special attention. This paper studies the dynamic behavior of a circuit with massive critical paths in the presence of an SET. We also propose a novel flip-flop architecture to mitigate the effects of such SETs in combinational circuits. Furthermore, the proposed architecture can tolerant a single event upset (SEU) caused by particle strike on the internal nodes of a flip-flo

A neural probe with up to 966 electrodes and up to 384 configurable channels in 0.13 μm SOI CMOS

In vivo recording of neural action-potential and local-field-potential signals requires the use of high-resolution penetrating probes. Several international initiatives to better understand the brain are driving technology efforts towards maximizing the number of recording sites while minimizing the neural probe dimensions. We designed and fabricated (0.13-μm SOI Al CMOS) a 384-channel configurable neural probe for large-scale in vivo recording of neural signals. Up to 966 selectable active electrodes were integrated along an implantable shank (70 μm wide, 10 mm long, 20 μm thick), achieving a crosstalk of −64.4 dB. The probe base (5 × 9 mm2) implements dual-band recording and a 1

A 10-Gb/s two-dimensional eye-opening monitor in 0.13-μm standard CMOS

An eye-opening monitor (EOM) architecture that can capture a two-dimensional (2-D) map of the eye diagram of a high-speed data signal has been developed. Two single-quadrant phase rotators and one digital-to-analog converter (DAC) are used to generate rectangular masks with variable sizes and aspect ratios. Each mask is overlapped with the received eye diagram and the number of signal transitions inside the mask is recorded as error. The combination of rectangular masks with the same error creates error contours that overall provide a 2-D map of the eye. The authors have implemented a prototype circuit in 0.13-μm standard CMOS technology that operates up to 12.5 Gb/s at 1.2-V supply. The EOM maps the input eye to a 2-D error diagram with up to 68-dB mask error dynamic range. The left and right halves of the eyes are monitored separately to capture horizontally asymmetric eyes. The chip consumes 330 mW and operates reliably with supply voltages as low as 1 V at 10 Gb/s. The authors also present a detailed analysis that verifies if the measurements are in good agreement with the expected results