Exploiting Application Behaviors for Resilient Static Random Access Memory Arrays in the Near-Threshold Computing Regime

Near-Threshold Computing embodies an intriguing choice for mobile processors due to the promise of superior energy efficiency, extending the battery life of these devices while reducing the peak power draw. However, process, voltage, and temperature variations cause a significantly high failure rate of Level One cache cells in the near-threshold regime a stark contrast to designs in the super-threshold regime, where fault sites are rare. This thesis work shows that faulty cells in the near-threshold regime are highly clustered in certain regions of the cache. In addition, popular mobile benchmarks are studied to investigate the impact of run-time workloads on timing faults manifestation. A technique to mitigate the run-time faults is proposed. This scheme maps frequently used data to healthy cache regions by exploiting the application cache behaviors. The results show up to 78% gain in performance over two other state-of-the-art techniques

Impact on performance and energy of the retention time and processor frequency in L1 macrocell-based data caches

[EN] Cache memories dissipate an important amount of the energy budget in current microprocessors. This is mainly due to cache cells are typically implemented with six transistors. To tackle this design concern, recent research has focused on the proposal of new cache cells. An n-bit cache cell, namely macrocell, has been proposed in a previous work. This cell combines SRAM and eDRAM technologies with the aim of reducing energy consumption while maintaining the performance. The capacitance of eDRAM cells impacts on energy consumption and performance since these cells lose their state once the retention time expires. On such a case, data must be fetched from a lower level of the memory hierarchy, so negatively impacting on performance and energy consumption. As opposite, if the capacitance is too high, energy would be wasted without bringing performance benefits. This paper identifies the optimal capacitance for a given processor frequency. To this end, the tradeoff between performance and energy consumption of a macrocell-based cache has been evaluated varying the capacitance and frequency. Experimental results show that, compared to a conventional cache, performance losses are lower than 2% and energy savings are up to 55% for a cache with 10 fF capacitors and frequencies higher than 1 GHz. In addition, using trench capacitors, a 4-bit macrocell reduces by 29% the area of four conventional SRAM cells.This work was supported in part by Spanish CICYT under Grant TIN2009-14475-C04-01, by Consolider-Ingenio 2010 under Grant CSD2006-00046, and by European community’s Seventh Framework Programme (FP7/2007-2013) under Grant 289154.Valero Bresó, A.; Sahuquillo Borrás, J.; Lorente Garcés, VJ.; Petit Martí, SV.; López Rodríguez, PJ.; Duato Marín, JF. (2012). Impact on performance and energy of the retention time and processor frequency in L1 macrocell-based data caches. IEEE Transactions on Very Large Scale Integration (VLSI) Systems. 20(6):1108-1117. https://doi.org/10.1109/TVLSI.2011.2142202S1108111720

Multi-criteria optimization for energy-efficient multi-core systems-on-chip

The steady down-scaling of transistor dimensions has made possible the evolutionary progress leading to today’s high-performance multi-GHz microprocessors and core based System-on-Chip (SoC) that offer superior performance, dramatically reduced cost per function, and much-reduced physical size compared to their predecessors. On the negative side, this rapid scaling however also translates to high power densities, higher operating temperatures and reduced reliability making it imperative to address design issues that have cropped up in its wake. In particular, the aggressive physical miniaturization have increased CMOS fault sensitivity to the extent that many reliability constraints pose threat to the device normal operation and accelerate the onset of wearout-based failures. Among various wearout-based failure mechanisms, Negative biased temperature instability (NBTI) has been recognized as the most critical source of device aging. The urge of reliable, low-power circuits is driving the EDA community to develop new design techniques, circuit solutions, algorithms, and software, that can address these critical issues. Unfortunately, this challenge is complicated by the fact that power and reliability are known to be intrinsically conflicting metrics: traditional solutions to improve reliability such as redundancy, increase of voltage levels, and up-sizing of critical devices do contrast with traditional low-power solutions, which rely on compact architectures, scaled supply voltages, and small devices. This dissertation focuses on methodologies to bridge this gap and establishes an important link between low-power solutions and aging effects. More specifically, we proposed new architectural solutions based on power management strategies to enable the design of low-power, aging aware cache memories. Cache memories are one of the most critical components for warranting reliable and timely operation. However, they are also more susceptible to aging effects. Due to symmetric structure of a memory cell, aging occurs regardless of the fact that a cell (or word) is accessed or not. Moreover, aging is a worst-case matric and line with worst-case access pattern determines the aging of the entire cache. In order to stop the aging of a memory cell, it must be put into a proper idle state when a cell (or word) is not accessed which require proper management of the idleness of each atomic unit of power management. We have proposed several reliability management techniques based on the idea of cache partitioning to alleviate NBTI-induced aging and obtain joint energy and lifetime benefits. We introduce graceful degradation mechanism which allows different cache blocks into which a cache is partitioned to age at different rates. This implies that various sub-blocks become unreliable at different times, and the cache keeps functioning with reduced efficiency. We extended the capabilities of this architecture by integrating the concept of reconfigurable caches to maintain the performance of the cache throughout its lifetime. By this strategy, whenever a block becomes unreliable, the remaining cache is reconfigured to work as a smaller size cache with only a marginal degradation of performance. Many mission-critical applications require guaranteed lifetime of their operations and therefore the hardware implementing their functionality. Such constraints are usually enforced by means of various reliability enhancing solutions mostly based on redundancy which are not energy-friendly. In our work, we have proposed a novel cache architecture in which a smart use of cache partitions for redundancy allows us to obtain cache that meet a desired lifetime target with minimal energy consumption

Cache architectures based on heterogeneous technologies to deal with manufacturing errors

[EN] SRAM technology has traditionally been used to implement processor caches since it is the fastest existing RAM technology.However,one of the major drawbacks of this technology is its high energy consumption.To reduce this energy consumption modern processors mainly use two complementary techniques: i)low-power operating modes and ii)low-power memory technologies.The first technique allows the processor working at low clock frequencies and supply voltages.The main limitation of this technique is that manufacturing defects can significantly affect the reliability of SRAM cells when working these modes.The second technique brings alternative technologies such as eDRAM, which provides minimum area and power consumption.The main drawback of this memory technology is that reads are destructive and eDRAM cells work slower than SRAM ones. This thesis presents three main contributions regarding low-power caches and heterogeneous technologies: i)an study that identifies the optimal capacitance of eDRAM cells, ii)a novel cache design that tolerates the faults produced by SRAM cells in low-power modes, iii)a methodology that allows obtain the optimal operating frequency/voltage level when working with low-power modes. Regarding the first contribution,in this work SRAM and eDRAM technologies are combined to achieve a low-power fast cache that requires smaller area than conventional designs and that tolerates SRAM failures.First,this dissertation focuses on one of the main critical aspects of the design of heterogeneous caches:eDRAM cell capacitance.In this dissertation the optimal capacitance for an heterogeneous L1 data cache is identified by analyzing the compromise between performance and energy consumption.Experimental results show that an heterogeneous cache implemented with 10fF capacitors offers similar performance as a conventional SRAM cache while providing 55% energy savings and reducing by 29% the cache area. Regarding the second contribution,this thesis proposes a novel organization for a fault-tolerant heterogeneous cache.Currently,reducing the supply voltage is a mechanism widely used to reduce consumption and applies when the system workload activity decreases.However,SRAM cells cause different types of failures when the supply voltage is reduced and thus they limit the minimum operating voltage of the microprocessor. In the proposal,memory cells implemented with eDRAM technology serve as backup in case of failure of SRAM cells, because the correct operation of eDRAM cells is not affected by reduced voltages. The proposed architecture has two working modes: high-performance mode for supply voltages that do not induce SRAM cell failures, and low-power mode for those voltages that cause SRAM cell failures. In high-performance mode, the cache provides full capacity, which enables the processor to achieve its maximum performance. In low-power mode, the effective capacity of the cache is reduced because some of the eDRAM cells are dedicated to recover from SRAM failures. Experimental results show that the performance is scarcely reduced (e.g. less than 2.7% across all the studied benchmarks) with respect to an ideal SRAM cache without failures. Finally,this thesis proposes a methodology to find the optimal frequency/voltage level regarding energy consumption for the designed heterogeneous cache. For this purpose, first SRAM failure types and their probabilities are characterized.Then,the energy consumption of different frequency/voltage levels is evaluated when the system works in low-power mode.The study shows that, mainly due to the impact of SRAM failures on performance,the optimal combination of voltage and frequency from the energy point of view does not always correspond to the minimum voltage.[ES] La tecnología SRAM se ha utilizado tradicionalmente para implementar las memorias cache debido a que es la tecnología de memoria RAM más rápida existente.Por contra,uno de los principales inconvenientes de esta tecnología es su elevado consumo energético.Para reducirlo los procesadores modernos suelen emplear dos técnicas complementarias:i) modos de funcionamiento de bajo consumo y ii)tecnologías de bajo consumo.La primeras técnica consiste en utilizar bajas frecuencias y voltajes de funcionamiento.La principal limitación de esta técnica es que los defectos de fabricación pueden afectar notablemente a la fiabilidad de las celdas SRAM en estos modos.La segunda técnica agrupa tecnologías alternativas como la eDRAM,que ofrece área y consumo mínimos.El inconveniente de esta tecnología es que las lecturas son destructivas y es más lenta que la SRAM. Esta tesis presenta tres contribuciones principales centradas en caches de bajo consumo y tecnologías heterogéneas: i)estudio de la capacitancia óptima de las celdas eDRAM, ii)diseño de una cache tolerante a fallos producidos en las celdas SRAM en modos de bajo consumo, iii)metodología para obtener la relación óptima entre voltaje y frecuencia en procesadores con modos de bajo consumo. Respecto a la primera contribución,en este trabajo se combinan las tecnologías SRAM y eDRAM para conseguir una memoria cache rápida, de bajo consumo, área reducida, y tolerante a los fallos inherentes a la tecnología SRAM.En primer lugar,esta disertación se centra en uno de los aspectos críticos de diseño de caches heterogéneas SRAM/eDRAM: la capacitancia de los condensadores implementados con tecnología eDRAM.En esta tesis se identifica la capacitancia óptima de una cache de datos L1 heterogénea mediante el estudio del compromiso entre prestaciones y consumo energético.Los resultados experimentales muestran que condensadores de 10fF ofrecen prestaciones similares a las de una cache SRAM convencional ahorrando un 55% de consumo y reduciendo un 29% el área ocupada por la cache. Respecto a la segunda contribución,esta tesis propone una organización de cache heterogénea tolerante a fallos.Actualmente,reducir el voltaje de alimentación es un mecanismo muy utilizado para reducir el consumo en condiciones de baja carga.Sin embargo,las celdas SRAM producen distintos tipos de fallos cuando se reduce el voltaje de alimentación y por tanto limitan el voltaje mínimo de funcionamiento del microprocesador. En la cache heterogénea propuesta,las celdas de memoria implementadas con tecnología eDRAM sirven de copia de seguridad en caso de fallo de las celdas SRAM, ya que el correcto funcionamiento de las celdas eDRAM no se ve afectado por tensiones reducidas.La arquitectura propuesta consta de dos modos de funcionamiento: high-performance mode para voltajes de alimentación que no inducen fallos en celdas implementadas en tecnología SRAM, y low-power mode para aquellos que sí lo hacen. En el modo high-performance mode,el procesador dispone de toda la capacidad de la cache.En el modo low-power mode se reduce la capacidad efectiva de la cache puesto que algunas de las celdas eDRAM se dedican a la recuperación de fallos de celdas SRAM.El estudio de prestaciones realizado muestra que éstas bajan hasta un máximo de 2.7% con respecto a una cache perfecta sin fallos. Finalmente, en esta tesis se propone una metodología para encontrar la relación óptima de voltaje/frecuencia con respecto al consumo energético sobre la cache heterogénea previamente diseñada. Para ello,primero se caracterizan los tipos de fallos SRAM y las probabilidades de fallo de los mismos.Después,se evalúa el consumo energético de diferentes combinaciones de voltaje/frecuencia cuando el sistema se encuentra en un modo de bajo consumo.El estudio muestra que la combinación óptima de voltaje y frecuencia desde el punto de vista energético no siempre corresponde al mínimo voltaje debido al imp[CA] La tecnologia SRAM s'ha utilitzat tradicionalment per a implementar les memòries cau degut a que és la tecnologia de memòria RAM més ràpida existent.Per contra, un dels principals inconvenients d'aquesta tecnologia és el seu elevat consum energètic.Per a reduir el consum els processadors moderns solen emprar dues tècniques complementàries: i)modes de funcionament de baix consum i ii)tecnologies de baix consum.La primera tècnica consisteix en utilitzar baixes freqüències i voltatges de funcionament.La principal limitació d'aquesta tècnica és que els defectes de fabricació poden afectar notablement a la fiabilitat de les cel·les SRAM en aquests modes.La segona tècnica agrupa tecnologies alternatives com la eDRAM, que ofereix àrea i consum mínims.L'inconvenient d'aquesta tecnologia és que les lectures són destructives i és més lenta que la SRAM. Aquesta tesi presenta tres contribucions principals centrades en caus de baix consum i tecnologies heterogènies: i)estudi de la capacitancia òptima de les cel·les eDRAM, ii)disseny d'una cau tolerant a fallades produïdes en les cel·les SRAM en modes de baix consum, iii)metodologia per a obtenir la relació òptima entre voltatge i freqüència en processadors amb modes de baix consum. Respecte a la primera contribució, en aquest treball es combinen les tecnologies SRAM i eDRAM per a aconseguir una memòria cau ràpida, de baix consum, àrea reduïda, i tolerant a les fallades inherents a la tecnologia SRAM.En primer lloc, aquesta dissertació se centra en un dels aspectes crítics de disseny de caus heterogènies: la capacitancia dels condensadors implementats amb tecnologia eDRAM.En aquesta dissertació s'identifica la capacitancia òptima d'una cache de dades L1 heterogènia mitjançant l'estudi del compromís entre prestacions i consum energètic.Els resultats experimentals mostren que condensadors de 10fF ofereixen prestacions similars a les d'una cau SRAM convencional estalviant un 55% de consum i reduint un 29% l'àrea ocupada per la cau. Respecte a la segona contribució, aquesta tesi proposa una organització de cau heterogènia tolerant a fallades.Actualment,reduir el voltatge d'alimentació és un mecanisme molt utilitzat per a reduir el consum en condicions de baixa càrrega.Per contra, les cel·les SRAM produeixen diferents tipus de fallades quan es redueix el voltatge d'alimentació i per tant limiten el voltatge mínim de funcionament del microprocessador. En la cau heterogènia proposta, les cel·les de memòria implementades amb tecnologia eDRAM serveixen de còpia de seguretat en cas de fallada de les cel·les SRAM, ja que el correcte funcionament de les cel·les eDRAM no es veu afectat per tensions reduïdes.L'arquitectura proposada consta de dues maneres de funcionament: high-performance mode per a voltatges d'alimentació que no indueixen fallades en cel·les implementades en tecnologia SRAM,i low-power mode per a aquells que sí ho fan.En el mode high-performance,el processador disposa de tota la capacitat de la cau.En el mode low-power es redueix la capacitat efectiva de la cau posat que algunes de les cel·les eDRAM es dediquen a la recuperació de fallades de cel·les SRAM.L'estudi de prestacions realitzat mostra que aquestes baixen fins a un màxim de 2.7% pel que fa a una cache perfecta sense fallades. Finalment,en aquesta tesi es proposa una metodologia per a trobar la relació òptima de voltatge/freqüència pel que fa al consum energètic sobre la cau heterogènia prèviament dissenyada.Per a açò,primer es caracteritzen els tipus de fallades SRAM i les probabilitats de fallada de les mateixes.Després,s'avalua el consum energètic de diferents combinacions de voltatge/freqüència quan el sistema es troba en un mode de baix consum.L'estudi mostra que la combinació òptima de voltatge i freqüència des del punt de vista energètic no sempre correspon al mínim voltatge degut a l'impacte de les fallades de SRAM en les presLorente Garcés, VJ. (2015). Cache architectures based on heterogeneous technologies to deal with manufacturing errors [Tesis doctoral no publicada]. Universitat Politècnica de València. https://doi.org/10.4995/Thesis/10251/58428TESI

Fault and Defect Tolerant Computer Architectures: Reliable Computing With Unreliable Devices

This research addresses design of a reliable computer from unreliable device technologies. A system architecture is developed for a fault and defect tolerant (FDT) computer. Trade-offs between different techniques are studied and yield and hardware cost models are developed. Fault and defect tolerant designs are created for the processor and the cache memory. Simulation results for the content-addressable memory (CAM)-based cache show 90% yield with device failure probabilities of 3 x 10(-6), three orders of magnitude better than non fault tolerant caches of the same size. The entire processor achieves 70% yield with device failure probabilities exceeding 10(-6). The required hardware redundancy is approximately 15 times that of a non-fault tolerant design. While larger than current FT designs, this architecture allows the use of devices much more likely to fail than silicon CMOS. As part of model development, an improved model is derived for NAND Multiplexing. The model is the first accurate model for small and medium amounts of redundancy. Previous models are extended to account for dependence between the inputs and produce more accurate results

Spin-Transfer-Torque (STT) Devices for On-chip Memory and Their Applications to Low-standby Power Systems

With the scaling of CMOS technology, the proportion of the leakage power to total power consumption increases. Leakage may account for almost half of total power consumption in high performance processors. In order to reduce the leakage power, there is an increasing interest in using nonvolatile storage devices for memory applications. Among various promising nonvolatile memory elements, spin-transfer torque magnetic RAM (STT-MRAM) is identified as one of the most attractive alternatives to conventional SRAM. However, several design challenges of STT-MRAM such as shared read and write current paths, single-ended sensing, and high dynamic power are major challenges to be overcome to make it suitable for on-chip memories. To mitigate such problems, we propose a domain wall coupling based spin-transfer torque (DWCSTT) device for on-chip caches. Our proposed DWCSTT bit-cell decouples the read and the write current paths by the electrically-insulating magnetic coupling layer so that we can separately optimize read operation without having an impact on write-ability. In addition, the complementary polarizer structure in the read path of the DWCSTT device allows DWCSTT to enable self-referenced differential sensing. DWCSTT bit-cells improve the write power consumption due to the low electrical resistance of the write current path. Furthermore, we also present three different bit-cell level design techniques of Spin-Orbit Torque MRAM (SOT-MRAM) for alleviating some of the inefficiencies of conventional magnetic memories while maintaining the advantages of spin-orbit torque (SOT) based novel switching mechanism such as low write current requirement and decoupled read and write current path. Our proposed SOT-MRAM with supporting dual read/write ports (1R/1W) can address the issue of high-write latency of STT-MRAM by simultaneous 1R/1W accesses. Second, we propose a new type of SOT-MRAM which uses only one access transistor along with a Schottky diode in order to mitigate the area-overhead caused by two access transistors in conventional SOT-MRAM. Finally, a new design technique of SOT-MRAM is presented to improve the integration density by utilizing a shared bit-line structure

Gestión de jerarquías de memoria híbridas a nivel de sistema

Tesis inédita de la Universidad Complutense de Madrid, Facultad de Informática, Departamento de Arquitectura de Computadoras y Automática y de Ku Leuven, Arenberg Doctoral School, Faculty of Engineering Science, leída el 11/05/2017.In electronics and computer science, the term ‘memory’ generally refers to devices that are used to store information that we use in various appliances ranging from our PCs to all hand-held devices, smart appliances etc. Primary/main memory is used for storage systems that function at a high speed (i.e. RAM). The primary memory is often associated with addressable semiconductor memory, i.e. integrated circuits consisting of silicon-based transistors, used for example as primary memory but also other purposes in computers and other digital electronic devices. The secondary/auxiliary memory, in comparison provides program and data storage that is slower to access but offers larger capacity. Examples include external hard drives, portable flash drives, CDs, and DVDs. These devices and media must be either plugged in or inserted into a computer in order to be accessed by the system. Since secondary storage technology is not always connected to the computer, it is commonly used for backing up data. The term storage is often used to describe secondary memory. Secondary memory stores a large amount of data at lesser cost per byte than primary memory; this makes secondary storage about two orders of magnitude less expensive than primary storage. There are two main types of semiconductor memory: volatile and nonvolatile. Examples of non-volatile memory are ‘Flash’ memory (sometimes used as secondary, sometimes primary computer memory) and ROM/PROM/EPROM/EEPROM memory (used for firmware such as boot programs). Examples of volatile memory are primary memory (typically dynamic RAM, DRAM), and fast CPU cache memory (typically static RAM, SRAM, which is fast but energy-consuming and offer lower memory capacity per are a unit than DRAM). Non-volatile memory technologies in Si-based electronics date back to the 1990s. Flash memory is widely used in consumer electronic products such as cellphones and music players and NAND Flash-based solid-state disks (SSDs) are increasingly displacing hard disk drives as the primary storage device in laptops, desktops, and even data centers. The integration limit of Flash memories is approaching, and many new types of memory to replace conventional Flash memories have been proposed. The rapid increase of leakage currents in Silicon CMOS transistors with scaling poses a big challenge for the integration of SRAM memories. There is also the case of susceptibility to read/write failure with low power schemes. As a result of this, over the past decade, there has been an extensive pooling of time, resources and effort towards developing emerging memory technologies like Resistive RAM (ReRAM/RRAM), STT-MRAM, Domain Wall Memory and Phase Change Memory(PRAM). Emerging non-volatile memory technologies promise new memories to store more data at less cost than the expensive-to build silicon chips used by popular consumer gadgets including digital cameras, cell phones and portable music players. These new memory technologies combine the speed of static random-access memory (SRAM), the density of dynamic random-access memory (DRAM), and the non-volatility of Flash memory and so become very attractive as another possibility for future memory hierarchies. The research and information on these Non-Volatile Memory (NVM) technologies has matured over the last decade. These NVMs are now being explored thoroughly nowadays as viable replacements for conventional SRAM based memories even for the higher levels of the memory hierarchy. Many other new classes of emerging memory technologies such as transparent and plastic, three-dimensional(3-D), and quantum dot memory technologies have also gained tremendous popularity in recent years...En el campo de la informática, el término ‘memoria’ se refiere generalmente a dispositivos que son usados para almacenar información que posteriormente será usada en diversos dispositivos, desde computadoras personales (PC), móviles, dispositivos inteligentes, etc. La memoria principal del sistema se utiliza para almacenar los datos e instrucciones de los procesos que se encuentre en ejecución, por lo que se requiere que funcionen a alta velocidad (por ejemplo, DRAM). La memoria principal está implementada habitualmente mediante memorias semiconductoras direccionables, siendo DRAM y SRAM los principales exponentes. Por otro lado, la memoria auxiliar o secundaria proporciona almacenaje(para ficheros, por ejemplo); es más lenta pero ofrece una mayor capacidad. Ejemplos típicos de memoria secundaria son discos duros, memorias flash portables, CDs y DVDs. Debido a que estos dispositivos no necesitan estar conectados a la computadora de forma permanente, son muy utilizados para almacenar copias de seguridad. La memoria secundaria almacena una gran cantidad de datos aun coste menor por bit que la memoria principal, siendo habitualmente dos órdenes de magnitud más barata que la memoria primaria. Existen dos tipos de memorias de tipo semiconductor: volátiles y no volátiles. Ejemplos de memorias no volátiles son las memorias Flash (algunas veces usadas como memoria secundaria y otras veces como memoria principal) y memorias ROM/PROM/EPROM/EEPROM (usadas para firmware como programas de arranque). Ejemplos de memoria volátil son las memorias DRAM (RAM dinámica), actualmente la opción predominante a la hora de implementar la memoria principal, y las memorias SRAM (RAM estática) más rápida y costosa, utilizada para los diferentes niveles de cache. Las tecnologías de memorias no volátiles basadas en electrónica de silicio se remontan a la década de1990. Una variante de memoria de almacenaje por carga denominada como memoria Flash es mundialmente usada en productos electrónicos de consumo como telefonía móvil y reproductores de música mientras NAND Flash solid state disks(SSDs) están progresivamente desplazando a los dispositivos de disco duro como principal unidad de almacenamiento en computadoras portátiles, de escritorio e incluso en centros de datos. En la actualidad, hay varios factores que amenazan la actual predominancia de memorias semiconductoras basadas en cargas (capacitivas). Por un lado, se está alcanzando el límite de integración de las memorias Flash, lo que compromete su escalado en el medio plazo. Por otra parte, el fuerte incremento de las corrientes de fuga de los transistores de silicio CMOS actuales, supone un enorme desafío para la integración de memorias SRAM. Asimismo, estas memorias son cada vez más susceptibles a fallos de lectura/escritura en diseños de bajo consumo. Como resultado de estos problemas, que se agravan con cada nueva generación tecnológica, en los últimos años se han intensificado los esfuerzos para desarrollar nuevas tecnologías que reemplacen o al menos complementen a las actuales. Los transistores de efecto campo eléctrico ferroso (FeFET en sus siglas en inglés) se consideran una de las alternativas más prometedores para sustituir tanto a Flash (por su mayor densidad) como a DRAM (por su mayor velocidad), pero aún está en una fase muy inicial de su desarrollo. Hay otras tecnologías algo más maduras, en el ámbito de las memorias RAM resistivas, entre las que cabe destacar ReRAM (o RRAM), STT-RAM, Domain Wall Memory y Phase Change Memory (PRAM)...Depto. de Arquitectura de Computadores y AutomáticaFac. de InformáticaTRUEunpu

Computing with Spintronics: Circuits and architectures

This thesis makes the following contributions towards the design of computing platforms with spintronic devices. 1) It explores the use of spintronic memories in the design of a domain-specific processor for an emerging class of data-intensive applications, namely recognition, mining and synthesis (RMS). Two different spintronic memory technologies — Domain Wall Memory (DWM) and STT-MRAM — are utilized to realize the different levels in the memory hierarchy of the domain-specific processor, based on their respective access characteristics. Architectural tradeoffs created by the use of spintronic memories are analyzed. The proposed design achieves 1.5X-4X improvements in energy-delay product compared to a CMOS baseline. 2) It describes the first attempt to use DWM in the cache hierarchy of general-purpose processors. DWM promises unparalleled density by packing several bits of data into each bit-cell. TapeCache, the proposed DWM-based cache architecture, utilizes suitable circuit and architectural optimizations to address two key challenges (i) the high energy and latency requirement of write operations and (ii) the need for shift operations to access the data stored in each DWM bit-cell. At the circuit level, DWM bit-cells that are tailored to the distinct design requirements of different levels in the cache hierarchy are proposed. At the architecture level, TapeCache proposes suitable cache organization and management policies to alleviate the performance impact of shift operations required to access data stored in DWM bit-cells. TapeCache achieves more than 7X improvements in both cache area and energy with virtually identical performance compared to an SRAM-based cache hierarchy. 3) It investigates the design of the on-chip memory hierarchy of general-purpose graphics processing units (GPGPUs)—massively parallel processors that are optimized for data-intensive high-throughput workloads—using DWM. STAG, a high density, energy-efficient Spintronic- Tape Architecture for GPGPU cache hierarchies is described. STAG utilizes different DWM bit-cells to realize different memory arrays in the GPGPU cache hierarchy. To address the challenge of high access latencies due to shifts, STAG predicts upcoming cache accesses by leveraging unique characteristics of GPGPU architectures and workloads, and prefetches data that are both likely to be accessed and require large numbers of shift operations. STAG achieves 3.3X energy reduction and 12.1% performance improvement over CMOS SRAM under iso-area conditions. 4) While the potential of spintronic devices for memories is widely recognized, their utility in realizing logic is much less clear. The thesis presents Spintastic, a new paradigm that utilizes Stochastic Computing (SC) to realize spintronic logic. In SC, data is encoded in the form of pseudo-random bitstreams, such that the probability of a \u271\u27 in a bitstream corresponds to the numerical value that it represents. SC can enable compact, low-complexity logic implementations of various arithmetic functions. Spintastic establishes the synergy between stochastic computing and spin-based logic by demonstrating that they mutually alleviate each other\u27s limitations. On the one hand, various building blocks of SC, which incur significant overheads in CMOS implementations, can be efficiently realized by exploiting the physical characteristics of spin devices. On the other hand, the reduced logic complexity and low logic depth of SC circuits alleviates the shortcomings of spintronic logic. Based on this insight, the design of spin-based stochastic arithmetic circuits, bitstream generators, bitstream permuters and stochastic-to-binary converter circuits are presented. Spintastic achieves 7.1X energy reduction over CMOS implementations for a wide range of benchmarks from the image processing, signal processing, and RMS application domains. 5) In order to evaluate the proposed spintronic designs, the thesis describes various device-to-architecture modeling frameworks. Starting with devices models that are calibrated to measurements, the characteristics of spintronic devices are successively abstracted into circuit-level and architectural models, which are incorporated into suitable simulation frameworks. (Abstract shortened by UMI.