Online self-repair of FIR filters

Chip-level failure detection has been a target of research for some time, but today's very deep-submicron technology is forcing such research to move beyond detection. Repair, especially self-repair, has become very important for containing the susceptibility of today's chips. This article introduces a self-repair-solution for the digital FIR filter, one of the key blocks used in DSPs

Design of Adiabatic MTJ-CMOS Hybrid Circuits

Low-power designs are a necessity with the increasing demand of portable devices which are battery operated. In many of such devices the operational speed is not as important as battery life. Logic-in-memory structures using nano-devices and adiabatic designs are two methods to reduce the static and dynamic power consumption respectively. Magnetic tunnel junction (MTJ) is an emerging technology which has many advantages when used in logic-in-memory structures in conjunction with CMOS. In this paper, we introduce a novel adiabatic hybrid MTJ/CMOS structure which is used to design AND/NAND, XOR/XNOR and 1-bit full adder circuits. We simulate the designs using HSPICE with 32nm CMOS technology and compared it with a non-adiabatic hybrid MTJ/CMOS circuits. The proposed adiabatic MTJ/CMOS full adder design has more than 7 times lower power consumtion compared to the previous MTJ/CMOS full adder

Research in the effective implementation of guidance computers with large scale arrays Interim report

Functional logic character implementation in breadboard design of NASA modular compute

Implementation of arithmetic primitives using truly deep submicron technology (TDST)

The invention of the transistor in 1947 at Bell Laboratories revolutionised the electronics industry and created a powerful platform for emergence of new industries. The quest to increase the number of devices per chip over the last four decades has resulted in rapid transition from Small-Scale-Integration (SSI) and Large-Scale-lntegration (LSI), through to the Very-Large-Scale-Integration (VLSI) technologies, incorporating approximately 10 to 100 million devices per chip. The next phase in this evolution is the Ultra-Large-Scale-Integration (ULSI) aiming to realise new application domains currently not accessible to CMOS technology. Although technology is continuously evolving to produce smaller systems with minimised power dissipation, the IC industry is facing major challenges due to constraints on power density (W/cm2) and high dynamic (operating) and static (standby) power dissipation. Mobile multimedia communication and optical based technologies have rapidly become a significant area of research and development challenging a variety of technological fronts. The future emergence or 4G (4th Generation) wireless communications networks is further driving this development, requiring increasing levels of media rich content. The processing requirements for capture, conversion, compression, decompression, enhancement and display of higher quality multimedia, place heavy demands on current ULSI systems. This is also apparent for mobile applications and intelligent optical networks where silicon chip area and power dissipation become primary considerations. In addition to the requirements for very low power, compact size and real-time processing, the rapidly evolving nature of telecommunication networks means that flexible soft programmable systems capable of adaptation to support a number of different standards and/or roles become highly desirable. In order to fully realise the capabilities promised by the 4G and supporting intelligent networks, new enabling technologies arc needed to facilitate the next generation of personal communications devices. Most of the current solutions to meet these challenges are based on various implementations of conventional architectures. For decades, silicon has been the main platform of computing, however it is slow, bulky, runs too hot, and is too expensive. Thus, new approaches to architectures, driving multimedia and future telecommunications systems, are needed in order to extend the life cycle of silicon technology. The emergence of Truly Deep Submicron Technology (TDST) and related 3-D interconnection technologies have provided potential alternatives from conventional architectures to 3-D system solutions, through integration of IDST, Vertical Software Mapping and Intelligent Interconnect Technology (IIT). The concept of Soft-Chip Technology (SCT) entails integration of Soft• Processing Circuits with Soft-Configurable Circuits . This concept can effectively manipulate hardware primitives through vertical integration of control and data. Thus the notion of 3-D Soft-Chip emerges as a new design algorithm for content-rich multimedia, telecommunication and intelligent networking system applications. 3•D architectures (design algorithms used suitable for 3-D soft-chip technology), are driven by three factors. The first is development of new device technology (TDST) that can support new architectures with complexities of 100M to 1000M devices. The second is development of advanced wafer bonding techniques such as Indium bump and the more futuristic optical interconnects for 3-D soft-chip mapping. The third is related to improving the performance of silicon CMOS systems as devices continue to scale down in dimensions. One of the fundamental building blocks of any computer system is the arithmetic component. Optimum performance of the system is determined by the efficiency of each individual component, as well as the network as a whole entity. Development of configurable arithmetic primitives is the fundamental focus in 3-D architecture design where functionality can be implemented through soft configurable hardware elements. Therefore the ability to improve the performance capability of a system is of crucial importance for a successful design. Important factors that predict the efficiency of such arithmetic components are: • The propagation delay of the circuit, caused by the gate, diffusion and wire capacitances within !he circuit, minimised through transistor sizing. and • Power dissipation, which is generally based on node transition activity. [2] Although optimum performance of 3-D soft-chip systems is primarily established by the choice of basic primitives such as adders and multipliers, the interconnecting network also has significant degree of influence on !he efficiency of the system. 3-D superposition of devices can decrease interconnect delays by up to 60% compared to a similar planar architecture. This research is based on development and implementation of configurable arithmetic primitives, suitable to the 3-D architecture, and has these foci: • To develop a variety of arithmetic components such as adders and multipliers with particular emphasis on minimum area and compatible with 3-D soft-chip design paradigm. • To explore implementation of configurable distributed primitives for arithmetic processing. This entails optimisation of basic primitives, and using them as part of array processing. In this research the detailed designs of configurable arithmetic primitives are implemented using TDST O.l3µm (130nm) technology, utilising CAD software such as Mentor Graphics and Cadence in Custom design mode, carrying through design, simulation and verification steps

A 100-MIPS GaAs asynchronous microprocessor

The authors describe how they ported an asynchronous microprocessor previously implemented in CMOS to gallium arsenide, using a technology-independent asynchronous design technique. They introduce new circuits including a sense-amplifier, a completion detection circuit, and a general circuit structure for operators specified by production rules. The authors used and tested these circuits in a variety of designs

A Reconfigurable Digital Multiplier and 4:2 Compressor Cells Design

With the continually growing use of portable computing devices and increasingly complex software applications, there is a constant push for low power high speed circuitry to support this technology. Because of the high usage and large complex circuitry required to carry out arithmetic operations used in applications such as digital signal processing, there has been a great focus on increasing the efficiency of computer arithmetic circuitry. A key player in the realm of computer arithmetic is the digital multiplier and because of its size and power consumption, it has moved to the forefront of today\u27s research. A digital reconfigurable multiplier architecture will be introduced. Regulated by a 2-bit control signal, the multiplier is capable of double and single precision multiplication, as well as fault tolerant and dual throughput single precision execution. The architecture proposed in this thesis is centered on a recursive multiplication algorithm, where a large multiplication is carried out using recursions of simpler submultiplier modules. Within each sub-multiplier module, instead of carry save adder arrays, 4:2 compressor rows are utilized for partial product reduction, which present greater efficiency, thus result in lower delay and power consumption of the whole multiplier. In addition, a study of various digital logic circuit styles are initially presented, and then three different designs of 4:2 compressor in Domino Logic are presented and simulation results confirm the property of proposed design in terms of delay, power consumption and operation frequenc