3 research outputs found

    12.8 kHz Energy-Efficient Read-Out IC for High Precision Bridge Sensor Sensing System

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    ํ•™์œ„๋…ผ๋ฌธ(๋ฐ•์‚ฌ) -- ์„œ์šธ๋Œ€ํ•™๊ต๋Œ€ํ•™์› : ๊ณต๊ณผ๋Œ€ํ•™ ์ „๊ธฐยท์ •๋ณด๊ณตํ•™๋ถ€, 2022.2. ๊น€์ˆ˜ํ™˜.In the thesis, a high energy-efficient read-out integrated circuit (read-out IC) for a high-precision bridge sensor sensing system is proposed. A low-noise capacitively-coupled chopper instrumentation amplifier (CCIA) followed by a high-resolution incremental discrete-time delta-sigma modulator (DTฮ”ฮฃฮœ) analog-to-digital converter (ADC) is implemented. To increase energy-efficiency, CCIA is chosen, which has the highest energy-efficiency among IA types. CCIA has a programmable gain of 1 to 128 that can amplify the small output of the bridge sensor. Impedance boosting loop (IBL) is applied to compensate for the low input impedance, which is a disadvantage of a CCIA. Also, the sensor offset cancellation technique was applied to CCIA to eliminate the offset resulting from the resistance mismatch of the bridge sensor, and the bridge sensor offset from -350 mV to 350 mV can be eliminated. In addition, the output data rate of the read-out IC is designed to be 12.8 kHz to quickly capture data and to reduce the power consumption of the sensor by turning off the sensor and read-out IC for the rest of the time. Generally, bridge sensor system is much slower than 12.8 kHz. To suppress 1/f noise, system level chopping and correlated double sampling (CDS) techniques are used. Implemented in a standard 0.13-ฮผm CMOS process, the ROICโ€™s effective resolution is 17.0 bits at gain 1 and that of 14.6 bits at gain 128. The analog part draws the average current of 139.4 ฮผA from 3-V supply, and 60.2 ฮผA from a 1.8 V supply.๋ณธ ๋…ผ๋ฌธ์—์„œ๋Š” ๊ณ ์ •๋ฐ€ ๋ธŒ๋ฆฌ์ง€ ์„ผ์„œ ์„ผ์‹ฑ ์‹œ์Šคํ…œ์„ ์œ„ํ•œ ์—๋„ˆ์ง€ ํšจ์œจ์ด ๋†’์€ Read-out Integrated Circuit (read-out IC)๋ฅผ ์ œ์•ˆํ•œ๋‹ค. ์ € ์žก์Œ Capacitively-Coupled Instrumentation Amplifier (CCIA)์— ์ด์€ ๊ณ ํ•ด์ƒ๋„ Discrete-time Delta-Sigma ๋ณ€์กฐ๊ธฐ(DTฮ”ฮฃฮœ) ์•„๋‚ ๋กœ๊ทธ-๋””์ง€ํ„ธ ๋ณ€ํ™˜๊ธฐ(ADC)๋ฅผ ๊ตฌํ˜„ํ•˜์˜€๋‹ค. ์—๋„ˆ์ง€ ํšจ์œจ์„ ๋†’์ด๊ธฐ ์œ„ํ•ด IA ์œ ํ˜• ์ค‘ ์—๋„ˆ์ง€ ํšจ์œจ์ด ๊ฐ€์žฅ ๋†’์€ CCIA๋ฅผ ์„ ํƒํ•˜์˜€๋‹ค. CCIA๋Š” ๋ธŒ๋ฆฌ์ง€ ์„ผ์„œ์˜ ์ž‘์€ ์ถœ๋ ฅ์„ ์ฆํญํ•  ์ˆ˜ ์žˆ๋Š” 1 ์—์„œ 128์˜ ํ”„๋กœ๊ทธ๋ž˜๋ฐ ๊ฐ€๋Šฅํ•œ ์ „์•• ์ด๋“์„ ๊ฐ€์ง„๋‹ค. CCIA์˜ ๋‹จ์ ์ธ ๋‚ฎ์€ ์ž…๋ ฅ ์ž„ํ”ผ๋˜์Šค๋ฅผ ๋ณด์ƒํ•˜๊ธฐ ์œ„ํ•ด Impedance Boosting Loop (IBL)์„ ์ ์šฉํ•˜์˜€๋‹ค. ๋˜ํ•œ CCIA์— ์„ผ์„œ ์˜คํ”„์…‹ ์ œ๊ฑฐ ๊ธฐ์ˆ ์„ ์ ์šฉํ•˜์—ฌ ๋ธŒ๋ฆฌ์ง€ ์„ผ์„œ์˜ ์ €ํ•ญ ๋ฏธ์Šค๋งค์น˜๋กœ ์ธํ•œ ์˜คํ”„์…‹์„ ์ œ๊ฑฐ ๊ธฐ๋Šฅ์„ ํƒ‘์žฌํ•˜์˜€์œผ๋ฉฐ -350mV์—์„œ 350mV๊นŒ์ง€ ๋ธŒ๋ฆฌ์ง€ ์„ผ์„œ ์˜คํ”„์…‹์„ ์ œ๊ฑฐํ•  ์ˆ˜ ์žˆ๋‹ค. Read-out IC์˜ ์ถœ๋ ฅ ๋ฐ์ดํ„ฐ ์ „์†ก๋ฅ ์€ 12.8kHz๋กœ ์„ค๊ณ„ํ•˜์—ฌ ๋ฐ์ดํ„ฐ๋ฅผ ๋น ๋ฅด๊ฒŒ ์ฑ„๊ณ  ๋‚˜๋จธ์ง€ ์‹œ๊ฐ„ ๋™์•ˆ ์„ผ์„œ์™€ read-out IC๋ฅผ ๊บผ์„œ ์„ผ์„œ์˜ ์ „๋ ฅ ์†Œ๋น„๋ฅผ ์ค„์ผ ์ˆ˜ ์žˆ๋„๋ก ์„ค๊ณ„ํ•˜์˜€๋‹ค. ์ผ๋ฐ˜์ ์œผ๋กœ ๋ธŒ๋ฆฌ์ง€ ์„ผ์„œ ์‹œ์Šคํ…œ์€ 12.8kHz๋ณด๋‹ค ๋Š๋ฆฌ๊ธฐ ๋•Œ๋ฌธ์— ์ด๊ฒƒ์ด ๊ฐ€๋Šฅํ•˜๋‹ค. ํ•˜์ง€๋งŒ, ์ผ๋ฐ˜์ ์ธ CCIA๋Š” ์ž…๋ ฅ ์ž„ํ”ผ๋˜์Šค ๋•Œ๋ฌธ์— ๋น ๋ฅธ ์†๋„์—์„œ ์„ค๊ณ„๊ฐ€ ๋ถˆ๊ฐ€๋Šฅํ•˜๋‹ค. ์ด๋ฅผ ํ•ด๊ฒฐํ•˜๊ธฐ ์œ„ํ•ด demodulate ์ฐจํ•‘์„ ์•ฐํ”„ ๋‚ด๋ถ€๊ฐ€ ์•„๋‹Œ ์‹œ์Šคํ…œ ์ฐจํ•‘์„ ์ด์šฉํ•ด ํ•ด๊ฒฐํ•˜์˜€๋‹ค. 1/f ๋…ธ์ด์ฆˆ๋ฅผ ์–ต์ œํ•˜๊ธฐ ์œ„ํ•ด ์‹œ์Šคํ…œ ๋ ˆ๋ฒจ ์ฐจํ•‘ ๋ฐ ์ƒ๊ด€ ์ด์ค‘ ์ƒ˜ํ”Œ๋ง(CDS) ๊ธฐ์ˆ ์ด ์‚ฌ์šฉ๋˜์—ˆ๋‹ค. 0.13ฮผm CMOS ๊ณต์ •์—์„œ ๊ตฌํ˜„๋œ read-out IC์˜ Effective Resolution (ER)์€ ์ „์•• ์ด๋“ 1์—์„œ 17.0๋น„ํŠธ์ด๊ณ  ์ „์•• ์ด๋“ 128์—์„œ 14.6๋น„ํŠธ๋ฅผ ๋‹ฌ์„ฑํ•˜์˜€๋‹ค. ์•„๋‚ ๋กœ๊ทธ ํšŒ๋กœ๋Š” 3 V ์ „์›์—์„œ 139.4ฮผA์˜ ํ‰๊ท  ์ „๋ฅ˜๋ฅผ, ๋””์ง€ํ„ธ ํšŒ๋กœ๋Š” 1.8 V ์ „์›์—์„œ 60.2ฮผA์˜ ํ‰๊ท  ์ „๋ฅ˜๋ฅผ ์‚ฌ์šฉํ•œ๋‹ค.CHAPTER 1 INTRODUCTION 1 1.1 SMART DEVICES 1 1.2 SMART SENSOR SYSTEMS 4 1.3 WHEATSTONE BRIDGE SENSOR 5 1.4 MOTIVATION 8 1.5 PREVIOUS WORKS 10 1.6 INTRODUCTION OF THE PROPOSED SYSTEM 14 1.7 THESIS ORGANIZATION 16 CHAPTER 2 SYSTEM OVERVIEW 17 2.1 SYSTEM ARCHITECTURE 17 CHAPTER 3 IMPLEMENTATION OF THE CCIA 19 3.1 CAPACITIVELY-COUPLED CHOPPER INSTRUMENTATION AMPLIFIER 19 3.2 IMPEDANCE BOOSTING 22 3.3 SENSOR OFFSET CANCELLATION 25 3.4 AMPLIFIER OFFSET CANCELLATION 29 3.5 AMPLIFIER IMPLEMENTATION 32 3.6 IMPLEMENTATION OF THE CCIA 35 CHAPTER 4 INCREMENTAL ฮ”ฮฃ ADC 37 4.1 INTRODUCTION OF INCREMENTAL ฮ”ฮฃ ADC 37 4.2 IMPLEMENTATION OF INCREMENTAL ฮ”ฮฃ MODULATOR 40 CHAPTER 5 SYSTEM-LEVEL DESIGN 43 5.1 DIGITAL FILTER 43 5.2 SYSTEM-LEVEL CHOPPING & TIMING 46 CHAPTER 5 MEASUREMENT RESULTS 48 6.1 MEASUREMENT SUMMARY 48 6.2 LINEARITY & NOISE MEASUREMENT 51 6.3 SENSOR OFFSET CANCELLATION MEASUREMENT 57 6.4 INPUT IMPEDANCE MEASUREMENT 59 6.5 TEMPERATURE VARIATION MEASUREMENT 63 6.6 PERFORMANCE SUMMARY 66 CHAPTER 7 CONCLUSION 68 APPENDIX A. 69 ENERGY-EFFICIENT READ-OUT IC FOR HIGH-PRECISION DC MEASUREMENT SYSTEM WITH IA POWER REDUCTION TECHNIQUE 69 BIBLIOGRAPHY 83 ํ•œ๊ธ€์ดˆ๋ก 87๋ฐ•

    Design of agile signal conditioning circuits for microelectromechanical sensors

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    Microelectromechanical systems (MEMS) are used in many applications to detect physical parameters and convert them to an electrical signal. The output of MEMS-based transducers is usually not suitable to be directly processed in the digital or the analog domain, and they could be as small as femto farads in capacitive sensing and micro volts in resistive sensing. Consequently, high sensitivity signal conditioning circuits are essential. In this thesis, it is shown that both the noise and input capacitance are important parameters to ensure optimal capacitive sensing. The dominant noise source in MEMS conditioning circuits is flicker noise, and one of the best methods to mitigate flicker noise is the chopping technique. Three different chopping techniques are considered: single chopper amplifier (SCA), dual chopper amplifier (DCA), and two-stage single chopper amplifier (TCA). Also, their sensitivity and power consumption based on the total gain and sensing capacitance are extracted. It is shown that the distribution of gain between the two stages in the DCA and TCA has a significant effect on the sensitivity, and, based on this distribution, the sensitivity and power consumption change significantly. For small sensor capacitances, the highest sensitivity could be achieved by a DCA because of its ability to decrease the noise floor and the input sensor capacitance simultaneously. A novel DCA is proposed to reach higher sensitivity and reduced power consumption. In this DCA, two supply voltages are utilized, and the second stage is composed of two parallel paths that improve the SNR and provide two gain settings. This circuit is fabricated in the GlobalFoundries 0.13 ฮผm CMOS technology. The measurement results show a power consumption of 2.66 ฮผW for the supply voltage of 0.7 V and of 3.26 ฮผW for the supply voltage of 1.2 V. The single path DCA has a gain of 34 dB with bandwidth of 4 kHz and input noise floor of 25 nV/โˆšHz. The dual path DCA has a gain of 38 dB with bandwidth of 3 kHz and input noise floor of 40 nV/โˆšHz. To be able to detect the signal near DC frequencies, another circuit is proposed which has a configurable bandwidth and a sub-ฮผHz noise corner frequency. This circuit is composed of three stages, and three chopping frequencies are used to mitigate the flicker noise of the three stages. The simulated circuit is designed in the GlobalFoundries 0.13 ฮผm CMOS technology with supply voltages of 0.4 V and 1.2 V. The total power consumption is of 6.7 ฮผW. A gain of 68 dB and bandwidths of 1, 10, 100 and 1000 Hz are achieved. The input referred noise floor is of 20.5 nV/โˆšHz and the design attains a good power efficiency factor of 4.0. In the capacitive mode, the noise floor is of 3.6 zF for a 100 fF capacitance sensor
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