366 research outputs found

    User learning, "sticky information," and user-based designs

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    "May 1995."Includes bibliographical references (p. 34-36).Eric von Hippel

    "Sticky information" and new marketing research methods

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    Includes bibliographical references (p. 34-37).Eric von Hippel

    A KNOWLEDGE BASED SUPPORT TOOL FOR THE EARLY STAGES OF ELECTRONIC ENGINEERING DESIGN

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    A desire to produce a design support system for the early stages of electronic engineering design, has led to the conception of the Plymouth Engineer's Design Assistant (PEDA), pulling together experience from the three fields of computing, psychology and electronic engineering. The basic emphasis of this tool has been to use psychological techniques to analyze the cognitive aspects of designers in action and then make recommendations for design tool improvement. The results of the complementary psychological research, and other relevant literature are examined and potential avenues to realizing an improving design explored. A new idealized abstract representation of early electronic engineering is proposed, which is more in line witli the cognitive needs of designers, thus enabling the production of more capable design tools. The main points of the representation are discussed, and comparisons with other approaches and tools drawn. The abstract representation is then taken and used to form a specific implementation as the core to the PEDA tool. An overview of the PEDA tool is given, followed by a discussion regarding the important aspects of the implementation. Important issues and problems raised during the course of the research are discussed, together with suggestions for future work.THE UNIVERSITY OF READING and PLESSEY SEMI-CONDUCTORS, ROBOROUGH, PLYMOUT

    Cost modelling and concurrent engineering for testable design

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    This thesis was submitted for the degree of Doctor of Philosophy and awarded by Brunel University.As integrated circuits and printed circuit boards increase in complexity, testing becomes a major cost factor of the design and production of the complex devices. Testability has to be considered during the design of complex electronic systems, and automatic test systems have to be used in order to facilitate the test. This fact is now widely accepted in industry. Both design for testability and the usage of automatic test systems aim at reducing the cost of production testing or, sometimes, making it possible at all. Many design for testability methods and test systems are available which can be configured into a production test strategy, in order to achieve high quality of the final product. The designer has to select from the various options for creating a test strategy, by maximising the quality and minimising the total cost for the electronic system. This thesis presents a methodology for test strategy generation which is based on consideration of the economics during the life cycle of the electronic system. This methodology is a concurrent engineering approach which takes into account all effects of a test strategy on the electronic system during its life cycle by evaluating its related cost. This objective methodology is used in an original test strategy planning advisory system, which allows for test strategy planning for VLSI circuits as well as for digital electronic systems. The cost models which are used for evaluating the economics of test strategies are described in detail and the test strategy planning system is presented. A methodology for making decisions which are based on estimated costing data is presented. Results of using the cost models and the test strategy planning system for evaluating the economics of test strategies for selected industrial designs are presented

    Top-down methodology employing hardware description languages (HDLs) for designing digital control in power converters

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    This paper presents a research line oriented to develop methodologies that takes advantage of hardware description languages in order to simplify the design of power converters that employ digital control techniques. The methodology focuses on setting the adequate communications among subsystems in order to simplify the change of the levels of abstraction of the subsystem’s models (from the conceptual level to the actual electric + synthesizable code). Changing the level of abstraction in the design process pretends: first to provide useful models at early designing steps; second, to optimize the simulation of the system, and at same time optimize the verification step

    The RIT IEEE-488 buffer design

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    This document describes the design of an NMOS ASIC used to control an RIT IEEE-488 Buffer previously designed by the author. Past designs used discrete components to implement an asynchronous controller and a synchronous, one-hot controller. The present design utilizes a multiple controller architecture incorporated within the ASIC. The ASIC is used to control bus protocol, bus transceivers, and memory. At power-up, the buffer configures itself as an active listener on the bus and waits for a talker to initiate communication. The buffer accepts a data file (a plot file for example) from the talker, then takes control of the bus, addresses a listener, transfers the stored data to the listener, unaddresses the listener, releases the bus, and finally, reassumes the active listener configuration. The RIT IEEE-488 buffer can realize time savings for a user in a controllerless system. The buffer accepts data from a talker in a matter of seconds and then takes on the chore of driving a slow listener. Thus, the talker is returned quickly to the operator for further use. At present, the buffer isn\u27t queueable - it cannot accept another data file until it completes the transfer of the present file. The author has also added five nmos cells (schematic/layout) into the \u27/user/pub\u27 directory on the Apollo workstations in the Computer Engineering Department\u27s VLSI LAB at RIT. Cell names are VSCLK, SYNC, CLOCK_GEN_STACK, PAD_TRISTATE, and PAD_TRISTATE_BUFFERED. All five cells have been simulated and successfully run through DRC, ERC, and LVS checks

    Platform-based design, test and fast verification flow for mixed-signal systems on chip

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    This research is providing methodologies to enhance the design phase from architectural space exploration and system study to verification of the whole mixed-signal system. At the beginning of the work, some innovative digital IPs have been designed to develop efficient signal conditioning for sensor systems on-chip that has been included in commercial products. After this phase, the main focus has been addressed to the creation of a re-usable and versatile test of the device after the tape-out which is close to become one of the major cost factor for ICs companies, strongly linking it to model’s test-benches to avoid re-design phases and multi-environment scenarios, producing a very effective approach to a single, fast and reliable multi-level verification environment. All these works generated different publications in scientific literature. The compound scenario concerning the development of sensor systems is presented in Chapter 1, together with an overview of the related market with a particular focus on the latest MEMS and MOEMS technology devices, and their applications in various segments. Chapter 2 introduces the state of the art for sensor interfaces: the generic sensor interface concept (based on sharing the same electronics among similar applications achieving cost saving at the expense of area and performance loss) versus the Platform Based Design methodology, which overcomes the drawbacks of the classic solution by keeping the generality at the highest design layers and customizing the platform for a target sensor achieving optimized performances. An evolution of Platform Based Design achieved by implementation into silicon of the ISIF (Intelligent Sensor InterFace) platform is therefore presented. ISIF is a highly configurable mixed-signal chip which allows designers to perform an effective design space exploration and to evaluate directly on silicon the system performances avoiding the critical and time consuming analysis required by standard platform based approach. In chapter 3 we describe the design of a smart sensor interface for conditioning next generation MOEMS. The adoption of a new, high performance and high integrated technology allow us to integrate not only a versatile platform but also a powerful ARM processor and various IPs providing the possibility to use the platform not only as a conditioning platform but also as a processing unit for the application. In this chapter a description of the various blocks is given, with a particular emphasis on the IP developed in order to grant the highest grade of flexibility with the minimum area occupation. The architectural space evaluation and the application prototyping with ISIF has enabled an effective, rapid and low risk development of a new high performance platform achieving a flexible sensor system for MEMS and MOEMS monitoring and conditioning. The platform has been design to cover very challenging test-benches, like a laser-based projector device. In this way the platform will not only be able to effectively handle the sensor but also all the system that can be built around it, reducing the needed for further electronics and resulting in an efficient test bench for the algorithm developed to drive the system. The high costs in ASIC development are mainly related to re-design phases because of missing complete top-level tests. Analog and digital parts design flows are separately verified. Starting from these considerations, in the last chapter a complete test environment for complex mixed-signal chips is presented. A semi-automatic VHDL-AMS flow to provide totally matching top-level is described and then, an evolution for fast self-checking test development for both model and real chip verification is proposed. By the introduction of a Python interface, the designer can easily perform interactive tests to cover all the features verification (e.g. calibration and trimming) into the design phase and check them all with the same environment on the real chip after the tape-out. This strategy has been tested on a consumer 3D-gyro for consumer application, in collaboration with SensorDynamics AG
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