Designing a dexterous reconfigurable packaging system for flexible automation

This paper presents a design for a reconfigurable packaging system that can handle cartons of different shape and sizes and is amenable to ever changing demands of packaging industries for perfumery and cosmetic products. The system takes structure of a multi-fingered robot hand, which can provide fine motions, and dexterous manipulation capability that may be required in a typical packaging-assembly line. The paper outlines advanced modeling and simulation undertaken to design the packaging system and discusses the experimental work carried out. The new packaging system is based on the principle of reconfigurability, that shows adaptability to simple as well as complex carton geometry. The rationale of developing such a system is presented with description of its human equivalent. The hardware and software implementations are also discussed together with directions for future research

Ultra-Thin Chip Package (UTCP) and stretchable circuit technologies for wearable ECG system

A comfortable, wearable wireless ECG monitoring system is proposed. The device is realized using the combination of two proprietary advanced technologies for electronic packaging and interconnection : the UTCP (Ultra-Thin Chip Package) technology and the SMI (Stretchable Mould Interconnect) technology for elastic and stretchable circuits. Introduction of these technologies results in small fully functional devices, exhibiting a significant increase in user comfort compared to devices fabricated with more conventional packaging and interconnection technologies

BCB Based Packaging for Low Actuation Voltage RF MEMS Devices

This paper outlines the issues related to RF MEMS packaging and low actuation voltage. An original approach is presented concerning the modeling of capacitive contacts using multiphysics simulation and advanced characterization. A similar approach is used concerning packaging development where multi-physics simulations are used to optimize the process. A devoted package architecture is proposed featuring very low loss at microwave range

Applications of heat pipes to cool PWBS and hybrid microcircuits

Some of the advanced thermal management techniques used to reduce operating junction temperature under extreme environmental temperature conditions are discussed. Heat pipes in actual electronic packaging applications, and those under development, are discussed. Performance characteristics of heat pipes are given, and examples are described of how thermal problems in electronic packaging are solved through the use of heat pipes

A Review on Active Packaging: An Innovation in Food Packaging

Innovative packaging such as active packaging is the result of consumers demand for packaging that is more advanced and creative than what is currently offered. Active packaging aiming at extending shelf life or improving safety while maintaining quality is progressing towards the incorporation of natural active agents into more sustainable packaging materials. Depending on the requirements of packed food, the application of appropriate active packaging systems can significantly reduce food quality deterioration. Different active packaging systems are Oxygen scavengers, Carbon dioxide emitters and scavenger, Ethylene scavengers, Ethanol emitters, Moisture absorbers, Antimicrobial agents, Flavour/odour absorbers, Temperature-controlled packaging

Discrete input equipment design study

The study to improve the reliability of the LUT system by discrete input equipment (DIE) is reported. Subjects discussed include: specifications, packaging, aircraft integrated systems, and word formats DIE. It is recommended that maximal use of advanced technology be made, particularly the "know how' developed on the Saturn project

Ku & C Band solid state switch matrix for satellite payloads using LTCC multilayer substrate

This paper describes the design and development of Ku and C band solid state switch matrix for multimedia satellite payloads. The design, through the use of advanced packaging techniques, allows significant savings on mass and volume with respect to traditional electromechanical switches while guaranteeing a comparable reliability

Thermoelectric Outer Planets Spacecraft (TOPS) electronic packaging and cabling development summary report

Electronic packaging and cabling activities performed in support of the Thermoelectric Outer Planets Spacecraft (TOPS) Advanced Systems Technology (AST) project are detailed. It describes new electronic compartment, electronic assembly, and module concepts, and a new high-density, planar interconnection technique called discrete multilayer (DML). Development and qualification of high density cabling techniques, using small gage wire and microminiature connectors, are also reported

Thin film diffusion barrier formation in PDMS microcavities

We describe a method to form glass like thin film barrier in polydimethylsiloxane (PDMS) microcavities. The reactive fragments for the surface reaction were created from O2 and hexamethyldisiloxane (HMDS) in RF plasma environment. The reaction is based on migration of the reactive fragments into the microcavities by diffusion, to form a glass like thin film barrier to conceal the naked surface of PDMS. The barrier successfully blocked penetration of a fluorescent dye rhodamine B (RhB) into PDMS. The thickness of the barrier could be controlled by the time of reaction and the pressure inside the reaction chamber. There is a wide range of applications of such a technique in various fields, e.g. for coating the covered surfaces of microfluidic channels, tubes, capillaries, medical devices, catheters, as well as chip-integrated capillary electrophoresis and advanced electronic and opto-fluidic packaging