Investigation of organic adhesives for hybrid microcircuits

The properties of organic adhesives were investigated to acquire information for a guideline document regarding the selection of adhesives for use in high reliability hybrid microcircuits. Specifically, investigations were made of (1) alternate methods for determining the outgassing of cured adhesives, (2) effects of long term aging at 150 C on the electrical properties of conductive adhesives, (3) effects of shelf life age on adhesive characteristics, (4) bond strengths of electrically conductive adhesives on thick film gold metallization, (5) a copper filled adhesive, (6) effects of products outgassed from cured adhesives on device electrical parameters, (7) metal migration from electrically conductive adhesives, and (8) ionic content of electrically insulative adhesives. The tests performed during these investigations are described, and the results obtained are discussed

Design guidelines for hybrid microcircuits; organic adhesives for hybrid microcircuits

The properties of organic adhesives were studied to acquire an adequate information base to generate a guideline document for the selection of adhesives for use in high reliability hybrid microcircuits. Specific areas covered include: (1) alternate methods for determining the outgassing of cured adhesives; (2) effects of long term aging at 150C on the electrical properties of conductive adhesives; (3) effects of shelf life age on adhesive characteristics; (4) bond strengths of electrically conductive adhesives on thick film gold metallization, (5) a copper filled adhesive; (6) effects of products outgassed from cured adhesives on device electrical parameters; (7) metal migration from electrically conductive adhesives; and (8) ionic content of electrically insulative adhesives. The tests performed during these investigations are described, and the results obtained are discussed in detail

Classification review of dental adhesive systems: from the IV generation to the universal type

Adhesive dentistry has undergone great progress in the last decades. In light of minimal-invasive dentistry, this new approach promotes a more conservative cavity design, which relies on the effectiveness of current enamel-dentine adhesives. Adhesive dentistry began in 1955 by Buonocore on the benefits of acid etching. With changing technologies, dental adhesives have evolved from no-etch to total-etch (4th and 5th generation) to self-etch (6th, 7th and 8th generation) systems. Currently, bonding to dental substrates is based on three different strategies: 1) etch-and-rinse, 2) self-etch and 3) resin-modified glass-ionomer approach as possessing the unique properties of self-adherence to the tooth tissue. More recently, a new family of dentin adhesives has been introduced (universal or multi-mode adhesives), which may be used either as etch-and-rinse or as self-etch adhesives. The purpose of this article is to review the literature on the current knowledge for each adhesive system according to their classification that have been advocated by many authorities in most operative/restorative procedures. As noted by several valuable studies that have contributed to understanding of bonding to various substrates helps clinicians to choose the appropriate dentin bonding agents for optimal clinical outcomes

Exploratory study on the effects of novel diamine curing agents and isocyanate precursors on the properties of new epoxy and urethane adhesives

The effects of novel aromatic diamine structures on the adhesive properties of epoxy and polyurethane adhesives were studied. Aromatic diamines based on benzophenone and diphenyl-methane isomers were evaluated as curing agents for epoxy resins and benzophenone and diphenyl-methane based diamine isomers were evaluated as curing agents for polyurethane adhesives. Polyurethane adhesives were prepared based on m, m prime-diisocyanato-diphenyl-methane and m, m prime-diisocyanato-benzophenone. The m, m prime-diisocayanato-diphenyl-methane based adhesive had properties comparable to state-of-the-art adhesives. The m, m prime-diisocyanato-benzophenone based adhesive was extremely reactive

Development of low cost, high reliability sealing techniques for hybrid microcircuit packages. Phase 2, supplement 1: Moisture permeation of adhesive-sealed hybrid microcircuit packages

The susceptibility of adhesive-sealed ceramic packages to moisture permeation was investigated. The two adhesives, Ablebond 789-1 and Epo-Tek H77, were evaluated as package sealants. These adhesives were previously selected as the most promising candidates for this application from a group of ten adhesives. Ceramic packages sealed with these adhesives were exposed to temperature-humidity conditions of 25 C/98 percent RH, 50 C/60 percent RH, 50 C/98 percent RH, and 85 C/85 percent RH and their moisture contents using were monitored solid state moisture sensors sealed inside them. Five packages were tested at each of these exposures - two ceramic packages sealed with each of the two adhesives and one seam-sealed gold-plated Kovar package. This latter package was included to serve as a control. The results showed that the adhesive-sealed packages were not hermetic to moisture. The rates at which moisture entered the packages increased with the severity of the exposure environments (i.e., higher temperatures and higher moisture vapor pressures) with greater dependence on temperature than on moisture vapor pressure

Development of a qualification standard for adhesives used in hybrid microcircuits

Improved qualification standards and test procedures for adhesives used in microelectronic packaging are developed. The test methods in specification for the Selection and Use of Organic Adhesives in Hybrid Microcircuits are reevaluated versus industry and government requirements. Four electrically insulative and four electrically conductive adhesives used in the assembly of hybrid microcircuits are selected to evaluate the proposed revised test methods. An estimate of the cost to perform qualification testing of an adhesive to the requirements of the revised specification is also prepared

Development of low cost, high reliability sealing techniques for hybrid microcircuit packages, phase 2

Adhesives were evaluated to determine if they qualify for application to hybrid microcircuit packages. The effort consisted of the following: (1) seal gold-plated Kovar packages with selective adhesives and determine seal integrity after exposure to temperature humidity environments; (2) seal both gold-plated Kovar and ceramic packages with the four best adhesives identified in (1) and determine seal integrity after exposure to MIL-STD-883A test environments; and (3) subject the best adhesive identified in (2) to a 60 C/98% RH environment and determine susceptibility to moisture permeation. Test results are provided

Polyimide adhesives

A process of preparing aromatic polyamide-acids for use as adhesives is described. An equimolar quantity of an aromatic dianhydride is added to a stirred solution of an aromatic diamine in a water or alcohol-miscible ether solvent to obtain a viscous polymer solution. The polymeric-acid intermediate polymer does not become insoluble but directly forms a smooth viscous polymer solution. These polyamic-acid polymers are converted, by heating in the range of 200-300 C and with pressure, to form polyimides with excellent adhesive properties

Evaluation of a metering, mixing, and dispensing system for mixing polysulfide adhesive

Tests were performed to evaluate whether a metered mixing system can mix PR-1221 polysulfide adhesive as well as or better than batch-mixed adhesive; also, to evaluate the quality of meter-mixed PR-1860 and PS-875 polysulfide adhesives. These adhesives are candidate replacements for PR-1221 which will not be manufactured in the future. The following material properties were evaluated: peel strength, specific gravity and adhesive components of mixed adhesives, Shore A hardness, tensile adhesion strength, and flow rate. Finally, a visual test called the butterfly test was performed to observe for bubbles and unmixed adhesive. The results of these tests are reported and discussed