Aging-Aware Request Scheduling for Non-Volatile Main Memory

Modern computing systems are embracing non-volatile memory (NVM) to implement high-capacity and low-cost main memory. Elevated operating voltages of NVM accelerate the aging of CMOS transistors in the peripheral circuitry of each memory bank. Aggressive device scaling increases power density and temperature, which further accelerates aging, challenging the reliable operation of NVM-based main memory. We propose HEBE, an architectural technique to mitigate the circuit aging-related problems of NVM-based main memory. HEBE is built on three contributions. First, we propose a new analytical model that can dynamically track the aging in the peripheral circuitry of each memory bank based on the bank's utilization. Second, we develop an intelligent memory request scheduler that exploits this aging model at run time to de-stress the peripheral circuitry of a memory bank only when its aging exceeds a critical threshold. Third, we introduce an isolation transistor to decouple parts of a peripheral circuit operating at different voltages, allowing the decoupled logic blocks to undergo long-latency de-stress operations independently and off the critical path of memory read and write accesses, improving performance. We evaluate HEBE with workloads from the SPEC CPU2017 Benchmark suite. Our results show that HEBE significantly improves both performance and lifetime of NVM-based main memory.Comment: To appear in ASP-DAC 202

A Survey of Software-Defined Networks-on-Chip: Motivations, Challenges and Opportunities

Current computing platforms encourage the integration of thousands of processing cores, and their interconnections, into a single chip. Mobile smartphones, IoT, embedded devices, desktops, and data centers use Many-Core Systems-on-Chip (SoCs) to exploit their compute power and parallelism to meet the dynamic workload requirements. Networks-on-Chip (NoCs) lead to scalable connectivity for diverse applications with distinct traffic patterns and data dependencies. However, when the system executes various applications in traditional NoCs—optimized and fixed at synthesis time—the interconnection nonconformity with the different applications’ requirements generates limitations in the performance. In the literature, NoC designs embraced the Software-Defined Networking (SDN) strategy to evolve into an adaptable interconnection solution for future chips. However, the works surveyed implement a partial Software-Defined Network-on-Chip (SDNoC) approach, leaving aside the SDN layered architecture that brings interoperability in conventional networking. This paper explores the SDNoC literature and classifies it regarding the desired SDN features that each work presents. Then, we described the challenges and opportunities detected from the literature survey. Moreover, we explain the motivation for an SDNoC approach, and we expose both SDN and SDNoC concepts and architectures. We observe that works in the literature employed an uncomplete layered SDNoC approach. This fact creates various fertile areas in the SDNoC architecture where researchers may contribute to Many-Core SoCs designs.Las plataformas informáticas actuales fomentan la integración de miles de núcleos de procesamiento y sus interconexiones, en un solo chip. Los smartphones móviles, el IoT, los dispositivos embebidos, los ordenadores de sobremesa y los centros de datos utilizan sistemas en chip (SoC) de muchos núcleos para explotar su potencia de cálculo y paralelismo para satisfacer los requisitos de las cargas de trabajo dinámicas. Las redes en chip (NoC) conducen a una conectividad escalable para diversas aplicaciones con distintos patrones de tráfico y dependencias de datos. Sin embargo, cuando el sistema ejecuta varias aplicaciones en las NoC tradicionales -optimizadas y fijadas en el momento de síntesis, la disconformidad de la interconexión con los requisitos de las distintas aplicaciones genera limitaciones en el rendimiento. En la literatura, los diseños de NoC adoptaron la estrategia de redes definidas por software (SDN) para evolucionar hacia una solución de interconexión adaptable para los futuros chips. Sin embargo, los trabajos estudiados implementan un enfoque parcial de red definida por software en el chip (SDNoC) de SDN, dejando de lado la arquitectura en capas de SDN que aporta interoperabilidad en la red convencional. Este artículo explora la literatura sobre SDNoC y la clasifica en función de las características SDN que presenta cada trabajo. A continuación, describimos los retos y oportunidades detectados a partir del estudio de la literatura. Además, explicamos la motivación para un enfoque SDNoC, y exponemos los conceptos y arquitecturas de SDN y SDNoC. Observamos que los trabajos en la literatura emplean un enfoque SDNoC por capas no completo. Este hecho crea varias áreas fértiles en la arquitectura SDNoC en las que los investigadores pueden contribuir a los diseños de SoCs de muchos núcleos

Thermal-aware adaptive energy minimization of open MP parallel applications

Energy minimization of parallel applications considering thermal distributions among the processor cores is an emerging challenge for current and future generations of many-core computing systems. This paper proposes an adaptive energy minimization approach that hierarchically applies dynamic voltage\slash frequency scaling (DVFS), thread-to-core affinity and dynamic concurrency controls (DCT) to address this challenge. The aim is to minimize the energy consumption and achieve balanced thermal distributions among cores, thereby improving the lifetime reliability of the system, while meeting a specified power budget requirement. Fundamental to this approach is an iterative learning-based control algorithm that adapts the VFS and core allocations dynamically based on the CPU workloads and thermal distributions of the processor cores, guided by the CPU performance counters at regular intervals. The adaptation is facilitated through modified OpenMP library-based power budget annotations. The proposed approach is extensively validated on an Intel Xeon E5-2630 platform with up to 12 CPUs running NAS parallel benchmark applications

Machine Learning for Run-Time Energy Optimisation in Many-Core Systems

In recent years, the focus of computing has moved away from performance-centric serial computation to energy-efficient parallel computation. This necessitates run-time optimisation techniques to address the dynamic resource requirements of different applications on many-core architectures. In this paper, we report on intelligent run-time algorithms which have been experimentally validated for managing energy and application performance in many-core embedded system. The algorithms are underpinned by a cross-layer system approach where the hardware, system software and application layers work together to optimise the energy-performance trade-off. Algorithm development is motivated by the biological process of how a human brain (acting as an agent) interacts with the external environment (system) changing their respective states over time. This leads to a pay-off for the action taken, and the agent eventually learns to take the optimal/best decisions in future. In particular, our online approach uses a model-free reinforcement learning algorithm that suitably selects the appropriate voltage-frequency scaling based on workload prediction to meet the applications’ performance requirements and achieve energy savings of up to 16% in comparison to state-of-the-art-techniques, when tested on four ARM A15 cores of an ODROID-XU3 platform

Emerging Security Threats in Modern Digital Computing Systems: A Power Management Perspective

Design of computing systems — from pocket-sized smart phones to massive cloud based data-centers — have one common daunting challenge : minimizing the power consumption. In this effort, power management sector is undergoing a rapid and profound transformation to promote clean and energy proportional computing. At the hardware end of system design, there is proliferation of specialized, feature rich and complex power management hardware components. Similarly, in the software design layer complex power management suites are growing rapidly. Concurrent to this development, there has been an upsurge in the integration of third-party components to counter the pressures of shorter time-to-market. These trends collectively raise serious concerns about trust and security of power management solutions. In recent times, problems such as overheating, performance degradation and poor battery life, have dogged the mobile devices market, including the infamous recall of Samsung Note 7. Power outage in the data-center of a major airline left innumerable passengers stranded, with thousands of canceled flights costing over 100 million dollars. This research examines whether such events of unintentional reliability failure, can be replicated using targeted attacks by exploiting the security loopholes in the complex power management infrastructure of a computing system. At its core, this research answers an imminent research question: How can system designers ensure secure and reliable operation of third-party power management units? Specifically, this work investigates possible attack vectors, and novel non-invasive detection and defense mechanisms to safeguard system against malicious power attacks. By a joint exploration of the threat model and techniques to seamlessly detect and protect against power attacks, this project can have a lasting impact, by enabling the design of secure and cost-effective next generation hardware platforms

Thermal profiling in CMOS/memristor hybrid architectures

CMOS/memristor hybrid architectures combine conventional CMOS processing elements with thin-film memristor-based crossbar circuits for high-density reconfigurable systems. These architectures have received an explosive growth in research over the past few years due to the first practical demonstration of a thin-film memristor in 2008. The reliability and lifetimes of both the CMOS and memristor partitions of these architectures are severely affected by temperature variations across the chip. Therefore, it is expected that dynamic thermal management (DTM) mechanisms will be needed to improve their reliability and lifetime. This thesis explores one aspect of DTM--thermal profiling--in a CMOS/memristor memory architecture. A temperature sensing resistive random access memory (TSRRAM) was designed. Temperature information is extracted from the TSRRAM by measuring the write time of thin-film memristors. Active and passive sensing mechanisms are also introduced as means for DTM algorithms to determine the thermal profile of the chip. Crosstherm, a simulation framework, was developed to analyze the effects of temperature variations in CMOS/memristor architectures. The TSRRAM design was simulated using the Crosstherm framework for four CMOS processor benchmarks. Passive sensing produced a mean absolute sensor error across all benchmarks of 2.14 K. The size of the DTM unit\u27s memory was also shown to have a significant impact on the accuracy of extracted thermal data during passive sensing. Active sensing was also demonstrated to show the effect of dynamic adjustment of sensor resolution on the accuracy of hotspot temperature estimations