Parallel vs. Serial Inter-plane communication using TSVs

3-D integration is a promising prospect for implementing high performance multifunctional systems-on- chip. Through Silicon Vias (TSVs) are the enablers for achieving high bandwidth paths in inter-plane communications. TSVs also provide higher vertical link density and facilitate the heat flow in the 3-D circuits as compared to other potential schemes such as inductive links. However, reliability issues and crosstalk problems among adjacent TSVs decrease the yield and performance of TSV based circuits. Reducing the number of TSVs employed for inter-plane signal transferring can alleviate these problems. This paper proposes to exploit serialization to reduce the number of TSVs in a 3D circuit and presents a comparison between different aspects of TSV-based 3-D circuits such as area, power, crosstalk and yield in parallel and serial vertical links

Digital Serializer Design for a SerDes Chip in 130nm CMOS Technology

The development of this project is derived from the effort of previous generations from the System on Chip Design Specialty Program at ITESO, who have pioneered the creation of a serializer-deserializer device for high-speed communications in CMOS technology, aiming towards a small and efficient device. The design flow and enhancements implemented within the digital serializer module of the SerDes system, consists of an 8b10b encoder followed by a parallel to serial converter that together reaches a maximum frequency of 239 MHz in a typical cmrf8sf (130 nm) technology manufacturing process, implemented with Cadence tools. The rtl and testbench were taken from the work of Efrain Arrambide, adding a register to store the current disparity value, and thus, enhance the code by adding primitive blocks to improve the behavior of the serializer module and the validation process, generating a summary for every run. The system on chip flow is followed by choosing the variables that best fit the design and a layout with no design violations is generated during the physical synthesis. The individual module layouts were completed successfully in terms of behavior and violations, while the integration of the mixed signal device showed errors that were not resolved in time for manufacturing.El desarrollo de este proyecto parte del trabajo realizado por las generaciones anteriores de la especialidad de diseño de circuitos integrados del ITESO, quienes fueron pioneros en la creación de un dispositivo para comunicaciones de alta velocidad en tecnología CMOS, con el objetivo de obtener un producto final pequeño y eficiente. El flujo de diseño y mejoras implementadas al módulo serializador digital del sistema SerDes, el cual consiste en un codificador 8b10b seguido de un convertidor de datos de paralelo a serial, alcanza una frecuencia máxima de 239 MHz al ser fabricado y operado en condiciones típicas con la tecnología cmrf8sf (130 nm), además de ser implementado con las herramientas proveídas por Cadence. El código de descripción de hardware y banco de pruebas fueron tomados originalmente de los entregados por Efrain Arrambide, a lo que se le agregó un registro para almacenar el valor de la disparidad del dato enviado, así como la adición de bloques básicos para mejorar el comportamiento y se simplificó el código Verilog. El proceso de validación fue mejorado de tal manera que se prueban bloques por separado y cada iteración genera un registro de transacciones y un resumen al final con los resultados de manera automática para cada iteración. El flujo del diseño de sistemas en chip fue seguido por completo, eligiendo las variables que mejor se adaptan a la respuesta y especificaciones del sistema, así como buscar que genere ninguna violación en el diseño físico. Los distintos bloques del sistema serializador-deserializador fueron diseñados y verificados con éxito, sin embargo, la integración del sistema de señal mixta no fue completada debido a errores que no se lograron resolver a tiempo para cumplir con la fecha de fabricación.ITESO, A. C.Consejo Nacional de Ciencia y Tecnologí

Signaling in 3-D integrated circuits, benefits and challenges

Three-dimensional (3-D) or vertical integration is a design and packaging paradigm that can mitigate many of the increasing challenges related to the design of modern integrated systems. 3-D circuits have recently been at the spotlight, since these circuits provide a potent approach to enhance the performance and integrate diverse functions within amulti-plane stack. Clock networks consume a great portion of the power dissipated in a circuit. Therefore, designing a low-power clock network in synchronous circuits is an important task. This requirement is stricter for 3-D circuits due to the increased power densities. Synchronization issues can be more challenging for 3-D circuits since a clock path can spread across several planes with different physical and electrical characteristics. Consequently, designing low power clock networks for 3-D circuits is an important issue. Resonant clock networks are considered efficient low-power alternatives to conventional clock distribution schemes. These networks utilize additional inductive circuits to reduce power while delivering a full swing clock signal to the sink nodes. In this research, a design method to apply resonant clocking to synthesized clock trees is proposed. Manufacturing processes for 3-D circuits include some additional steps as compared to standard CMOS processes which makes 3-D circuits more susceptible to manufacturing defects and lowers the overall yield of the bonded 3-D stack. Testing is another complicated task for 3-D ICs, where pre-bond test is a prerequisite. Pre-bond testability, in turn, presents new challenges to 3-D clock network design primarily due to the incomplete clock distribution networks prior to the bonding of the planes. A design methodology of resonant 3-D clock networks that support wireless pre-bond testing is introduced. To efficiently address this issue, inductive links are exploited to wirelessly transmit the clock signal to the disjoint resonant clock networks. The inductors comprising the LC tanks are used as the receiver circuit for the links, essentially eliminating the need for additional circuits and/or interconnect resources during pre-bond test. Recent FPGAs are quite complex circuits which provide reconfigurablity at the cost of lower performance and higher power consumption as compared to ASIC circuits. Exploiting a large number of programmable switches, routing structures are mainly responsible for performance degradation in FPAGs. Employing 3-D technology can providemore efficient switches which drastically improve the performance and reduce the power consumption of the FPGA. RRAM switches are one of the most promising candidates to improve the FPGA routing architecture thanks to their low on-resistance and non-volatility. Along with the configurable switches, buffers are the other important element of the FPGAs routing structure. Different characteristics of RRAM switches change the properties of signal paths in RRAM-based FPGAs. The on resistance of RRAMswitches is considerably lower than CMOS pass gate switches which results in lower RC delay for RRAM-based routing paths. This different nature in critical path and signal delay in turn affect the need for intermediate buffers. Thus the buffer allocation should be reconsidered. In the last part of this research, the effect of intermediate buffers on signal propagation delay is studied and a modified buffer allocation scheme for RRAM-based FPGA routing path is proposed