904 research outputs found

    Current Programmed Active Pixel Sensors for Large Area Diagnostic X-ray Imaging

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    Rapid progress over the last decade on large area thin film transistor (TFT) arrays led to the emergence of high-performance, low-power, low-cost active matrix flat panel imagers. Despite the shortcomings associated with the instability and low mobility of TFTs, the amorphous silicon TFT technology still remains the primary solution for the backplane of flat panel imagers. The use of a-Si:H TFTs as the building block of the large area integrated circuit becomes challenging particularly when the role of the TFT is extended from traditional switching applications to on-pixel signal amplifier for large area digital imaging. This is the idea behind active pixel sensor (APS) architectures in which under each pixel an amplifier circuit consisting of one or two switching TFTs integrated with one amplifying TFT is fabricated. To take advantage of the full potential of these amplifiers, it is crucial to develop APS architectures to compensate for the limitations of the TFTs. In this thesis several APS architectures are designed, simulated, fabricated, and tested addressing these challenges using the mask sets presented in Appendix A. The proposed APS architectures can compensate for inherent stabilities of the comprising TFTs. Therefore, the sensitivity of their output data to the transistor variations is significantly suppressed. This is achieved by using a well defined external current source instead of the traditional voltage source to reset the APS architectures during the reset cycle of their periodic operation. The performance of these circuits is analyzed in terms of their stability, settling time, noise, and temperature-dependence. For appropriate readout of the current mode APS architectures, high gain transresistance amplifiers with correlated double sampling capability is designed, simulated and fabricated in CMOS technology. Measurement and measurement based calculation results reveal that the proposed APS architectures can meet even the stringent requirements of low noise, real-time digital fluoroscopy

    CMOS active pixel sensor type imaging system on a chip

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    A single chip camera which includes an .[.intergrated.]. .Iadd.integrated .Iaddend.image acquisition portion and control portion and which has double sampling/noise reduction capabilities thereon. Part of the .[.intergrated.]. .Iadd.integrated .Iaddend.structure reduces the noise that is picked up during imaging

    Single chip camera device having double sampling operation

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    A single chip camera device is formed on a single substrate including an image acquisition portion for control portion and the timing circuit formed on the substrate. The timing circuit also controls the photoreceptors in a double sampling mode in which are reset level is first read and then after an integration time a charged level is read

    Single substrate camera device with CMOS image sensor

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    Single substrate device is formed to have an image acquisition device and a controller. The controller on the substrate controls the system operation

    Active Matrix Flat Panel Bio-Medical X-ray Imagers

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    This work investigates the design, system integration, optimization, and evaluation of amorphous silicon (a-Si:H) active matrix flat panel imagers (AMFPI) for bio-medical applications. Here, two hybrid active pixel sensor (H-APS) designs are introduced that improve the dynamic range while maintaining the desirable attributes of high speed and low noise readout. Also presented is a systematic approach for noise analysis of thin film transistors (TFT) and pixel circuits in which circuit analysis techniques and TFT noise models are combined to evaluate circuit noise performance. We also explore different options of system integration and present measurement results of a high fill-factor (HFF) array with segmented photodiode

    CMOS IMAGE SENSORS FOR LAB-ON-A-CHIP MICROSYSTEM DESIGN

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    The work described herein serves as a foundation for the development of CMOS imaging in lab-on-a-chip microsystems. Lab-on-a-chip (LOC) systems attempt to emulate the functionality of a cell biology lab by incorporating multiple sensing modalidites into a single microscale system. LOC are applicable to drug development, implantable sensors, cell-based bio-chemical detectors and radiation detectors. The common theme across these systems is achieving performance under severe resource constraints including noise, bandwidth, power and size. The contributions of this work are in the areas of two core lab-on-a-chip imaging functions: object detection and optical measurements

    Low Frequency Electric Field Imaging

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    abstract: Electric field imaging allows for a low cost, compact, non-invasive, non-ionizing alternative to other methods of imaging. It has many promising industrial applications including security, safely imaging power lines at construction sites, finding sources of electromagnetic interference, geo-prospecting, and medical imaging. The work presented in this dissertation concerns low frequency electric field imaging: the physics, hardware, and various methods of achieving it. Electric fields have historically been notoriously difficult to work with due to how intrinsically noisy the data is in electric field sensors. As a first contribution, an in-depth study demonstrates just how prevalent electric field noise is. In field tests, various cables were placed underneath power lines. Despite being shielded, the 60 Hz power line signal readily penetrated several types of cables. The challenges of high noise levels were largely addressed by connecting the output of an electric field sensor to a lock-in amplifier. Using the more accurate means of collecting electric field data, D-dot sensors were arrayed in a compact grid to resolve electric field images as a second contribution. This imager has successfully captured electric field images of live concealed wires and electromagnetic interference. An active method was developed as a third contribution. In this method, distortions created by objects when placed in a known electric field are read. This expands the domain of what can be imaged because the object does not need to be a time-varying electric field source. Images of dielectrics (e.g. bodies of water) and DC wires were captured using this new method. The final contribution uses a collection of one-dimensional electric field images, i.e. projections, to reconstruct a two-dimensional image. This was achieved using algorithms based in computed tomography such as filtered backprojection. An algebraic approach was also used to enforce sparsity regularization with the L1 norm, further improving the quality of some images.Dissertation/ThesisDoctoral Dissertation Electrical Engineering 201

    DESIGN OF A BURST MODE ULTRA HIGH-SPEED LOW-NOISE CMOS IMAGE SENSOR

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    Ultra-high-speed (UHS) image sensors are of interest for studying fast scientific phenomena and may also be useful in medicine. Several published studies have recently achieved frame rates of up to millions of frames per second (Mfps) using advanced processes and/or customized processes. This thesis presents a burst-mode (108 frames) UHS low-noise CMOS image sensor (CIS) based on charge-sweep transfer gates in an unmodified, standard 180 nm front-side-illuminated CIS process. By optimizing the photodiode geometry, the 52.8 μm pitch pixels with 20x20 μm^2 of active area, achieve a charge-transfer time of less than 10 ns. A proof-of-concept CIS was designed and fabricated. Through characterization, it is shown that the designed CIS has the potential to achieve 20 Mfps with an input-referred noise of 5.1 e− rms
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