9,781 research outputs found

    Physically justifiable die-level modeling of spatial variation in view of systematic across wafer variability

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    Technical Design Report for the PANDA Micro Vertex Detector

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    This document illustrates the technical layout and the expected performance of the Micro Vertex Detector (MVD) of the PANDA experiment. The MVD will detect charged particles as close as possible to the interaction zone. Design criteria and the optimisation process as well as the technical solutions chosen are discussed and the results of this process are subjected to extensive Monte Carlo physics studies. The route towards realisation of the detector is outlined

    Modeling the Temperature Bias of Power Consumption for Nanometer-Scale CPUs in Application Processors

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    We introduce and experimentally validate a new macro-level model of the CPU temperature/power relationship within nanometer-scale application processors or system-on-chips. By adopting a holistic view, this model is able to take into account many of the physical effects that occur within such systems. Together with two algorithms described in the paper, our results can be used, for instance by engineers designing power or thermal management units, to cancel the temperature-induced bias on power measurements. This will help them gather temperature-neutral power data while running multiple instance of their benchmarks. Also power requirements and system failure rates can be decreased by controlling the CPU's thermal behavior. Even though it is usually assumed that the temperature/power relationship is exponentially related, there is however a lack of publicly available physical temperature/power measurements to back up this assumption, something our paper corrects. Via measurements on two pertinent platforms sporting nanometer-scale application processors, we show that the power/temperature relationship is indeed very likely exponential over a 20{\deg}C to 85{\deg}C temperature range. Our data suggest that, for application processors operating between 20{\deg}C and 50{\deg}C, a quadratic model is still accurate and a linear approximation is acceptable.Comment: Submitted to SAMOS 2014; International Conference on Embedded Computer Systems: Architectures, Modeling, and Simulation (SAMOS XIV

    Hybrid Gate-Level Leakage Model for Monte Carlo Analysis on Multiple GPUs

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    This paper proposes a hybrid gate-level leakage model for the use with the Monte Carlo (MC) analysis approach, which combines a lookup table (LUT) model with a first-order exponential-polynomial model (first-order model, herein). For the process parameters having strong nonlinear relationships with the logarithm of leakage current, the proposed model uses the LUT approach for the sake of modeling accuracy. For the other process parameters, it uses the first-order model for increased efficiency. During the library characterization for each type of logic gates, the proposed approach determines the process parameters for which it will use the LUT model. And, it determines the number of LUT data points, which can maximize analysis efficiency with acceptable accuracy, based on the user-defined threshold. The proposed model was implemented for gate-level MC leakage analysis using three graphic processing units. In experiments, the proposed approach exhibited the average errors of <5% in both mean and standard deviation with reference to SPICE-level MC leakage analysis. In comparison, MC analysis with the first-order model exhibited more than 90% errors. In CPU times, the proposed hybrid approach took only two to five times longer runtimes. In comparison with the full LUT model, the proposed hybrid model was up to one hundred times faster while increasing the average errors by only 3%. Finally, the proposed approach completed a leakage analysis of an OpenSparc T2 core of 4.5 million gates with a runtime of <5 min.1150Ysciescopu

    Production and performance of silicon pixel modules with planar sensors for the ATLAS ITk upgrade

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    On Timing Model Extraction and Hierarchical Statistical Timing Analysis

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    In this paper, we investigate the challenges to apply Statistical Static Timing Analysis (SSTA) in hierarchical design flow, where modules supplied by IP vendors are used to hide design details for IP protection and to reduce the complexity of design and verification. For the three basic circuit types, combinational, flip-flop-based and latch-controlled, we propose methods to extract timing models which contain interfacing as well as compressed internal constraints. Using these compact timing models the runtime of full-chip timing analysis can be reduced, while circuit details from IP vendors are not exposed. We also propose a method to reconstruct the correlation between modules during full-chip timing analysis. This correlation can not be incorporated into timing models because it depends on the layout of the corresponding modules in the chip. In addition, we investigate how to apply the extracted timing models with the reconstructed correlation to evaluate the performance of the complete design. Experiments demonstrate that using the extracted timing models and reconstructed correlation full-chip timing analysis can be several times faster than applying the flattened circuit directly, while the accuracy of statistical timing analysis is still well maintained

    Experimental Tests of Particle Flow Calorimetry

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    Precision physics at future colliders requires highly granular calorimeters to support the Particle Flow Approach for event reconstruction. This article presents a review of about 10 - 15 years of R\&D, mainly conducted within the CALICE collaboration, for this novel type of detector. The performance of large scale prototypes in beam tests validate the technical concept of particle flow calorimeters. The comparison of test beam data with simulation, of e.g.\ hadronic showers, supports full detector studies and gives deeper insight into the structure of hadronic cascades than was possible previously.Comment: 55 pages, 83 figures, to appear in Reviews of Modern physic
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