Power/Ground Networks Optimization Design Methods with Noise Immunity

制度:新 ; 報告番号:甲3535号 ; 学位の種類:博士(工学) ; 授与年月日:2012/3/15 ; 早大学位記番号:新587

Effective network grid synthesis and optimization for high performance very large scale integration system design

制度:新 ; 文部省報告番号:甲2642号 ; 学位の種類:博士(工学) ; 授与年月日:2008/3/15 ; 早大学位記番号:新480

Design and Analysis of Power Distribution Networks in VLSI Circuits.

Rapidly switching currents of the on-chip devices can cause fluctuations in the supply voltage which can be classified as IR and Ldi/dt drops. The voltage fluctuations in a supply network can inject noise in a circuit which may lead to functional failures of the design. Power supply integrity verification is, therefore, a critical concern in high-performance designs. Also, with decreasing supply voltages, gate-delay is becoming increasingly sensitive to supply voltage variation. With ever-diminishing clock periods, accurate analysis of the impact of supply voltage on circuit performance has also become critical. Increasing power consumption and clock frequency have exacerbated the Ldi/dt drop in every new technology generation. The Ldi/dt drop has become the dominant portion of the overall supply-drop in high performance designs. On-die passive decap, which has traditionally been used for suppressing Ldi/dt, has become expensive due to its area and leakage power overhead. This has created an urgent need for novel circuit techniques to suppress the Ldi/dt drop in power distribution networks. We provide accurate algorithmic solutions for determining the worst-case supply-drop and the impact of supply noise on circuit performance. We propose a path-based and a block-based approach for computing the maximum circuit delay under power supply fluctuations. We also propose an early-mode supply-drop estimation approach and a statistical approach for power grid analysis. All the proposed approaches are vectorless and account for both IR and Ldi/dt drops. We also propose a performance-aware decoupling capacitance allocation technique which uses timing slacks to drive the optimization. Finally, we present analog as well as all-digital circuit techniques for inductive supply noise suppression. The proposed all-digital circuit techniques were implemented in a test-chip, fabricated in a 0.13µm CMOS process. Measurements on the test-chip demonstrate a reduction in the supply fluctuations by 57% for a ramp loads and by 75% during resonance. We also present a low-power, all-digital on-chip oscilloscope for accurate measurement of supply noise. Supply noise measurements obtained from the on-chip oscilloscope were validated to conform well to those obtained from a traditional supply-drop monitor and direct on-chip probing.Ph.D.Electrical EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttp://deepblue.lib.umich.edu/bitstream/2027.42/58508/1/spant_1.pd

CAD methodologies for low power and reliable 3D ICs

The main objective of this dissertation is to explore and develop computer-aided-design (CAD) methodologies and optimization techniques for reliability, timing performance, and power consumption of through-silicon-via(TSV)-based and monolithic 3D IC designs. The 3D IC technology is a promising answer to the device scaling and interconnect problems that industry faces today. Yet, since multiple dies are stacked vertically in 3D ICs, new problems arise such as thermal, power delivery, and so on. New physical design methodologies and optimization techniques should be developed to address the problems and exploit the design freedom in 3D ICs. Towards the objective, this dissertation includes four research projects. The first project is on the co-optimization of traditional design metrics and reliability metrics for 3D ICs. It is well known that heat removal and power delivery are two major reliability concerns in 3D ICs. To alleviate thermal problem, two possible solutions have been proposed: thermal-through-silicon-vias (T-TSVs) and micro-fluidic-channel (MFC) based cooling. For power delivery, a complex power distribution network is required to deliver currents reliably to all parts of the 3D IC while suppressing the power supply noise to an acceptable level. However, these thermal and power networks pose major challenges in signal routability and congestion. In this project, a co-optimization methodology for signal, power, and thermal interconnects in 3D ICs is presented. The goal of the proposed approach is to improve signal, thermal, and power noise metrics and to provide fast and accurate design space explorations for early design stages. The second project is a study on 3D IC partition. For a 3D IC, the target circuit needs to be partitioned into multiple parts then mapped onto the dies. The partition style impacts design quality such as footprint, wirelength, timing, and so on. In this project, the design methodologies of 3D ICs with different partition styles are demonstrated. For the LEON3 multi-core microprocessor, three partitioning styles are compared: core-level, block-level, and gate-level. The design methodologies for such partitioning styles and their implications on the physical layout are discussed. Then, to perform timing optimizations for 3D ICs, two timing constraint generation methods are demonstrated that lead to different design quality. The third project is on the buffer insertion for timing optimization of 3D ICs. For high performance 3D ICs, it is crucial to perform thorough timing optimizations. Among timing optimization techniques, buffer insertion is known to be the most effective way. The TSVs have a large parasitic capacitance that increases the signal slew and the delay on the downstream. In this project, a slew-aware buffer insertion algorithm is developed that handles full 3D nets and considers TSV parasitics and slew effects on delay. Compared with the well-known van Ginneken algorithm and a commercial tool, the proposed algorithm finds buffering solutions with lower delay values and acceptable runtime overhead. The last project is on the ultra-high-density logic designs for monolithic 3D ICs. The nano-scale 3D interconnects available in monolithic 3D IC technology enable ultra-high-density device integration at the individual transistor-level. The benefits and challenges of monolithic 3D integration technology for logic designs are investigated. First, a 3D standard cell library for transistor-level monolithic 3D ICs is built and their timing and power behavior are characterized. Then, various interconnect options for monolithic 3D ICs that improve design quality are explored. Next, timing-closed, full-chip GDSII layouts are built and iso-performance power comparisons with 2D IC designs are performed. Important design metrics such as area, wirelength, timing, and power consumption are compared among transistor-level monolithic 3D, gate-level monolithic 3D, TSV-based 3D, and traditional 2D designs.PhDCommittee Chair: Lim, Sung Kyu; Committee Member: Bakir, Muhannad; Committee Member: Kim, Hyesoon; Committee Member: Lee, Hsien-Hsin; Committee Member: Mukhopadhyay, Saiba

Signaling in 3-D integrated circuits, benefits and challenges

Three-dimensional (3-D) or vertical integration is a design and packaging paradigm that can mitigate many of the increasing challenges related to the design of modern integrated systems. 3-D circuits have recently been at the spotlight, since these circuits provide a potent approach to enhance the performance and integrate diverse functions within amulti-plane stack. Clock networks consume a great portion of the power dissipated in a circuit. Therefore, designing a low-power clock network in synchronous circuits is an important task. This requirement is stricter for 3-D circuits due to the increased power densities. Synchronization issues can be more challenging for 3-D circuits since a clock path can spread across several planes with different physical and electrical characteristics. Consequently, designing low power clock networks for 3-D circuits is an important issue. Resonant clock networks are considered efficient low-power alternatives to conventional clock distribution schemes. These networks utilize additional inductive circuits to reduce power while delivering a full swing clock signal to the sink nodes. In this research, a design method to apply resonant clocking to synthesized clock trees is proposed. Manufacturing processes for 3-D circuits include some additional steps as compared to standard CMOS processes which makes 3-D circuits more susceptible to manufacturing defects and lowers the overall yield of the bonded 3-D stack. Testing is another complicated task for 3-D ICs, where pre-bond test is a prerequisite. Pre-bond testability, in turn, presents new challenges to 3-D clock network design primarily due to the incomplete clock distribution networks prior to the bonding of the planes. A design methodology of resonant 3-D clock networks that support wireless pre-bond testing is introduced. To efficiently address this issue, inductive links are exploited to wirelessly transmit the clock signal to the disjoint resonant clock networks. The inductors comprising the LC tanks are used as the receiver circuit for the links, essentially eliminating the need for additional circuits and/or interconnect resources during pre-bond test. Recent FPGAs are quite complex circuits which provide reconfigurablity at the cost of lower performance and higher power consumption as compared to ASIC circuits. Exploiting a large number of programmable switches, routing structures are mainly responsible for performance degradation in FPAGs. Employing 3-D technology can providemore efficient switches which drastically improve the performance and reduce the power consumption of the FPGA. RRAM switches are one of the most promising candidates to improve the FPGA routing architecture thanks to their low on-resistance and non-volatility. Along with the configurable switches, buffers are the other important element of the FPGAs routing structure. Different characteristics of RRAM switches change the properties of signal paths in RRAM-based FPGAs. The on resistance of RRAMswitches is considerably lower than CMOS pass gate switches which results in lower RC delay for RRAM-based routing paths. This different nature in critical path and signal delay in turn affect the need for intermediate buffers. Thus the buffer allocation should be reconsidered. In the last part of this research, the effect of intermediate buffers on signal propagation delay is studied and a modified buffer allocation scheme for RRAM-based FPGA routing path is proposed

Modelling and performance analysis of multigigabit serial interconnects using real number based analog verification methods

The increasing importance of multigigabit transceiver circuits in modern chip design calls for new methods of analyzing and integrating these challenging building blocks. This work presents a design and analysis framework basend on the SystemVerilog real number modeling ansatz. It further extends the simulation possibilities thus obtained by introducing additional higher level numeric modelling and evaluation methods to support multigigabit statistical link budgeting procedures based on the Peak Distortion Algorithm

Physical parameter-aware Networks-on-Chip design

PhD ThesisNetworks-on-Chip (NoCs) have been proposed as a scalable, reliable and power-efficient communication fabric for chip multiprocessors (CMPs) and multiprocessor systems-on-chip (MPSoCs). NoCs determine both the performance and the reliability of such systems, with a significant power demand that is expected to increase due to developments in both technology and architecture. In terms of architecture, an important trend in many-core systems architecture is to increase the number of cores on a chip while reducing their individual complexity. This trend increases communication power relative to computation power. Moreover, technology-wise, power-hungry wires are dominating logic as power consumers as technology scales down. For these reasons, the design of future very large scale integration (VLSI) systems is moving from being computation-centric to communication-centric. On the other hand, chip’s physical parameters integrity, especially power and thermal integrity, is crucial for reliable VLSI systems. However, guaranteeing this integrity is becoming increasingly difficult with the higher scale of integration due to increased power density and operating frequencies that result in continuously increasing temperature and voltage drops in the chip. This is a challenge that may prevent further shrinking of devices. Thus, tackling the challenge of power and thermal integrity of future many-core systems at only one level of abstraction, the chip and package design for example, is no longer sufficient to ensure the integrity of physical parameters. New designtime and run-time strategies may need to work together at different levels of abstraction, such as package, application, network, to provide the required physical parameter integrity for these large systems. This necessitates strategies that work at the level of the on-chip network with its rising power budget. This thesis proposes models, techniques and architectures to improve power and thermal integrity of Network-on-Chip (NoC)-based many-core systems. The thesis is composed of two major parts: i) minimization and modelling of power supply variations to improve power integrity; and ii) dynamic thermal adaptation to improve thermal integrity. This thesis makes four major contributions. The first is a computational model of on-chip power supply variations in NoCs. The proposed model embeds a power delivery model, an NoC activity simulator and a power model. The model is verified with SPICE simulation and employed to analyse power supply variations in synthetic and real NoC workloads. Novel observations regarding power supply noise correlation with different traffic patterns and routing algorithms are found. The second is a new application mapping strategy aiming vii to minimize power supply noise in NoCs. This is achieved by defining a new metric, switching activity density, and employing a force-based objective function that results in minimizing switching density. Significant reductions in power supply noise (PSN) are achieved with a low energy penalty. This reduction in PSN also results in a better link timing accuracy. The third contribution is a new dynamic thermal-adaptive routing strategy to effectively diffuse heat from the NoC-based threedimensional (3D) CMPs, using a dynamic programming (DP)-based distributed control architecture. Moreover, a new approach for efficient extension of two-dimensional (2D) partially-adaptive routing algorithms to 3D is presented. This approach improves three-dimensional networkon- chip (3D NoC) routing adaptivity while ensuring deadlock-freeness. Finally, the proposed thermal-adaptive routing is implemented in field-programmable gate array (FPGA), and implementation challenges, for both thermal sensing and the dynamic control architecture are addressed. The proposed routing implementation is evaluated in terms of both functionality and performance. The methodologies and architectures proposed in this thesis open a new direction for improving the power and thermal integrity of future NoC-based 2D and 3D many-core architectures

Integrated Topologies And Digital Control For Satellite Power Management And Distribution Systems

This work is focused on exploring advanced solutions for space power management and distribution (PMAD) systems. As spacecraft power requirements continue to increase, paralleled by the pressures for reducing cost and overall system weight, power electronics engineers will continue to face major redesigns of the space power systems in order to meet such challenges. Front-end PMAD systems, used to interface the solar sources and battery backup to the distribution bus, need to be designed with increased efficiency, reliability, and power density. A new family of integrated single-stage power converter structures is introduced here. This family allows the interface and control of multiple power sources and storage devices in order to optimize utilization of available resources. Employing single-stage power topologies, these converters control power flow efficiently and cost-effectively. This is achieved by modifying the operation and control strategies of isolated soft-switched half-bridge and full-bridge converters--two of the most popular two-port converter topologies. These topologies are reconfigured and utilized to realize three power processing paths. These paths simultaneously utilize the power devices, allowing increased functionality while promising reduced losses and enhanced power densities. Each of the proposed topologies is capable of performing simultaneous control of two of its three ports. Control objectives include battery or ultra-capacitor charge regulation, solar array maximum power point tracking (MPPT), and/or bus voltage regulation. Another advantage of the proposed power structure is that current engineering design concepts can be used to optimize the new topologies in a fashion similar to the mother topologies. This includes component selection and magnetic design procedures, as well as achieving soft-switching for increased efficiency at higher switching frequencies. Galvanic isolation of the load port through high-frequency transformers provides design flexibility for high step-up/step-down conversion ratios. It further allows the converters to be used as power electronics building blocks (PEBB) with outputs connected in different series/parallel combinations to meet different load requirements. Utilizing such converters promises significant savings in size, weight, and costs of the power management system as well as the devices it manages. Chapter 1 of this dissertation provides an introduction to the requirements, challenges, and trends of space PMAD. A review of existing multi-port converter technologies and digital control techniques is given in Chapter 2. Chapter 3 discusses different PMAD system architectures. It outlines the basic concepts used for PMAD integration and discusses the potential for improvement. Chapters 4 and 5 present and discuss the operation and characteristics of three different integrated multi-port converters. Chapter 6 presents improved methods for practical digital control of switching converters, which are especially useful in complex multi-objective controllers used for PMAD. This is followed by conclusions and suggested future work

Integrated Circuit Design for Miniaturized, Trackable, Ultrasound Based Biomedical Implants

This thesis focuses on the design of an ultrasonography compatible implantable sensor platform, as a novel approach that implements a miniaturized, battery-less, real-time trackable parallel biosensing system. In addition to the frontend circuit, a sub-nW fully integrated pH sensor is designed in a way that can be easily integrated with the proposed sonography-compatible sensor platform. Combining the two integrated circuits together, the whole system will be able to map in vivo physiological information acquired from a distributed set of sensors on top of the ultrasound movie, leading to the idea envisioned as “augmented ultrasonography”. Implemented in a 0.18 μm technology, an ultrasound power and data frontend circuit is designed to enable medical sensing implants to operate in an ultrasonography compatible way. When placed within the field of view of an imaging transducer, the frontend circuit harvests the power through a piece of piezo crystal from a minimally modified brightness-mode (B-mode) ultrasound imaging process that is commonly adopted in modern medical practices. The implant can also establish bi-directional data communication channels with the imaging transducer, allowing data to be transmitted in a way synchronized to the frame rate of the B-mode film. The design of the circuit is made possible by a combination of ultra-low-power circuit techniques and novel frontend circuit topologies, as imaging ultrasound waves in the form of short pulses with extremely low duty cycle poses challenges that has not previously seen in other implantable sensor systems. The proposed prototype achieves a total area of 0.6mm² for the integrated circuit (IC), as well as 71mm theoretical maximum implantable depth (up to 40 mm is verified experimentally). These two together give opportunities for this design to become the next generation solution for deep-tissue bio-sensing implants. Realized using the same 0.18 μm technology, the fully integrated pH sensor is designed to deliver accurate pH readouts, at a reasonable speed of 1 sample per second, while consuming only 0.72 nW of power. Using an ion-sensitive field effect transistor (ISFET) and reference field effect transistor pair (REFET), the IC requires minimum additional post fabrication to deliver 10-bit resolution pH readouts at an end-to-end sensitivity of 65.8 LSB/pH. When working as a standalone device, this work advances the state-of-the-art of ISFET based pH sensor design. With an addition of 0.46 mm² of area, it is possible to integrate it with the ultrasound sonography compatible implant platform. This potential integration will further advance the vision of the augmented ultrasonography: real-time display of physiological information in a B-mode film, with the help from a distributed bio-sensor system for deep-tissue physiology monitoring