Throughput-driven floorplanning with wire pipelining

The size of future high-performance SoC is such that the time-of-flight of wires connecting distant pins in the layout can be much higher than the clock period. In order to keep the frequency as high as possible, the wires may be pipelined. However, the insertion of flip-flops may alter the throughput of the system due to the presence of loops in the logic netlist. In this paper, we address the problem of floorplanning a large design where long interconnects are pipelined by inserting the throughput in the cost function of a tool based on simulated annealing. The results obtained on a series of benchmarks are then validated using a simple router that breaks long interconnects by suitably placing flip-flops along the wires

Indirect test of M-S circuits using multiple specification band guarding

Testing analog and mixed-signal circuits is a costly task due to the required test time targets and high end technical resources. Indirect testing methods partially address these issues providing an efficient solution using easy to measure CUT information that correlates with circuit performances. In this work, a multiple specification band guarding technique is proposed as a method to achieve a test target of misclassified circuits. The acceptance/rejection test regions are encoded using octrees in the measurement space, where the band guarding factors precisely tune the test decision boundary according to the required test yield targets. The generated octree data structure serves to cluster the forthcoming circuits in the production testing phase by solely relying on indirect measurements. The combined use of octree based encoding and multiple specification band guarding makes the testing procedure fast, efficient and highly tunable. The proposed band guarding methodology has been applied to test a band-pass Butterworth filter under parametric variations. Promising simulation results are reported showing remarkable improvements when the multiple specification band guarding criterion is used.Peer ReviewedPostprint (author's final draft

Testing a Quantum Computer

The problem of quantum test is formally addressed. The presented method attempts the quantum role of classical test generation and test set reduction methods known from standard binary and analog circuits. QuFault, the authors software package generates test plans for arbitrary quantum circuits using the very efficient simulator QuIDDPro[1]. The quantum fault table is introduced and mathematically formalized, and the test generation method explained.Comment: 15 pages, 17 equations, 27 tables, 8 figure

Mixed-Signal Testability Analysis for Data-Converter IPs

In this paper, a new procedure to derive testability measures is presented. Digital testability can be calculated by means of probability, while in analog it is possible to calculate testability using impedance values. Although attempts have been made to reach compatibility, matching was somewhat arbitrary and therefore not necessarily compatible. The concept of the new approach is that digital and analog can be integrated in a more consistent way. More realistic testability figures are obtained, which makes testability of true mixed-signal systems and circuits feasible. To verify the results, our method is compared with a sensitivity analysis, for a simple 3-bit ADC

Equalization of Third-Order Intermodulation Products in Wideband Direct Conversion Receivers

This paper reports a SAW-less direct-conversion receiver which utilizes a mixed-signal feedforward path to regenerate and adaptively cancel IM3 products, thus accomplishing system-level linearization. The receiver system performance is dominated by a custom integrated RF front end implemented in 130-nm CMOS and achieves an uncorrected out-of-band IIP3 of -7.1 dBm under the worst-case UMTS FDD Region 1 blocking specifications. Under IM3 equalization, the receiver achieves an effective IIP3 of +5.3 dBm and meets the UMTS BER sensitivity requirement with 3.7 dB of margin

On-Chip Transparent Wire Pipelining (invited paper)

Wire pipelining has been proposed as a viable mean to break the discrepancy between decreasing gate delays and increasing wire delays in deep-submicron technologies. Far from being a straightforwardly applicable technique, this methodology requires a number of design modifications in order to insert it seamlessly in the current design flow. In this paper we briefly survey the methods presented by other researchers in the field and then we thoroughly analyze the solutions we recently proposed, ranging from system-level wire pipelining to physical design aspects