Exploiting Adaptive Techniques to Improve Processor Energy Efficiency

Rapid device-miniaturization keeps on inducing challenges in building energy efficient microprocessors. As the size of the transistors continuously decreasing, more uncertainties emerge in their operations. On the other hand, integrating more and more transistors on a single chip accentuates the need to lower its supply-voltage. This dissertation investigates one of the primary device uncertainties - timing error, in microprocessor performance bottleneck in NTC era. Then it proposes various innovative techniques to exploit these opportunities to maintain processor energy efficiency, in the context of emerging challenges. Evaluated with the cross-layer methodology, the proposed approaches achieve substantial improvements in processor energy efficiency, compared to other start-of-art techniques

A Survey of Prediction and Classification Techniques in Multicore Processor Systems

In multicore processor systems, being able to accurately predict the future provides new optimization opportunities, which otherwise could not be exploited. For example, an oracle able to predict a certain application\u27s behavior running on a smart phone could direct the power manager to switch to appropriate dynamic voltage and frequency scaling modes that would guarantee minimum levels of desired performance while saving energy consumption and thereby prolonging battery life. Using predictions enables systems to become proactive rather than continue to operate in a reactive manner. This prediction-based proactive approach has become increasingly popular in the design and optimization of integrated circuits and of multicore processor systems. Prediction transforms from simple forecasting to sophisticated machine learning based prediction and classification that learns from existing data, employs data mining, and predicts future behavior. This can be exploited by novel optimization techniques that can span across all layers of the computing stack. In this survey paper, we present a discussion of the most popular techniques on prediction and classification in the general context of computing systems with emphasis on multicore processors. The paper is far from comprehensive, but, it will help the reader interested in employing prediction in optimization of multicore processor systems

A Study on Performance and Power Efficiency of Dense Non-Volatile Caches in Multi-Core Systems

In this paper, we present a novel cache design based on Multi-Level Cell Spin-Transfer Torque RAM (MLC STTRAM) that can dynamically adapt the set capacity and associativity to use efficiently the full potential of MLC STTRAM. We exploit the asymmetric nature of the MLC storage scheme to build cache lines featuring heterogeneous performances, that is, half of the cache lines are read-friendly, while the other is write-friendly. Furthermore, we propose to opportunistically deactivate ways in underutilized sets to convert MLC to Single-Level Cell (SLC) mode, which features overall better performance and lifetime. Our ultimate goal is to build a cache architecture that combines the capacity advantages of MLC and performance/energy advantages of SLC. Our experiments show an improvement of 43% in total numbers of conflict misses, 27% in memory access latency, 12% in system performance, and 26% in LLC access energy, with a slight degradation in cache lifetime (about 7%) compared to an SLC cache

Exploration and Design of Power-Efficient Networked Many-Core Systems

Multiprocessing is a promising solution to meet the requirements of near future applications. To get full benefit from parallel processing, a manycore system needs efficient, on-chip communication architecture. Networkon- Chip (NoC) is a general purpose communication concept that offers highthroughput, reduced power consumption, and keeps complexity in check by a regular composition of basic building blocks. This thesis presents power efficient communication approaches for networked many-core systems. We address a range of issues being important for designing power-efficient manycore systems at two different levels: the network-level and the router-level. From the network-level point of view, exploiting state-of-the-art concepts such as Globally Asynchronous Locally Synchronous (GALS), Voltage/ Frequency Island (VFI), and 3D Networks-on-Chip approaches may be a solution to the excessive power consumption demanded by today’s and future many-core systems. To this end, a low-cost 3D NoC architecture, based on high-speed GALS-based vertical channels, is proposed to mitigate high peak temperatures, power densities, and area footprints of vertical interconnects in 3D ICs. To further exploit the beneficial feature of a negligible inter-layer distance of 3D ICs, we propose a novel hybridization scheme for inter-layer communication. In addition, an efficient adaptive routing algorithm is presented which enables congestion-aware and reliable communication for the hybridized NoC architecture. An integrated monitoring and management platform on top of this architecture is also developed in order to implement more scalable power optimization techniques. From the router-level perspective, four design styles for implementing power-efficient reconfigurable interfaces in VFI-based NoC systems are proposed. To enhance the utilization of virtual channel buffers and to manage their power consumption, a partial virtual channel sharing method for NoC routers is devised and implemented. Extensive experiments with synthetic and real benchmarks show significant power savings and mitigated hotspots with similar performance compared to latest NoC architectures. The thesis concludes that careful codesigned elements from different network levels enable considerable power savings for many-core systems.Siirretty Doriast

Gestión de jerarquías de memoria híbridas a nivel de sistema

Tesis inédita de la Universidad Complutense de Madrid, Facultad de Informática, Departamento de Arquitectura de Computadoras y Automática y de Ku Leuven, Arenberg Doctoral School, Faculty of Engineering Science, leída el 11/05/2017.In electronics and computer science, the term ‘memory’ generally refers to devices that are used to store information that we use in various appliances ranging from our PCs to all hand-held devices, smart appliances etc. Primary/main memory is used for storage systems that function at a high speed (i.e. RAM). The primary memory is often associated with addressable semiconductor memory, i.e. integrated circuits consisting of silicon-based transistors, used for example as primary memory but also other purposes in computers and other digital electronic devices. The secondary/auxiliary memory, in comparison provides program and data storage that is slower to access but offers larger capacity. Examples include external hard drives, portable flash drives, CDs, and DVDs. These devices and media must be either plugged in or inserted into a computer in order to be accessed by the system. Since secondary storage technology is not always connected to the computer, it is commonly used for backing up data. The term storage is often used to describe secondary memory. Secondary memory stores a large amount of data at lesser cost per byte than primary memory; this makes secondary storage about two orders of magnitude less expensive than primary storage. There are two main types of semiconductor memory: volatile and nonvolatile. Examples of non-volatile memory are ‘Flash’ memory (sometimes used as secondary, sometimes primary computer memory) and ROM/PROM/EPROM/EEPROM memory (used for firmware such as boot programs). Examples of volatile memory are primary memory (typically dynamic RAM, DRAM), and fast CPU cache memory (typically static RAM, SRAM, which is fast but energy-consuming and offer lower memory capacity per are a unit than DRAM). Non-volatile memory technologies in Si-based electronics date back to the 1990s. Flash memory is widely used in consumer electronic products such as cellphones and music players and NAND Flash-based solid-state disks (SSDs) are increasingly displacing hard disk drives as the primary storage device in laptops, desktops, and even data centers. The integration limit of Flash memories is approaching, and many new types of memory to replace conventional Flash memories have been proposed. The rapid increase of leakage currents in Silicon CMOS transistors with scaling poses a big challenge for the integration of SRAM memories. There is also the case of susceptibility to read/write failure with low power schemes. As a result of this, over the past decade, there has been an extensive pooling of time, resources and effort towards developing emerging memory technologies like Resistive RAM (ReRAM/RRAM), STT-MRAM, Domain Wall Memory and Phase Change Memory(PRAM). Emerging non-volatile memory technologies promise new memories to store more data at less cost than the expensive-to build silicon chips used by popular consumer gadgets including digital cameras, cell phones and portable music players. These new memory technologies combine the speed of static random-access memory (SRAM), the density of dynamic random-access memory (DRAM), and the non-volatility of Flash memory and so become very attractive as another possibility for future memory hierarchies. The research and information on these Non-Volatile Memory (NVM) technologies has matured over the last decade. These NVMs are now being explored thoroughly nowadays as viable replacements for conventional SRAM based memories even for the higher levels of the memory hierarchy. Many other new classes of emerging memory technologies such as transparent and plastic, three-dimensional(3-D), and quantum dot memory technologies have also gained tremendous popularity in recent years...En el campo de la informática, el término ‘memoria’ se refiere generalmente a dispositivos que son usados para almacenar información que posteriormente será usada en diversos dispositivos, desde computadoras personales (PC), móviles, dispositivos inteligentes, etc. La memoria principal del sistema se utiliza para almacenar los datos e instrucciones de los procesos que se encuentre en ejecución, por lo que se requiere que funcionen a alta velocidad (por ejemplo, DRAM). La memoria principal está implementada habitualmente mediante memorias semiconductoras direccionables, siendo DRAM y SRAM los principales exponentes. Por otro lado, la memoria auxiliar o secundaria proporciona almacenaje(para ficheros, por ejemplo); es más lenta pero ofrece una mayor capacidad. Ejemplos típicos de memoria secundaria son discos duros, memorias flash portables, CDs y DVDs. Debido a que estos dispositivos no necesitan estar conectados a la computadora de forma permanente, son muy utilizados para almacenar copias de seguridad. La memoria secundaria almacena una gran cantidad de datos aun coste menor por bit que la memoria principal, siendo habitualmente dos órdenes de magnitud más barata que la memoria primaria. Existen dos tipos de memorias de tipo semiconductor: volátiles y no volátiles. Ejemplos de memorias no volátiles son las memorias Flash (algunas veces usadas como memoria secundaria y otras veces como memoria principal) y memorias ROM/PROM/EPROM/EEPROM (usadas para firmware como programas de arranque). Ejemplos de memoria volátil son las memorias DRAM (RAM dinámica), actualmente la opción predominante a la hora de implementar la memoria principal, y las memorias SRAM (RAM estática) más rápida y costosa, utilizada para los diferentes niveles de cache. Las tecnologías de memorias no volátiles basadas en electrónica de silicio se remontan a la década de1990. Una variante de memoria de almacenaje por carga denominada como memoria Flash es mundialmente usada en productos electrónicos de consumo como telefonía móvil y reproductores de música mientras NAND Flash solid state disks(SSDs) están progresivamente desplazando a los dispositivos de disco duro como principal unidad de almacenamiento en computadoras portátiles, de escritorio e incluso en centros de datos. En la actualidad, hay varios factores que amenazan la actual predominancia de memorias semiconductoras basadas en cargas (capacitivas). Por un lado, se está alcanzando el límite de integración de las memorias Flash, lo que compromete su escalado en el medio plazo. Por otra parte, el fuerte incremento de las corrientes de fuga de los transistores de silicio CMOS actuales, supone un enorme desafío para la integración de memorias SRAM. Asimismo, estas memorias son cada vez más susceptibles a fallos de lectura/escritura en diseños de bajo consumo. Como resultado de estos problemas, que se agravan con cada nueva generación tecnológica, en los últimos años se han intensificado los esfuerzos para desarrollar nuevas tecnologías que reemplacen o al menos complementen a las actuales. Los transistores de efecto campo eléctrico ferroso (FeFET en sus siglas en inglés) se consideran una de las alternativas más prometedores para sustituir tanto a Flash (por su mayor densidad) como a DRAM (por su mayor velocidad), pero aún está en una fase muy inicial de su desarrollo. Hay otras tecnologías algo más maduras, en el ámbito de las memorias RAM resistivas, entre las que cabe destacar ReRAM (o RRAM), STT-RAM, Domain Wall Memory y Phase Change Memory (PRAM)...Depto. de Arquitectura de Computadores y AutomáticaFac. de InformáticaTRUEunpu

Toward Reliable, Secure, and Energy-Efficient Multi-Core System Design

Computer hardware researchers have perennially focussed on improving the performance of computers while stipulating the energy consumption under a strict budget. While several innovations over the years have led to high performance and energy efficient computers, more challenges have also emerged as a fallout. For example, smaller transistor devices in modern multi-core systems are afflicted with several reliability and security concerns, which were inconceivable even a decade ago. Tackling these bottlenecks happens to negatively impact the power and performance of the computers. This dissertation explores novel techniques to gracefully solve some of the pressing challenges of the modern computer design. Specifically, the proposed techniques improve the reliability of on-chip communication fabric under a high power supply noise, increase the energy-efficiency of low-power graphics processing units, and demonstrate an unprecedented security loophole of the low-power computing paradigm through rigorous hardware-based experiments

Aggressive and reliable high-performance architectures - techniques for thermal control, energy efficiency, and performance augmentation

As more and more transistors fit in a single chip, consumers of the electronics industry continue to expect decline in cost-per-function. Advancements in process technology offer steady improvements in system performance. The improvements manifest themselves as shrinking area, faster circuits and improved battery life. However, this migration toward sub-micro/nano-meter technologies presents a new set of challenges as the system becomes extremely sensitive to any voltage, temperature or process variations. One approach to immunize the system from the adverse effects of these variations is to add sufficient safety margins to the operating clock frequency of the system. Clearly, this approach is overly conservative because these worst case scenarios rarely occur. But, process technology in nanoscale era has already hit the power and frequency walls. Regardless of any of these challenges, the present processors not only need to run faster, but also cooler and use lesser energy. At a juncture where there is no further improvement in clock frequency is possible, data dependent latching through Timing Speculation (TS) provides a silver lining. Timing speculation is a widely known method for realizing better-than-worst-case systems. TS is aggressive in nature, where the mechanism is to dynamically tune the system frequency beyond the worst-case limits obtained from application characteristics to enhance the performance of system-on-chips (SoCs). However, such aggressive tuning has adverse consequences that need to be overcome. Power dissipation, on-chip temperature and reliability are key issues that cannot be ignored. A carefully designed power management technique combined with a reliable, controlled, aggressive clocking not only attempts to constrain power dissipation within a limit, but also improves performance whenever possible. In this dissertation, we present a novel power level switching mechanism by redefining the existing voltage-frequency pairs. We introduce an aggressive yet reliable framework for energy efficient thermal control. We were able to achieve up to 40% speed-up compared to a base scheme without overclocking. We compare our method against different schemes. We observe that up to 75% Energy-Delay squared product (ED2) savings relative to base architecture is possible. We showcase the loss of efficiency in present chip multiprocessor systems due to excess power supplied, and propose Utilization-aware Task Scheduling (UTS) - a power management scheme that increases energy efficiency of chip multiprocessors. Our experiments demonstrate that UTS along with aggressive timing speculation squeezes out maximum performance from the system without loss of efficiency, and breaching power & thermal constraints. From our evaluation we infer that UTS improves performance by up to 12% due to aggressive power level switching and over 50% in ED2 savings compared to traditional power management techniques. Aggressive clocking systems having TS as their central theme operate at a clock frequency range beyond specified safe limits, exploiting the data dependence on circuit critical paths. However, the margin for performance enhancement is restricted due to extreme difference between short paths and critical paths. In this thesis, we show that increasing the lengths of short paths of the circuit increases the margin of TS, leading to performance improvement in aggressively designed systems. We develop Min-arc algorithm to efficiently add delay buffers to selected short paths while keeping down the area penalty. We show that by using our algorithm, it is possible to increase the circuit contamination delay by up to 30% without affecting the propagation delay, with moderate area overhead. We also explore the possibility of increasing short path delays further by relaxing the constraint on propagation delay, and achieve even higher performance. Overall, we bring out the inter-relationship between power, temperature and reliability of aggressively clocked systems. Our main objective is to achieve maximal performance benefits and improved energy efficiency within thermal constraints by effectively combining dynamic frequency scaling, dynamic voltage scaling and reliable overclocking. We provide solutions to improve the existing power management in chip multiprocessors to dynamically maximize system utilization and satisfy the power constraints within safe thermal limits

Challenges and Opportunities in Near-Threshold DNN Accelerators around Timing Errors

AI evolution is accelerating and Deep Neural Network (DNN) inference accelerators are at the forefront of ad hoc architectures that are evolving to support the immense throughput required for AI computation. However, much more energy efficient design paradigms are inevitable to realize the complete potential of AI evolution and curtail energy consumption. The Near-Threshold Computing (NTC) design paradigm can serve as the best candidate for providing the required energy efficiency. However, NTC operation is plagued with ample performance and reliability concerns arising from the timing errors. In this paper, we dive deep into DNN architecture to uncover some unique challenges and opportunities for operation in the NTC paradigm. By performing rigorous simulations in TPU systolic array, we reveal the severity of timing errors and its impact on inference accuracy at NTC. We analyze various attributes—such as data–delay relationship, delay disparity within arithmetic units, utilization pattern, hardware homogeneity, workload characteristics—and uncover unique localized and global techniques to deal with the timing errors in NTC

Energy and Reliability in Future NOC Interconnected CMPS

In this dissertation, I explore energy and reliability in future NoC (Network-on-Chip) interconnected CMPs (chip multiprocessors) as they have become a first-order constraint in future CMP design. In the first part, we target the root cause of network energy consumption through techniques that reduce link and router-level switching activity. We specifically focus on memory subsystem traffic, as it comprises the bulk of NoC load in a CMP. By transmitting only the flits that contain words that we predicted would be useful using a novel spatial locality predictor, our scheme seeks to reduce network activity. We aim to further lower NoC energy consumption through microarchitectural mechanisms that inhibit datapath switching activity caused by unused words in individual flits. Using simulation-based performance studies and detailed energy models based on synthesized router designs and different link wire types, we show that (a) the pre- diction mechanism achieves very high accuracy, with an average rate of false-unused prediction of just 2.5%; (b) the combined NoC energy savings enabled by the predictor and microarchitectural support are 36% on average and up to 57% in the best case; and (c) there is no system performance penalty as a result of this technique. In the second part, we present a method for dynamic voltage/frequency scaling of networks-on-chip and last level caches in CMP designs, where the shared resources form a single voltage/frequency domain. We develop a new technique for monitoring and control and validate it by running PARSEC benchmarks through full system simulations. These techniques reduce energy-delay product by 46% compared to a state-of-the-art prior work. In the third part, we develop critical path models for HCI- and NBTI-induced wear assuming stress caused under realistic workload conditions, and apply them onto the interconnect microarchitecture. A key finding from this modeling is that, counter to prevailing wisdom, wearout in the CMP on-chip interconnect is correlated with a lack of load observed in the NoC routers, rather than high load. We then develop a novel wearout-decelerating scheme in which routers under low load have their wearout-sensitive components exercised without significantly impacting the router’s cycle time, pipeline depth, and area or power consumption. We subsequently show that the proposed design yields a 13.8∼65× increase in CMP lifetime

Effective memory management for mobile environments

Smartphones, tablets, and other mobile devices exhibit vastly different constraints compared to regular or classic computing environments like desktops, laptops, or servers. Mobile devices run dozens of so-called “apps” hosted by independent virtual machines (VM). All these VMs run concurrently and each VM deploys purely local heuristics to organize resources like memory, performance, and power. Such a design causes conflicts across all layers of the software stack, calling for the evaluation of VMs and the optimization techniques specific for mobile frameworks. In this dissertation, we study the design of managed runtime systems for mobile platforms. More specifically, we deepen the understanding of interactions between garbage collection (GC) and system layers. We develop tools to monitor the memory behavior of Android-based apps and to characterize GC performance, leading to the development of new techniques for memory management that address energy constraints, time performance, and responsiveness. We implement a GC-aware frequency scaling governor for Android devices. We also explore the tradeoffs of power and performance in vivo for a range of realistic GC variants, with established benchmarks and real applications running on Android virtual machines. We control for variation due to dynamic voltage and frequency scaling (DVFS), Just-in-time (JIT) compilation, and across established dimensions of heap memory size and concurrency. Finally, we provision GC as a global service that collects statistics from all running VMs and then makes an informed decision that optimizes across all them (and not just locally), and across all layers of the stack. Our evaluation illustrates the power of such a central coordination service and garbage collection mechanism in improving memory utilization, throughput, and adaptability to user activities. In fact, our techniques aim at a sweet spot, where total on-chip energy is reduced (20–30%) with minimal impact on throughput and responsiveness (5–10%). The simplicity and efficacy of our approach reaches well beyond the usual optimization techniques