シリコンフォトニクスを用いた高速・高感度光受信器に関する研究

Tohoku University山田　博仁課

Design of a Radiation-Hardened Optical Transceiver

Reliable and efficient communication links are vital in harsh environments where ionizing radiation is present. Optical links specifically are necessary to support the growing need for higher data rates and faster signal processing requirements of devices in these environments. For many years, radiation hardness in electronics has been achieved via specialized manufacturing processes in dedicated foundries. These techniques have failed to scale at the rate of commercial CMOS processes, disallowing for faster and more efficient circuits. One strategy to create radiation tolerant circuits while still retaining the benefits of commercial fabrication is a hard-by-design methodology. Techniques such as enclosed layout (EL) and triple modular redundancy (TMR) can be used to design circuitry tolerant to ionizing radiation. This thesis demonstrates an optical transceiver in a 180nm CMOS process based on a transmit vertical-cavity surface-emitting laser (VCSEL) and a receive photo-detector (PD) with radiation-hardened circuitry. The transceiver has been characterized electrically and comparisons between the radiation hardened and non radiation-hardened versions were performed in the Texas A&M Cyclotron Institute and Nuclear Engineering & Science Center (NESC)

Design of Power-Efficient Optical Transceivers and Design of High-Linearity Wireless Wideband Receivers

The combination of silicon photonics and advanced heterogeneous integration is promising for next-generation disaggregated data centers that demand large scale, high throughput, and low power. In this dissertation, we discuss the design and theory of power-efficient optical transceivers with System-in-Package (SiP) 2.5D integration. Combining prior arts and proposed circuit techniques, a receiver chip and a transmitter chip including two 10 Gb/s data channels and one 2.5 GHz clocking channel are designed and implemented in 28 nm CMOS technology. An innovative transimpedance amplifier (TIA) and a single-ended to differential (S2D) converter are proposed and analyzed for a low-voltage high-sensitivity receiver; a four-to-one serializer, programmable output drivers, AC coupling units, and custom pads are implemented in a low-power transmitter; an improved quadrature locked loop (QLL) is employed to generate accurate quadrature clocks. In addition, we present an analysis for inverter-based shunt-feedback TIA to explicitly depict the trade-off among sensitivity, data rate, and power consumption. At last, the research on CDR-based​ clocking schemes for optical links is also discussed. We introduce prior arts and propose a power-efficient clocking scheme based on an injection-locked phase rotator. Next, we analyze injection-locked ring oscillators (ILROs) that have been widely used for quadrature clock generators (QCGs) in multi-lane optical or wireline transceivers due to their low power, low area, and technology scalability. The asymmetrical or partial injection locking from 2 phases to 4 phases results in imbalances in amplitude and phase. We propose a modified frequency-domain analysis to provide intuitive insight into the performance design trade-offs. The analysis is validated by comparing analytical predictions with simulations for an ILRO-based QCG in 28 nm CMOS technology. This dissertation also discusses the design of high-linearity wireless wideband receivers. An out-of-band (OB) IM3 cancellation technique is proposed and analyzed. By exploiting a baseband auxiliary path (AP) with a high-pass feature, the in-band (IB) desired signal and out-of-band interferers are split. OB third-order intermodulation products (IM3) are reconstructed in the AP and cancelled in the baseband (BB). A 0.5-2.5 GHz frequency-translational noise-cancelling (FTNC) receiver is implemented in 65nm CMOS to demonstrate the proposed approach. It consumes 36 mW without cancellation at 1 GHz LO frequency and 1.2 V supply, and it achieves 8.8 MHz baseband bandwidth, 40dB gain, 3.3dB NF, 5dBm OB IIP3, and −6.5dBm OB B1dB. After IM3 cancellation, the effective OB-IIP3 increases to 32.5 dBm with an extra 34 mW for narrow-band interferers (two tones). For wideband interferers, 18.8 dB cancellation is demonstrated over 10 MHz with two −15 dBm modulated interferers. The local oscillator (LO) leakage is −92 dBm and −88 dB at 1 GHz and 2 GHz LO respectively. In summary, this technique achieves both high OB linearity and good LO isolation

Integrated Circuit Design for Hybrid Optoelectronic Interconnects

This dissertation focuses on high-speed circuit design for the integration of hybrid optoelectronic interconnects. It bridges the gap between electronic circuit design and optical device design by seamlessly incorporating the compact Verilog-A model for optical components into the SPICE-like simulation environment, such as the Cadence design tool. Optical components fabricated in the IME 130nm SOI CMOS process are characterized. Corresponding compact Verilog-A models for Mach-Zehnder modulator (MZM) device are developed. With this approach, electro-optical co-design and hybrid simulation are made possible. The developed optical models are used for analyzing the system-level specifications of an MZM based optoelectronic transceiver link. Link power budgets for NRZ, PAM-4 and PAM-8 signaling modulations are simulated at system-level. The optimal transmitter extinction ratio (ER) is derived based on the required receiver\u27s minimum optical modulation amplitude (OMA). A limiting receiver is fabricated in the IBM 130 nm CMOS process. By side- by-side wire-bonding to a commercial high-speed InGaAs/InP PIN photodiode, we demonstrate that the hybrid optoelectronic limiting receiver can achieve the bit error rate (BER) of 10-12 with a -6.7 dBm sensitivity at 4 Gb/s. A full-rate, 4-channel 29-1 length parallel PRBS is fabricated in the IBM 130 nm SiGe BiCMOS process. Together with a 10 GHz phase locked loop (PLL) designed from system architecture to transistor level design, the PRBS is demonstrated operating at more than 10 Gb/s. Lessons learned from high-speed PCB design, dealing with signal integrity issue regarding to the PCB transmission line are summarized

Towards the Design of Robust High-Speed and Power Efficient Short Reach Photonic Links

In 2014, approximately eight trillion transistors were fabricated every second thanks to improvements in integration density and fabrication processes. This increase in integration and functionality has also brought about the possibility of system on chip (SoC) and high-performance computing (HPC). Electrical interconnects presently dominate the very-short reach interconnect landscape (< 5 cm) in these applications. This, however, is expected to change. These interconnects' downfall will be caused by their need for impedance matching, limited pin-density and frequency dependent loss leading to intersymbol interference. In an attempt to solve this, researchers have increasingly explored integrated silicon photonics as it is compatible with current CMOS processes and creates many possibilities for short-reach applications. Many see optical interconnects as the high-speed link solution for applications ranging from intra-data center (~200 m) down to module or even chip scales (< 2 cm). The attractive properties of optical interconnects, such as low loss and multiplexing abilities, will enable such things as Exascale high-performance computers of the future (equal to 10^18 calculations per second). In fact, forecasts predict that by 2025 photonics at the smallest levels of the interconnect hierarchy will be a reality. This thesis presents three novel research projects, which all work towards increasing robustness and cost-efficiency in short-reach optical links. It discusses three parts of the optical link: the interconnect, the receiver and the photodiode. The first topic of this thesis is exploratory work on the use of an optical multiplexing technique, mode-division multiplexing (MDM), to carry multiple data lanes along with a forwarded clock for very short-reach applications. The second topic discussed is a novel reconfigurable CMOS receiver proposed as a method to map a clock signal to an interconnect lane in an MDM source-synchronous link with the lowest optical crosstalk. The receiver is designed as a method to make electronic chips that suit the needs of optical ones. By leveraging the more robust electronic integrated circuit, link solutions can be tuned to meet the needs of photonic chips on a die by die basis. The third topic of this thesis proposes a novel photodetector which uses photonic grating couplers to redirect vertical incident light to the horizontal direction. With this technique, the light is applied along the entire length of a p-n junction to improve the responsivity and speed of the device. Experimental results for this photodetector at 35 Gb/s are published, showing it to be the fastest all-silicon based photodetector reported in the literature at the time of publication

Realization of Integrated Coherent LiDAR

LiDAR (Light Detection and Ranging) captures high-definition real-time 3D images of the surrounding environment through active sensing with infrared lasers. It has unique advantages that can compensate the fundamental limitations in camera-based 3D imaging via vision algorithms or RADARs, which makes it an important sensing modality to guarantee robust autonomy in self-driving cars. However, high price tag of existing commercial LiDAR modules based on mechanical beam scanners and intensity-based detection scheme makes them unusable in the context of mass produced consumer products.The focus of thesis is on the integrated coherent LiDAR with optical phased array-based solid-state beam steering, which has great potential to dramatically bring down the cost of a LiDAR module. It begins with an overview of LiDAR implementation options and system requirements in the context of autonomous vehicles, which leads us to conclude that beam-steering coherent FMCW LiDAR in optical C-band is indeed the best implementation strategy to realize low-cost automotive LiDARs. Motivated by this observation, a quantitative framework for evaluating FMCW LiDAR performance is also introduced to predict the design that satisfies car-grade performance requirements. Then the thesis presents the silicon implementation results from our single-chip optical phased array and integrated coherent LiDAR prototype. Our implementations leverage the 3D heterogeneous integration platform, where custom silicon photonics and nanoscale CMOS fabricated at a 300 mm wafer facility are combined at the wafer-scale to minimize the unit cost without I/O density issues. After discussing remaining challenges and possible ways to enhance the operating range and system reliability, this thesis finally addresses the problem of fundamental trade-off between phase noise and wavelength tuning in FMCW laser source, and present circuit- and algorithm-level techniques to enable FMCW measurements beyond inherent laser coherence range limit

Modeling and Design of High-Speed CMOS Receivers for Short-Reach Photonic Links

This dissertation presents several research outcomes towards designing high-speed CMOS optical receivers for energy-efficient short-reach optical links. First, it provides a wide survey of recently published equalizer-based receivers and presents a novel methodology to accurately calculate their noise. The proposed methodology is then used to find the receiver that achieves the best sensitivity. Second, the trade-off between sensitivity and power dissipation of the receiver is optimized to reduce the energy consumption per bit of the overall link. Design trade-offs for the receiver, transmitter, and the overall link are presented, and comparisons are made to study how much receiver sensitivity can be sacrificed to save its power dissipation before this power reduction is outpaced by the transmitter’s increase in power. Unlike conventional wisdom, our results show that energy-efficient links require low-power receivers with input capacitance much smaller than that required for noise-optimum performance. Third, the thesis presents a novel equalization technique for optical receivers. A linear equalizer (LE) is realized by adding a pole in the feedback paths of an active feedback-based wideband amplifier. By embedding the peaking in the main amplifier (MA), the front-end meets the sensitivity and gain of conventional LE-based receivers with better energy efficiency by eliminating the standalone equalizer stage(s). Electrical measurements are presented to demonstrate the capability of the proposed technique in restoring the bandwidth and improving the performance over the conventional design