Integrated Circuit Solutions for High Datarate Polymer Fiber Communication

Most societies today are dependent on an Internet connection. It has to be reliable in any condition, energy efficient, but most importantly fast. High data rate communication is urgently needed, not only to connect one part of the world to the other, but also for short range applications to help us get through the day. Communication within an autonomous car, to get us from point A to point B, streaming entertainment at a Friday night, or parts of a production chain to help out at a factory. The transmitters and receivers are key components to transfer the data to make these kind of applications possible. Adjustments to what is available and possible is what challenges the progress. Fundamental limitations comes from the material properties and available energy in comparison to the noise around us. Dealing with bandwidth limitations is somewhat man-made, but the interference of different signals is completely real. Looking around for opportunities in this world leads you to look for free bandwidths. The millimeterwave-band (30-300 GHz) offers available bandwidth as well as other benefits. In this work, different circuit solutions enabling high data rate communication is proposed and presented. Different technologies are used, like state of the art processes and commercial processes. Wirebound communication through polymer microwave fiber (PMF) using energy efficient RF-DAC based modulators and power detectors (PDs) is a cheap and robust solution. In this work we explore the opportunities of short range, ultra high data rate, PMF bound communication, which is found to support 30 Gbps error free (BER<10^-12) data

Integrated Circuit Design for High Data Rate Polymer Microwave Fiber Communication

The rapid development of semiconductor processes with a maximum frequency of oscillation well above 300 GHz enables new applications at frequencies above 100 GHz to be researched and developed. Such applications include wireless backhaul, wireless access, radar and radiometer sensors, wireless energy distribution and harvesting, etc.\ua0For several of these applications, a throughput in data rate well above 10 Gbps, even up to 100 Gbps, is required. Optical fiber communication is the leading option for high data rate and long-range wired communication. However, for shorter ranges like chip-to-chip or module-to-module (up to ten meters), millimeter-wave communication over a polymer microwave fiber (PMF) is an interesting alternative due to its potential low cost. Other advantages include flexibility, less sensitivity to temperature variations, and a more relaxed mechanical tolerance requirement. Similar to optical fiber, dispersion occurs on PMFs and will cause symbol interference. Different ways to deal with this effect are investigated, for example, pulse shaping and equalization of the signal.\ua0This work proposes and presents various circuit solutions enabling high data rate communication. Two technologies are used, 250 nm InP DHBT and 130 nm SiGe BiCMOS. An energy-efficient solution using an RF-DAC and power detector for pulse amplitude modulated links are evaluated, as well as an I/Q modulated solution. I/Q (de-)modulators require more complexity, but the increased spectral efficiency can also increase the data rate further.\ua0\ua0In summary, I explore the opportunities and challenges of short-range, ultra-high data rate, PMF bound communication, which is found to support 56 Gbps error-free (BER<10-12) data and 102 Gbps with a BER=2.1*10-3

Digital Signal Processing on FPGA for Short-Range Optical Communications Systems over Plastic Optical Fiber

Nowadays bandwidth requirements are increasing vertiginously. As new ways and concepts of how to share information emerge, new ways of how to access the web enter the market. Computers and mobile devices are only the beginning, the spectrum of web products and services such as IPTV, VoIP, on-line gaming, etc has been augmented by the possibility to share, store data, interact and work on the Cloud. The rush for bandwidth has led researchers from all over the world to enquire themselves on how to achieve higher data rates, and it is thanks to their efforts, that both long-haul and short-range communications systems have experienced a huge development during the last few years. However, as the demand for higher information throughput increases traditional short-range solutions reach their lim- its. As a result, optical solutions are now migrating from long-haul to short-range communication systems. As part of this trend, plastic optical fiber (POF) systems have arisen as promising candidates for applications where traditional glass optical fibers (GOF) are unsuitable. POF systems feature a series of characteristics that make them very suitable for the market requirements. More in detail, these systems are low cost, robust, easy to handle and to install, flexible and yet tolerant to bendings. Nonetheless, these features come at the expense of a considerable higher bandwidth limitation when compared to GOF systems. This thesis is aimed to the investigate the use of digital signal processing (DSP) algorithms to overcome the bandwidth limitation in short-range optical communications system based on POF. In particular, this dissertation presents the design and development of DSP algorithms on field programmable gate arrays (FPGAs) with the ultimate purpose of implementing a fully engineered 1Gbit/s Ethernet Media Converter capable of establishing data links over 50+ meters of PMMA-SI POF using an RC-LED as transmitte

56+ Gb/s serial transmission using duo-binary signaling

In this paper we present duobinary signaling as an alternative for signaling schemes like PAM4 and Ensemble NRZ that are currently being considered as ways to achieve data rates of 56 Gb/s over copper. At the system level, the design includes a custom transceiver ASIC. The transmitter is capable of equalizing 56 Gb/s non-return to zero (NRZ) signals into a duobinary response at the output of the channel. The receiver includes dedicated hardware to decode the duobinary signal. This transceiver is used to demonstrate error-free transmission for different PCB channel lengths including a state-of-the-art Megtron 6 backplane demonstrator

Low Power SoC Design

The design of Low Power Systems-on-Chips (SoC) in very deep submicron technologies becomes a very complex task that has to bridge very high level system description with low-level considerations due to technology defaults and variations and increasing system and circuit complexity. This paper describes the major low-level issues, such as dynamic and static power consumption, temperature, technology variations, interconnect, DFM, reliability and yield, and their impact on high-level design, such as the design of multi-Vdd, fault-tolerant, redundant or adaptive chip architectures. Some very low power System-on-Chip (SoC) will be presented in three domains: wireless sensor networks, vision sensors and mobile TV

E-transportation: the role of embedded systems in electric energy transfer from grid to vehicle

Electric vehicles (EVs) are a promising solution to reduce the transportation dependency on oil, as well as the environmental concerns. Realization of E-transportation relies on providing electrical energy to the EVs in an effective way. Energy storage system (ESS) technologies, including batteries and ultra-capacitors, have been significantly improved in terms of stored energy and power. Beside technology advancements, a battery management system is necessary to enhance safety, reliability and efficiency of the battery. Moreover, charging infrastructure is crucial to transfer electrical energy from the grid to the EV in an effective and reliable way. Every aspect of E-transportation is permeated by the presence of an intelligent hardware platform, which is embedded in the vehicle components, provided with the proper interfaces to address the communication, control and sensing needs. This embedded system controls the power electronics devices, negotiates with the partners in multi-agent scenarios, and performs fundamental tasks such as power flow control and battery management. The aim of this paper is to give an overview of the open challenges in E-transportation and to show the fundamental role played by embedded systems. The conclusion is that transportation electrification cannot fully be realized without the inclusion of the recent advancements in embedded systems

System-level design and RF front-end implementation for a 3-10ghz multiband-ofdm ultrawideband receiver and built-in testing techniques for analog and rf integrated circuits

This work consists of two main parts: a) Design of a 3-10GHz UltraWideBand (UWB) Receiver and b) Built-In Testing Techniques (BIT) for Analog and RF circuits. The MultiBand OFDM (MB-OFDM) proposal for UWB communications has received significant attention for the implementation of very high data rate (up to 480Mb/s) wireless devices. A wideband LNA with a tunable notch filter, a downconversion quadrature mixer, and the overall radio system-level design are proposed for an 11-band 3.4-10.3GHz direct conversion receiver for MB-OFDM UWB implemented in a 0.25mm BiCMOS process. The packaged IC includes an RF front-end with interference rejection at 5.25GHz, a frequency synthesizer generating 11 carrier tones in quadrature with fast hopping, and a linear phase baseband section with 42dB of gain programmability. The receiver IC mounted on a FR-4 substrate provides a maximum gain of 67-78dB and NF of 5-10dB across all bands while consuming 114mA from a 2.5V supply. Two BIT techniques for analog and RF circuits are developed. The goal is to reduce the test cost by reducing the use of analog instrumentation. An integrated frequency response characterization system with a digital interface is proposed to test the magnitude and phase responses at different nodes of an analog circuit. A complete prototype in CMOS 0.35mm technology employs only 0.3mm2 of area. Its operation is demonstrated by performing frequency response measurements in a range of 1 to 130MHz on 2 analog filters integrated on the same chip. A very compact CMOS RF RMS Detector and a methodology for its use in the built-in measurement of the gain and 1dB compression point of RF circuits are proposed to address the problem of on-chip testing at RF frequencies. The proposed device generates a DC voltage proportional to the RMS voltage amplitude of an RF signal. A design in CMOS 0.35mm technology presents and input capacitance <15fF and occupies and area of 0.03mm2. The application of these two techniques in combination with a loop-back test architecture significantly enhances the testability of a wireless transceiver system

High-speed equalization and transmission in electrical interconnections

The relentless growth of data traffic and increasing digital signal processing capabilities of integrated circuits (IC) are demanding ever faster chip-to-chip / chip-to-module serial electrical interconnects. As data rates increase, the signal quality after transmission over printed circuit board (PCB) interconnections is severely impaired. Frequency-dependent loss and crosstalk noise lead to a reduced eye opening, a reduced signal-to-noise ratio and an increased inter-symbol interference (ISI). This, in turn, requires the use of improved signal processing or PCB materials, in order to overcome the bandwidth (BW) limitations and to improve signal integrity. By applying an optimal combination of equalizer and receiver electronics together with BW-efficient modulation schemes, the transmission rate over serial electrical interconnections can be pushed further. At the start of this research, most industrial backplane connectors, meeting the IEEE and OIF specifications such as manufactured by e.g. FCI or TE connectivity, had operational capabilities of up to 25 Gb/s. This research was mainly performed under the IWT ShortTrack project. The goal of this research was to increase the transmission speed over electrical backplanes up to 100 Gb/s per channel for next-generation telecom systems and data centers. This requirement greatly surpassed the state-ofthe-art reported in previous publications, considering e.g. 25 Gb/s duobinary and 42.8 Gb/s PAM-4 transmission over a low-loss Megtron 6 electrical backplane using off-line processing. The successful implementation of the integrated transmitter (TX) and receiver (RX) (1) , clearly shows the feasibility of single lane interconnections beyond 80 Gb/s and opens the potential of realizing industrial 100 Gb/s links using a recent IC technology process. Besides the advancement of the state-of-the-art in the field of high-speed transceivers and backplane transmission systems, which led to several academic publications, the output of this work also attracts a lot of attention from the industry, showing the potential to commercialize the developed chipset and technologies used in this research for various applications: not only in high-speed electrical transmission links, but also in high-speed opto-electronic communications such as access, active optical cables and optical backplanes. In this dissertation, the background of this research, an overview of this work and the thesis organization are illustrated in Chapter 1. In Chapter 2, a system level analysis is presented, showing that the channel losses are limiting the transmission speed over backplanes. In order to enhance the serial data rate over backplanes and to eliminate the signal degradation, several technologies are discussed, such as signal equalization and modulation techniques. First, a prototype backplane channel, from project partner FCI, implemented with improved backplane connectors is characterized. Second, an integrated transversal filter as a feed-forward equalizer (FFE) is selected to perform the signal equalization, based on a comprehensive consideration of the backplane channel performance, equalization capabilities, implementation complexity and overall power consumption. NRZ, duobinary and PAM-4 are the three most common modulation schemes for ultra-high speed electrical backplane communication. After a system-level simulation and comparison, the duobinary format is selected due to its high BW efficiency and reasonable circuit complexity. Last, different IC technology processes are compared and the ST microelectronics BiCMOS9MW process (featuring a fT value of over 200 GHz) is selected, based on a trade-off between speed and chip cost. Meanwhile it also has a benefit for providing an integrated microstrip model, which is utilized for the delay elements of the FFE. Chapter 3 illustrates the chip design of the high-speed backplane TX, consisting of a multiplexer (MUX) and a 5-tap FFE. The 4:1 MUX combines four lower rate streams into a high-speed differential NRZ signal up to 100 Gb/s as the FFE input. The 5-tap FFE is implemented with a novel topology for improved testability, such that the FFE performance can be individually characterized, in both frequency- and time-domain, which also helps to perform the coefficient optimization of the FFE. Different configurations for the gain cell in the FFE are compared. The gilbert configuration shows most advantages, in both a good high-frequency performance and an easy way to implement positive / negative amplification. The total chip, including the MUX and the FFE, consumes 750mW from a 2.5V supply and occupies an area of 4.4mm × 1.4 mm. In Chapter 4, the TX chip is demonstrated up to 84 Gb/s. First, the FFE performance is characterized in the frequency domain, showing that the FFE is able to work up to 84 Gb/s using duobinary formats. Second, the combination of the MUX and the FFE is tested. The equalized TX outputs are captured after different channels, for both NRZ and duobinary signaling at speeds from 64 Gb/s to 84 Gb/s. Then, by applying the duobinary RX 2, a serial electrical transmission link is demonstrated across a pair of 10 cm coax cables and across a 5 cm FX-2 differential stripline. The 5-tap FFE compensates a total loss between the TX and the RX chips of about 13.5 dB at the Nyquist frequency, while the RX receives the equalized signal and decodes the duobinary signal to 4 quarter rate NRZ streams. This shows a chip-to-chip data link with a bit error rate (BER) lower than 10−11. Last, the electrical data transmission between the TX and the RX over two commercial backplanes is demonstrated. An error-free, serial duobinary transmission across a commercial Megtron 6, 11.5 inch backplane is demonstrated at 48 Gb/s, which indicates that duobinary outperforms NRZ for attaining higher speed or longer reach backplane applications. Later on, using an ExaMAX® backplane demonstrator, duobinary transmission performance is verified and the maximum allowed channel loss at 40 Gb/s transmission is explored. The eye diagram and BER measurements over a backplane channel up to 26.25 inch are performed. The results show that at 40 Gb/s, a total channel loss up to 37 dB at the Nyquist frequency allows for error-free duobinary transmission, while a total channel loss of 42 dB was overcome with a BER below 10−8. An overview of the conclusions is summarized in Chapter 5, along with some suggestions for further research in this field. (1) The duobinary receiver was developed by my colleague Timothy De Keulenaer, as described in his PhD dissertation. (2) Described in the PhD dissertation of Timothy De Keulenaer