High-Performance Silicon Photonic Single-Sideband Modulators for Cold Atom Interferometry

The most complicated and challenging system within a light-pulse atom interferometer (LPAI) is the laser system, which controls the frequencies and intensities of multiple laser beams over time to configure quantum gravity and inertial sensors. The main function of an LPAI laser system is to perform cold-atom generation and state-selective detection and to generate coherent two-photon process for the light-pulse sequence. Substantial miniaturization and ruggedization of the laser system can be achieved by bringing together most key functions of the laser and optical system onto a photonic integrated circuit (PIC). Here we demonstrate a high-performance silicon photonic carrier-suppressed single-sideband (CS-SSB) modulator PIC with dual-parallel Mach-Zehnder modulators (DP-MZMs) operating near 1560 nm, which can dynamically shift the frequency of the light for the desired function within the LPAI. Independent RF control of channels in SSB modulator enables the extensive study of imbalances in both the optical and RF phases and amplitudes to simultaneously reach 30 dB carrier suppression and unprecedented 47.8 dB sideband suppression with peak conversion efficiency of -6.846 dB (20.7 %). Using a silicon photonic SSB modulator with time-multiplexed frequency shifting in an LPAI laser system, we demonstrate cold-atom generation, state-selective detection, and the realization of atom interferometer fringes to estimate gravitational acceleration, $g \approx 9.77 \pm 0.01 \,\rm{m/s^2}$, in a Rubidium ($^{87}$Rb) atom system.Comment: 18 pages, 9 figure

Fifth-order Polynomial Predistortion for Mach-Zehnder Modulator Linearization

Modern wireless applications require access to ultra-wide instantaneous RF bandwidths to provide frequency agility and multi-band RF processing. Wireless communications, radar and electronic warfare are examples of applications that will benefit from wideband multi-function transceivers. The role of the front-end filtering is critical in order for the multi-function transceiver to achieve adequate RF performance. Integrated electric filters are unable to achieve the required frequency selectivity and tuning range mainly due to low Q of on-chip inductors. This renders a complete integrated solution impractical. Normally, high frequency and high selectivity filters are achieved with off-chip bulky SAW filters. The limitation of electrical filters has motivated the employment of RF photonic receivers. The main issue with photonics is the cost but in recent times the emergence of silicon photonics has enabled the potential of RF photonics receivers to be implemented at a low cost. The use of photonics gives access to devices that can achieve really high Q and high integration at high frequencies. At the heart of the photonic receiver is the Mach-Zehnder modulator (MZM). It modulates the received signal from the antenna to the optical carrier. The major issue with the MZM is: it is non-linear and wideband. The MZM is placed before the photonic filter and right after the antennae so interferers received with the desired RF signal generate intermodulation products at the output of the MZM. The intermodulation products can be very close to the desired RF signal so they cannot be filtered out by the photonic filter and may corrupt the desired RF signal. To curtail the effects of the MZM non-linearity, linearization schemes are implemented to reduce the amplitude of the intermodulation products generated when the MZM receives interferers. This thesis work focuses on two main issues, Firstly, analysis of the intermodulation products generated by the MZM when a two tone RF signal is applied. Secondly, a literature review is done to examine the existing linearization schemes. Based on the predistortion linearization scheme, a new fifth-order predistortion is proposed. The proposed fifth-order predistortion is fabricated in GP 65nm TSMC CMOS process. The proposed fifth-order linearization achieves high IM3 suppression~ 20dB at high modulation index ~49.7% with 49.2mW of power consumed

Ultra-high-linearity integrated lithium niobate electro-optic modulators

Integrated lithium niobate (LN) photonics is a promising platform for future chip-scale microwave photonics systems owing to its unique electro-optic properties, low optical loss and excellent scalability. A key enabler for such systems is a highly linear electro-optic modulator that could faithfully covert analog electrical signals into optical signals. In this work, we demonstrate a monolithic integrated LN modulator with an ultrahigh spurious-free dynamic range (SFDR) of 120.04 dB Hz4/5 at 1 GHz, using a ring-assisted Mach-Zehnder interferometer configuration. The excellent synergy between the intrinsically linear electro-optic response of LN and an optimized linearization strategy allows us to fully suppress the cubic terms of third-order intermodulation distortions (IMD3) without active feedback controls, leading to ~ 20 dB improvement over previous results in the thin-film LN platform. Our ultra-high-linearity LN modulators could become a core building block for future large-scale functional microwave photonic integrated circuits, by further integration with other high-performance components like low-loss delay lines, tunable filters and phase shifters available on the LN platform

Silicon Photonic Platforms and Systems for High-speed Communications

Data communication is a critical component of modern technology in our society. There is an increasing reliance on information being at our fingers tips and we expect a low-latency, high-bandwidth connection to deliver entertainment or enhanced productivity. In order to serve this demand, communications devices are being pressed for smaller form factors, higher data throughput, lower power consumption and lower cost. Similar demands exist in a number of applications including metro/long-haul telecommunications, shorter datacenter links and supercomputing. Silicon photonics promises to be a technology that will solve some of the difficulties with improving communication devices. Building photonics in silicon allows for reuse of the same fabrication technology that is used by the CMOS electronics industry, potentially allowing for large volumes, high yields and low costs. Part I of this thesis details the design of components needed in a high-speed silicon photonic platform to meet the current challenges for high-speed communications. The author’s work in modeling photodetectors resulted in improving photodetector bandwidth from 30 GHz to 67 GHz, the fastest reported at the time of publication. Details regarding the optimization and test of modulators are also presented with the first-reported 50 Gbps modulator at 1310-nm. A large scale parallel channel demonstration of high-speed silicon photonics is then presented showing the potential scalability for silicon photonics systems. A full transceiver requires a number of components other than the photodetector and modulator that are the core active pieces of a silicon photonics platform. Part II includes work on the design and test of silicon photonic components providing functionality beyond the photodetector and modulator. A novel design integrating Metal-Semiconductor Field Effect Transistors (MESFETs) into a silicon photonics platform without process change is shown. This integration enables enhanced control functionality with minimal overhead. The critical final piece for a silicon photonics platform, adding a light source, is demonstrated along with performance results of the resulting tunable, extended C-band laser. In Part III, previous work on an enhanced silicon photonics platform with complementary components is used to build a high-speed integrated coherent link and then tested with a silicon photonics-based tunable laser. The transceiver was shown to operate at 34 Gbaud dual-polarization 16-QAM for a total of 272 Gbps over a single channel. This was the first published demonstration of an integrated coherent where all of the optics were built in a silicon photonics platform

Integrated Microwave Photonic Processors using Waveguide Mesh Cores

Integrated microwave photonics changes the scaling laws of information and communication systems offering architectural choices that combine photonics with electronics to optimize performance, power, footprint and cost. Application Specific Photonic Integrated Circuits, where particular circuits/chips are designed to optimally perform particular functionalities, require a considerable number of design and fabrication iterations leading to long-development times and costly implementations. A different approach inspired by electronic Field Programmable Gate Arrays is the programmable Microwave Photonic processor, where a common hardware implemented by the combination of microwave, photonic and electronic subsystems, realizes different functionalities through programming. Here, we propose the first-ever generic-purpose Microwave Photonic processor concept and architecture. This versatile processor requires a powerful end-to-end field-based analytical model to optimally configure all their subsystems as well as to evaluate their performance in terms of the radiofrequency gain, noise and dynamic range. Therefore, we develop a generic model for integrated Microwave Photonics systems. The key element of the processor is the reconfigurable optical core. It requires high flexibility and versatility to enable reconfigurable interconnections between subsystems as well as the synthesis of photonic integrated circuits. For this element, we focus on a 2-dimensional photonic waveguide mesh based on the interconnection of tunable couplers. Within the framework of this Thesis, we have proposed two novel interconnection schemes, aiming for a mesh design with a high level of versatility. Focusing on the hexagonal waveguide mesh, we explore the synthesis of a high variety of photonic integrated circuits and particular Microwave Photonics applications that can potentially be performed on a single hardware. In addition, we report the first-ever demonstration of such reconfigurable waveguide mesh in silicon. We demonstrate a world-record number of functionalities on a single photonic integrated circuit enabling over 30 different functionalities from the 100 that could be potentially obtained with a simple seven hexagonal cell structure. The resulting device can be applied to different fields including communications, chemical and biomedical sensing, signal processing, multiprocessor networks as well as quantum information systems. Our work is an important step towards this paradigm and sets the base for a new era of generic-purpose photonic integrated systems.Los dispositivos integrados de fotónica de microondas ofrecen soluciones optimizadas para los sistemas de información y comunicación. Generalmente, están compuestos por diferentes arquitecturas en las que subsistemas ópticos y electrónicos se integran para optimizar las prestaciones, el consumo, el tamaño y el coste del dispositivo final. Hasta ahora, los circuitos/chips de propósito específico se han diseñado para proporcionar una funcionalidad concreta, requiriendo así un número considerable de iteraciones entre las etapas de diseño, fabricación y medida, que origina tiempos de desarrollo largos y costes demasiado elevados. Una alternativa, inspirada por las FPGA (del inglés Field Programmable Gate Array), es el procesador fotónico programable. Este dispositivo combina la integración de subsistemas de microondas, ópticos y electrónicos para realizar, mediante la programación de los mismos y sus interconexiones, diferentes funcionalidades. En este trabajo, proponemos por primera vez el concepto del procesador de propósito general, así como su arquitectura. Además, con el fin de diseñar, optimizar y evaluar las prestaciones básicas del dispositivo, hemos desarrollado un modelo analítico extremo a extremo basado en las componentes del campo electromagnético. El modelo desarrollado proporciona como resultado la ganancia, el ruido y el rango dinámico global para distintas configuraciones de modulación y detección, en función de los subsistemas y su configuración. El elemento principal del procesador es su núcleo óptico reconfigurable. Éste requiere un alto grado de flexibilidad y versatilidad para reconfigurar las interconexiones entre los distintos subsistemas y para sintetizar los circuitos para el procesado óptico. Para este subsistema, proponemos el diseño de guías de onda reconfigurables para la creación de mallados bidimensionales. En el marco de esta tesis, hemos propuesto dos nuevos nodos de interconexión óptica para mallas reconfigurables, con el objetivo de obtener un mayor grado de versatilidad. Una vez escogida la malla hexagonal para el núcleo del procesador, hemos analizado la configuración de un gran número de circuitos fotónicos integrados y de funcionalidades de fotónica de microondas. El trabajo se ha completado con la demonstración de la primera malla reconfigurable integrada en un chip de silicio, demostrando además la síntesis de 30 de las 100 funcionalidades que potencialmente se pueden obtener con la malla diseñada compuesta de 7 celdas hexagonales. Este hecho supone un record frente a los sistemas de propósito específico. El sistema puede aplicarse en diferentes campos como las comunicaciones, los sensores químicos y biomédicos, el procesado de señales, la gestión y procesamiento de redes y los sistemas de información cuánticos. El conjunto del trabajo realizado representa un paso importante en la evolución de este paradigma, y sienta las bases para una nueva era de dispositivos fotónicos de propósito general.Els dispositius integrats de Fotònica de Microones oferixen solucions optimitzades per als sistemes d'informació i comunicació. Generalment, estan compostos per diferents arquitectures en què subsistemes òptics i electrònics s'integren per a optimitzar les prestacions, el consum, la grandària i el cost del dispositiu final. Fins ara, els circuits/xips de propòsit específic s'han dissenyat per a proporcionar una funcionalitat concreta, requerint així un nombre considerable d'iteracions entre les etapes de disseny, fabricació i mesura, que origina temps de desenrotllament llargs i costos massa elevats. Una alternativa, inspirada per les FPGA (de l'anglés Field Programmable Gate Array), és el processador fotònic programable. Este dispositiu combina la integració de subsistemes de microones, òptics i electrònics per a realitzar, per mitjà de la programació dels mateixos i les seues interconnexions, diferents funcionalitats. En este treball proposem per primera vegada el concepte del processador de propòsit general, així com la seua arquitectura. A més, a fi de dissenyar, optimitzar i avaluar les prestacions bàsiques del dispositiu, hem desenrotllat un model analític extrem a extrem basat en els components del camp electromagnètic. El model desenrotllat proporciona com resultat el guany, el soroll i el rang dinàmic global per a distintes configuracions de modulació i detecció, en funció dels subsistemes i la seua configuració. L'element principal del processador és el seu nucli òptic reconfigurable. Este requerix un alt grau de flexibilitat i versatilitat per a reconfigurar les interconnexions entre els distints subsistemes i per a sintetitzar els circuits per al processat òptic. Per a este subsistema, proposem el disseny de guies d'onda reconfigurables per a la creació de mallats bidimensionals. En el marc d'esta tesi, hem proposat dos nous nodes d'interconnexió òptica per a malles reconfigurables, amb l'objectiu d'obtindre un major grau de versatilitat. Una vegada triada la malla hexagonal per al nucli del processador, hem analitzat la configuració d'un gran nombre de circuits fotónicos integrats i de funcionalitats de fotónica de microones. El treball s'ha completat amb la demostració de la primera malla reconfigurable integrada en un xip de silici, demostrant a més la síntesi de 30 de les 100 funcionalitats que potencialment es poden obtindre amb la malla dissenyada composta de 7 cèl·lules hexagonals. Este fet suposa un rècord enfront dels sistemes de propòsit específic. El sistema pot aplicarse en diferents camps com les comunicacions, els sensors químics i biomèdics, el processat de senyals, la gestió i processament de xarxes i els sistemes d'informació quàntics. El conjunt del treball realitzat representa un pas important en l'evolució d'este paradigma, i assenta les bases per a una nova era de dispositius fotónicos de propòsit general.Pérez López, D. (2017). Integrated Microwave Photonic Processors using Waveguide Mesh Cores [Tesis doctoral no publicada]. Universitat Politècnica de València. https://doi.org/10.4995/Thesis/10251/91232TESI

Adaptive High Linearity Intensity Modulator for Advanced Microwave Photonic Links

This chapter, first, presents the motivation behind the need for adaptive, highly linear electro-optic modulators and an overview of the different optical linearization approaches of electro-optic modulators. Then, the figures of merits in terms of linearity performance are described and analyzed. Next, the chapter focuses on one excellent linearization approach called interferometric modulator with phase-modulating and cavity-modulating components (IMPACC). Here, we model IMPACC by simulating each of the key building blocks separately before putting them together as IMPACC modulator. This adaptive IMPACC design is compared to typical Mach-Zehnder interferometer (MZI) based modulators, and ring-assisted Mach-Zenhder interferometer (RAMZI) modulators. Theoretical analysis and results show that the IMPACC provides both superior linearity performance and unique adaptive feature that can be used to compensate for manufacturing tolerances, thus, providing extra flexibility in terms of device manufacturability as well as system integration

Design of a Multipurpose Photonic Chip Architecture for THz Dual-Comb Spectrometers

This article belongs to the Special Issue Terahertz Sensing and Imaging Technologies.In this work, we present a multipurpose photonic integrated circuit capable of generating multiheterodyne complex Dual-Combs (DC) THz signals. Our work focuses on translating the functionality of an electro-optic tunable DC system into a photonic chip employing standard building blocks to ensure the scalability and cost efficiency of the integrated device. The architecture we analyze for integration is based on three stages: a seed comb, a mode selection stage and a DC stage. This final DC stage includes a frequency shifter, a key element to improve the final detection of the THz signals and obtain real-time operation. This investigation covers three key aspects: (1) a solution for comb line selection on GHz spaced combs using OIL or OPLL on photonic chips is studied and evaluated, (2) a simple and versatile scheme to produce a frequency shift using the double sideband suppressed carrier modulation technique and an asymmetric Mach Zehnder Interferometer to filter one of the sidebands is proposed, and (3) a multipurpose architecture that can offer a versatile effective device, moving from application-specific PICs to general-purpose PICs. Using the building blocks (BBs) available from an InP-based foundry, we obtained simulations that offer a high-quality Dual-Comb frequency shifted signal with a side mode suppression ratio around 21 dB, and 41 dB after photodetection with an intermediate frequency of 1 MHz. We tested our system to generate a Dual-Comb with 10 kHz of frequency spacing and an OOK modulation with 5 Gbps which can be down-converted to the THz range by a square law detector. It is also important to note that the presented architecture is multipurpose and can also be applied to THz communications. This design is a step to enable a commercial THz photonic chip for multiple applications such as THz spectroscopy, THz multispectral imaging and THz telecommunications and offers the possibility of being fabricated in a multi-project wafer.This research was supported by Instituto Tecnológico Metropolitano, Universidad Carlos III de Madrid, the EU H2020 Celta project under Grant Agreement 675683, by the Spanish Ministry of Economy and Competitiveness under Project TEC2017-86271-R and by the ATTRACT project funded by the EC under Grant Agreement 777222

Aspectos de interconectividade dos moduladores de polímero

Orientador: Hugo Enrique Hernández-FigueroaTese (doutorado) - Universidade Estadual de Campinas, Faculdade de Engenharia Elétrica e de ComputaçãoResumo: As interconexões ópticas e elétricas são de grande interese na area de encapsulamento de circuitos integrados híbridos fotônicos. Baixas perdas e banda larga são necessárias para o desenvolvimento de novas tecnologías na área. Nesta tese apresentan-se as seguintes contribuições originais: uma metodologia do modelamento de interconexões elétricas em encapsulamento de moduladores de polímero eletro-óptico, um dispositivo óptico compacto de banda larga para interconectar a plataforma de silício sobre isolante com a plataforma de filmes finos de polímero sobre silícioAbstract: Electrical and optical interconnects are of great interest for photonic integrated circuits with hybrid platforms. Low loss and wide band are essential for the development of new technologies in this area. In this thesis, we present the following original contributions: a methodology for modeling electrical ceramic interconnects inside an electrooptic polymer packaging, and a compact low-loss optical interconnect for the silicon-on-insulator platform to the thin-film polymer on silicon platformDoutoradoTelecomunicações e TelemáticaDoutor em Engenharia Elétrica07/2014-36CAPE

Silicon photonic modulators for PAM transmissions

High-speed optical interconnects are crucial for both data centers and high performance computing systems. High power consumption and limited device bandwidth have hindered the move to higher optical transmission speeds. Integrated optical transceivers in silicon photonics (SiP) using pulse-amplitude modulation (PAM) are a promising solution to increase data rates. In this paper, we review recent progress in SiP for PAM transmissions. We focus on materials and technologies available CMOS-compatible photonics processes. Performance metrics of SiP modulators and crucial considerations for high-speed PAM transmissions are discussed. Various driving strategies to achieve optical PAM signals are presented. Some of the state-of-the-art SiP PAM modulators and integrated transmitters are reviewed