Digitally Assisted ADCS.

This work involves the development of digital calibration techniques for Analogto- Digital Converters. According to the 2001 International Technology Roadmap for Semiconductors, improved ADC technology is a key factor in the development of present and future applications. The switched-capacitor (SC) pipeline technique is the most popular method of implementing moderate resolution ADCs. However the advantages of CMOS, which originally made SC circuits feasible, are being eroding by process scaling. Good switches and opamps are becoming increasingly difficult to design and the growing gate leakage of deep submicron MOSFETs is causing difficulty. Traditional ADC schemes do not work well with supply voltages of 1.8V and below. Furthermore, the performance required by present and future wireless and IT applications will not be met by the present day ADC circuits techniques. Bearing in mind the challenges associated with deep sub-micron analog circuitry a new calibration technique for folding ADCs has been developed. Since digital circuitry scales well, this calibration relies heavily on digital techniques. Hence it reduces the amount of analog design involved. As this folding ADC is dominated, in terms of both functionality and power, by digital circuitry, the performance of folding will improve when implemented in smaller geometry processes. An 8-bit, 500MS/s, digitally calibrated folding ADC was designed in TSMC 0.18mm. A second prototype, 9-bit 400MS/s, was designed in ST 90nm. This ADC uses novel folders to reduce thermal noise. The major accomplishments of this work are: · The creation of a new folding ADC architecture that is digitally dominated allowing large transistor mismatch to be tolerated so that small devices can be utilized in the signal path. · The development of modeling techniques, to investigate and analyze the effects of transistor mismatch, folder linearity and redundancy in ADCs. · The design of a new folder circuit topology that decreases the required power consumption for a given noise budget. · The design of a resistor ladder DAC that uses a unique resistor layout to allow any shape ladder to be designed.Ph.D.Electrical EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttp://deepblue.lib.umich.edu/bitstream/2027.42/58426/1/ibogue_1.pd

High-Speed Analog-to-Digital Converters for Broadband Applications

Flash Analog-to-Digital Converters (ADCs), targeting optical communication standards, have been reported in SiGe BiCMOS technology. CMOS implementation of such designs faces two challenges. The first is to achieve a high sampling speed, given the lower gain-bandwidth (lower ft) of CMOS technology. The second challenge is to handle the wide bandwidth of the input signal with a certain accuracy. Although the first problem can be relaxed by using the time-interleaved architecture, the second problem remains as a main obstacle to CMOS implementation. As a result, the feasibility of the CMOS implementation of ADCs for such applications, or other wide band applications, depends primarily on achieving a very small input capacitance (large bandwidth) at the desired accuracy. In the flash architecture, the input capacitance is traded off for the achievable accuracy. This tradeoff becomes tighter with technology scaling. An effective way to ease this tradeoff is to use resistive offset averaging. This permits the use of smaller area transistors, leading to a reduction in the ADC input capacitance. In addition, interpolation can be used to decrease the input capacitance of flash ADCs. In an interpolating architecture, the number of ADC input preamplifiers is reduced significantly, and a resistor network interpolates the missing zero-crossings needed for an N-bit conversion. The resistive network also averages out the preamplifiers offsets. Consequently, an interpolating network works also as an averaging network. The resistor network used for averaging or interpolation causes a systematic non-linearity at the ADC transfer characteristics edges. The common solution to this problem is to extend the preamplifiers array beyond the input signal voltage range by using dummy preamplifiers. However, this demands a corresponding extension of the flash ADC reference-voltage resistor ladder. Since the voltage headroom of the reference ladder is considered to be a main bottleneck in the implementation of flash ADCs in deep-submicron technologies with reduced supply voltage, extending the reference voltage beyond the input voltage range is highly undesirable. The principal objective of this thesis is to develop a new circuit technique to enhance the bandwidth-accuracy product of flash ADCs. Thus, first, a rigorous analysis of flash ADC architectures accuracy-bandwidth tradeoff is presented. It is demonstrated that the interpolating architecture achieves a superior accuracy compared to that of a full flash architecture for the same input capacitance, and hence would lead to a higher bandwidth-accuracy product, especially in deep-submicron technologies that use low power supplies. Also, the gain obtained, when interpolation is employed, is quantified. In addition, the limitations of a previous claim, which suggests that an interpolating architecture is equivalent to an averaging full flash architecture that trades off accuracy for the input capacitance, is presented. Secondly, a termination technique for the averaging/interpolation network of flash ADC preamplifiers is devised. The proposed technique maintains the linearity of the ADC at the transfer characteristics edges and cancels out the over-range voltage, consumed by the dummy preamplifiers. This makes flash ADCs more amenable for integration in deep-submicron CMOS technologies. In addition, the elimination of this over-range voltage allows a larger least-significant bit. As a result, a higher input referred offset is tolerated, and a significant reductions in the ADC input capacitance and power dissipation are achieved at the same accuracy. Unlike a previous solution, the proposed technique does not introduce negative transconductance at flash ADC preamplifiers array edges. As a result, the offset averaging technique can be used efficiently. To prove the resulting saving in the ADC input capacitance and power dissipation that is attained by the proposed termination technique, a 6-bit 1.6-GS/s flash ADC test chip is designed and implemented in 0.13-$\mu$m CMOS technology. The ADC consumes 180 mW from a 1.5-V supply and achieves a Signal-to-Noise-plus-Distortion Ratio (SNDR) of 34.5 dB and 30 dB at 50-MHz and 1450-MHz input signal frequency, respectively. The measured peak Integral-Non-Linearity (INL) and Differential-Non-Linearity (DNL) are 0.42 LSB and 0.49 LSB, respectively

Design of Power/Analog/Digital Systems Through Mixed-Level Simulations

In recent years the development of the applications in the field of telecommunications, data processing, control, renewable energy generation, consumer and automotive electronics determined the need for increasingly complex systems, also in shorter time to meet the growing market demand. The increasing complexity is mainly due to the mixed nature of these systems that must be developed to accommodate the new functionalities and to satisfy the more stringent performance requirements of the emerging applications. This means a more complex design and verification process. The key to managing the increased design complexity is a structured and integrated design methodology which allows the sharing of different circuit implementations that can be at transistor level and/or at a higher level (i.e.HDL languages).In order to expedite the mixed systems design process it is necessary to provide: an integrated design methodology; a suitable supporting tool able to manage the entire design process and design complexity and its successive verification.It is essential that the different system blocks (power, analog, digital), described at different level of abstraction, can be co-simulated in the same design context. This capability is referred to as mixed-level simulation.One of the objectives of this research is to design a mixed system application referred to the control of a coupled step-up dc-dc converter. This latter consists of a power stage designed at transistor-level, also including accurate power device models, and the analog controller implemented using VerilogA modules. Digital controllers are becoming very attractive in dc-dc converters for their programmability, ability to implement sophisticated control schemes, and ease of integration with other digital systems. Thus, in this dissertation it will be presented a detailed design of a Flash Analog-to-Digital Converter (ADC). The designed ADC provides medium-high resolution associated to high-speed performance. This makes it useful not only for the control application aforementioned but also for applications with huge requirements in terms of speed and signal bandwidth. The entire design flow of the overall system has been conducted in the Cadence Design Environment that also provides the ability to mixed-level simulations. Furthermore, the technology process used for the ADC design is the IHP BiCMOS 0.25 µm by using 50 GHz NPN HBT devices

Design and debugging of multi-step analog to digital converters

With the fast advancement of CMOS fabrication technology, more and more signal-processing functions are implemented in the digital domain for a lower cost, lower power consumption, higher yield, and higher re-configurability. The trend of increasing integration level for integrated circuits has forced the A/D converter interface to reside on the same silicon in complex mixed-signal ICs containing mostly digital blocks for DSP and control. However, specifications of the converters in various applications emphasize high dynamic range and low spurious spectral performance. It is nontrivial to achieve this level of linearity in a monolithic environment where post-fabrication component trimming or calibration is cumbersome to implement for certain applications or/and for cost and manufacturability reasons. Additionally, as CMOS integrated circuits are accomplishing unprecedented integration levels, potential problems associated with device scaling – the short-channel effects – are also looming large as technology strides into the deep-submicron regime. The A/D conversion process involves sampling the applied analog input signal and quantizing it to its digital representation by comparing it to reference voltages before further signal processing in subsequent digital systems. Depending on how these functions are combined, different A/D converter architectures can be implemented with different requirements on each function. Practical realizations show the trend that to a first order, converter power is directly proportional to sampling rate. However, power dissipation required becomes nonlinear as the speed capabilities of a process technology are pushed to the limit. Pipeline and two-step/multi-step converters tend to be the most efficient at achieving a given resolution and sampling rate specification. This thesis is in a sense unique work as it covers the whole spectrum of design, test, debugging and calibration of multi-step A/D converters; it incorporates development of circuit techniques and algorithms to enhance the resolution and attainable sample rate of an A/D converter and to enhance testing and debugging potential to detect errors dynamically, to isolate and confine faults, and to recover and compensate for the errors continuously. The power proficiency for high resolution of multi-step converter by combining parallelism and calibration and exploiting low-voltage circuit techniques is demonstrated with a 1.8 V, 12-bit, 80 MS/s, 100 mW analog to-digital converter fabricated in five-metal layers 0.18-µm CMOS process. Lower power supply voltages significantly reduce noise margins and increase variations in process, device and design parameters. Consequently, it is steadily more difficult to control the fabrication process precisely enough to maintain uniformity. Microscopic particles present in the manufacturing environment and slight variations in the parameters of manufacturing steps can all lead to the geometrical and electrical properties of an IC to deviate from those generated at the end of the design process. Those defects can cause various types of malfunctioning, depending on the IC topology and the nature of the defect. To relive the burden placed on IC design and manufacturing originated with ever-increasing costs associated with testing and debugging of complex mixed-signal electronic systems, several circuit techniques and algorithms are developed and incorporated in proposed ATPG, DfT and BIST methodologies. Process variation cannot be solved by improving manufacturing tolerances; variability must be reduced by new device technology or managed by design in order for scaling to continue. Similarly, within-die performance variation also imposes new challenges for test methods. With the use of dedicated sensors, which exploit knowledge of the circuit structure and the specific defect mechanisms, the method described in this thesis facilitates early and fast identification of excessive process parameter variation effects. The expectation-maximization algorithm makes the estimation problem more tractable and also yields good estimates of the parameters for small sample sizes. To allow the test guidance with the information obtained through monitoring process variations implemented adjusted support vector machine classifier simultaneously minimize the empirical classification error and maximize the geometric margin. On a positive note, the use of digital enhancing calibration techniques reduces the need for expensive technologies with special fabrication steps. Indeed, the extra cost of digital processing is normally affordable as the use of submicron mixed signal technologies allows for efficient usage of silicon area even for relatively complex algorithms. Employed adaptive filtering algorithm for error estimation offers the small number of operations per iteration and does not require correlation function calculation nor matrix inversions. The presented foreground calibration algorithm does not need any dedicated test signal and does not require a part of the conversion time. It works continuously and with every signal applied to the A/D converter. The feasibility of the method for on-line and off-line debugging and calibration has been verified by experimental measurements from the silicon prototype fabricated in standard single poly, six metal 0.09-µm CMOS process