Sensor/ROIC Integration using Oxide Bonding


We explore the Ziptronix Direct Bond Interconnect technology for the integration of sensors and readout integrated circuits (ROICs) for high energy physics. The technology utilizes an oxide bond to form a robust mechanical connection between layers which serves to assist with the formation of metallic interlayer connections. We report on testing results of sample sensors bonded to ROICs and thinned to 100 microns.Comment: Talk given at the 2008 International Linear Collider Workshop (LCWS08 and ILC08), Chicago, Illinois, November 16-20, 2008. 4 pages, 1 figur

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