Integration of functional complex oxide nanomaterials on silicon

Abstract

The combination of standard wafer-scale semiconductor processing with the properties of functional oxides opens up to innovative and more efficient devices with high value applications which can be produced at large scale. This review uncovers the main strategies that are successfully used to monolithically integrate functional complex oxide thin films and nanostructures on silicon: the chemical solution deposition approach (CSD) and the advanced physical vapor deposition techniques such as oxide molecular beam epitaxy (MBE). Special emphasis will be placed on complex oxide nanostructures epitaxially grown on silicon using the combination of CSD and MBE. Several examples will be presented, with a particular stress on the control of interfaces and crystallization mechanisms on epitaxial perovskite oxide thin films, nanostructured quartz thin films, and octahedral molecular sieve nanowires. This review enlightens on the potential of complex oxide nanostructures and the combination of both chemical and physical elaboration techniques for novel oxide-based integrated devicesAC acknowledges the financial support from 1D-RENOX project (Cellule Energie INSIS-CNRS). J.M.V.-F. also acknowledges MINECO for support with a Ph.D. grant of the FPI program. We thank David Montero and L. Picas for technical support. We also thank P. Regreny, C. Botella, J.B. Goure for technical assistance on the Nanolyon technological platform. We acknowledge MICINN (MAT2008-01022 MAT2011-28874-c02-01 and MAT2012-35324), Consolider NANOSELECT (CSD2007-00041), Generalitat de Catalunya (2009 SGR 770 and Xarmae), and EU (HIPERCHEM, NMP4-CT2005-516858) projects. The HAADF-STEM microscopy work was conducted at the Center for Nanophase Materials Sciences, which is a DOE Office of Science User Facility. This research was supported by the European Research Council (ERC StG-2DTHERMS), Ministerio de Economía y Competitividad of Spain (MAT2013-44673-R) and EU funding Project “TIPS” Thermally Integrated Smart Photonics Systems Ref: 644453 call H2020-ICT-2014-1S