以氢气泡为动力学模板电沉积获得多孔铜,并通过热处理增强其结构稳定性.进一步将多孔铜作为基底通过电沉积制备Cu-Sn合金负极.Xrd结果给出其组成为Cu6Sn5合金,扫描电子显微镜(SEM)观察到Cu6Sn5合金电极为三维(3d)多孔结构.充放电结果指出,Cu6Sn5合金电极具有较好的充放电性能,其首次放电(嵌锂)和充电(脱锂)容量分别为735和571MAH·g-1,并且具有较好的容量保持率.运用电化学阻抗谱研究了Cu6Sn5合金电极在商业电解液中的界面特性.Porous Cu was fabricated by electrodeposition through a kinetic template of hydrogen bubbles.The product was subsequently annealed to increase its structural stability.The Cu-Sn alloy was then electrodeposited onto porous Cu which served as a current collector.X-ray diffraction (XRD) studies ascertained that the composition of the Cu-Sn alloy was Cu6Sn5 and scanning electron microscopy (SEM) investigations showed a three-dimensional (3D) porous structure of the electrode.The first charge/discharge capacities of the Cu6Sn5 alloy electrode were measured respectively at 735 and 571 mAh·g-1,and a good retention of the capacities has been determined.Interfacial properties of the Cu6Sn5 alloy electrode in a commercial electrolyte were also studied by electrochemical impedance spectroscopy (EIS).国家重点基础研究发展规划(973)项目(2009CB220102)资
