Printable stretchable interconnects

This article presents recent progress and a comprehensive overview of stretchable interconnects based on printable nanocomposites. Nanocomposite-based inks for printed stretchable interconnects have been categorized according to dispersed filler materials. They comprise of carbon-based fillers and metal-based fillers. Benefits in terms of excellent electrical performance and elastic properties make nanocomposites the ideal candidates for stretchable interconnect applications. Deeper analysis of nanocomposites-based stretchable interconnects includes the correlation between the size of fillers, percolation ratio, maximum electrical conductivity and mechanical elasticity. The key trends in the field have been highlighted using curve fitting methods on large data collected from the literature. Furthermore, a wide variety of applications for stretchable interconnects are presented

Stretchable electronics for artificial skin

Postprint (published version

Flexible and stretchable circuit technologies for space applications

Flexible and stretchable circuit technologies offer reduced volume and weight, increased electrical performance, larger design freedom and improved interconnect reliability. All of these advantages are appealing for space applications. In this paper, two example technologies, the ultra-thin chip package (UTCP) and stretchable moulded interconnect (SMI), are described. The UTCP technology results in a 60 µm thick chip package, including the embedding of a 20 µm thick chip, laser or protolithic via definition to the chip contacts and application of fan out metallization. Imec’s stretchable interconnect technology is inspired by conventional rigid and flexible printed circuit board (PCB) technology. Stretchable interconnects are realized by copper meanders supported by a flexible material e.g. polyimide. Elastic materials, predominantly silicone rubbers, are used to embed the conductors and the components, thus serving as circuit carrier. The possible advantages of these technologies with respect to space applications are discussed

Stretch de-spin mechanism Patent

Stretch Yo-Yo mechanism for reducing initial spin rate of space vehicl

Ultra-Stretchable Interconnects for High-Density Stretchable Electronics

The exciting field of stretchable electronics (SE) promises numerous novel applications, particularly in-body and medical diagnostics devices. However, future advanced SE miniature devices will require high-density, extremely stretchable interconnects with micron-scale footprints, which calls for proven standardized (complementary metal-oxide semiconductor (CMOS)-type) process recipes using bulk integrated circuit (IC) microfabrication tools and fine-pitch photolithography patterning. Here, we address this combined challenge of microfabrication with extreme stretchability for high-density SE devices by introducing CMOS-enabled, free-standing, miniaturized interconnect structures that fully exploit their 3D kinematic freedom through an interplay of buckling, torsion, and bending to maximize stretchability. Integration with standard CMOS-type batch processing is assured by utilizing the Flex-to-Rigid (F2R) post-processing technology to make the back-end-of-line interconnect structures free-standing, thus enabling the routine microfabrication of highly-stretchable interconnects. The performance and reproducibility of these free-standing structures is promising: an elastic stretch beyond 2000% and ultimate (plastic) stretch beyond 3000%, with 10 million cycles at 1000% stretch with <1% resistance change. This generic technology provides a new route to exciting highly-stretchable miniature devices.Comment: 13 pages, 5 figure, journal publicatio

3D Stretchable Arch Ribbon Array Fabricated via Grayscale Lithography.

Microstructures with flexible and stretchable properties display tremendous potential applications including integrated systems, wearable devices and bio-sensor electronics. Hence, it is essential to develop an effective method for fabricating curvilinear and flexural microstructures. Despite significant advances in 2D stretchable inorganic structures, large scale fabrication of unique 3D microstructures at a low cost remains challenging. Here, we demonstrate that the 3D microstructures can be achieved by grayscale lithography to produce a curved photoresist (PR) template, where the PR acts as sacrificial layer to form wavelike arched structures. Using plasma-enhanced chemical vapor deposition (PECVD) process at low temperature, the curved PR topography can be transferred to the silicon dioxide layer. Subsequently, plasma etching can be used to fabricate the arched stripe arrays. The wavelike silicon dioxide arch microstructure exhibits Young modulus and fracture strength of 52 GPa and 300 MPa, respectively. The model of stress distribution inside the microstructure was also established, which compares well with the experimental results. This approach of fabricating a wavelike arch structure may become a promising route to produce a variety of stretchable sensors, actuators and circuits, thus providing unique opportunities for emerging classes of robust 3D integrated systems

Printing of wirelessly rechargeable solid-state supercapacitors for soft, smart contact lenses with continuous operations

Recent advances in smart contact lenses are essential to the realization of medical applications and vision imaging for augmented reality through wireless communication systems. However, previous research on smart contact lenses has been driven by a wired system or wireless power transfer with temporal and spatial restrictions, which can limit their continuous use and require energy storage devices. Also, the rigidity, heat, and large sizes of conventional batteries are not suitable for the soft, smart contact lens. Here, we describe a human pilot trial of a soft, smart contact lens with a wirelessly rechargeable, solid-state supercapacitor for continuous operation. After printing the supercapacitor, all device components (antenna, rectifier, and light-emitting diode) are fully integrated with stretchable structures for this soft lens without obstructing vision. The good reliability against thermal and electromagnetic radiations and the results of the in vivo tests provide the substantial promise of future smart contact lenses

Fabrication And Thermoelectric Characterization Of Stretchable Conductive Latex-Based Composites

Miniaturized stretchable electronic devices that can be bent and strained elastically without breaking, have drawn considerable research interest in recent years for wearable computers and integrated bio-sensor applications. Portable electrical power harvesting remains a critical challenge in flexible electronics materials. One proposed solution has been to convert waste heat from the human body into electricity using thermoelectric materials. Traditionally, however, these materials are brittle ceramic semiconductors with limited fracture resistance under deformation. The primary objective of this thesis is to address this challenge by fabricating and studying the mechanical, thermal and electrical performance of stretchable composites combining natural latex polymer with either metallic (Ni) or thermoelectric (InSb) powders. Ni-based and InSb-based latex specimens were synthesized with different powder concentrations up to 36 vol.%. The effects of the powder concentration on tensile elongation, electrical conductivity, and thermal conductivity of the composites were measured at ambient temperature. Strong dependences of mechanical and electrical properties on powder concentration were found. By contrast, thermal conductivity was observed to remain low at all concentrations, suggesting that the predominant heat transport process is through the low-conductivity latex matrix rather than the conductive particles. This thesis was conducted with the support of a Vermont Space Grant Consortium graduate research assistantship

Flexible and stretchable electronics for wearable healthcare

Measuring the quality of human health and well-being is one of the key growth areas in our society. Preferably, these measurements are done as unobtrusive as possible. These sensoric devices are then to be integrated directly on the human body as a patch or integrated into garments. This requires the devices to be very thin, flexible and sometimes even stretchable. An overview will be given of recent technology developments in this domain and concrete application examples will be shown