CMOL: Second Life for Silicon?

This report is a brief review of the recent work on architectures for the prospective hybrid CMOS/nanowire/ nanodevice ("CMOL") circuits including digital memories, reconfigurable Boolean-logic circuits, and mixed-signal neuromorphic networks. The basic idea of CMOL circuits is to combine the advantages of CMOS technology (including its flexibility and high fabrication yield) with the extremely high potential density of molecular-scale two-terminal nanodevices. Relatively large critical dimensions of CMOS components and the "bottom-up" approach to nanodevice fabrication may keep CMOL fabrication costs at affordable level. At the same time, the density of active devices in CMOL circuits may be as high as 1012 cm2 and that they may provide an unparalleled information processing performance, up to 1020 operations per cm2 per second, at manageable power consumption.Comment: Submitted on behalf of TIMA Editions (http://irevues.inist.fr/tima-editions

Investigation of Micro Porosity Sintered wick in Vapor Chamber for Fan Less Design

Micro Porosity Sintered wick is made from metal injection molding processes, which provides a wick density with micro scale. It can keep more than 53 % working fluid inside the wick structure, and presents good pumping ability on working fluid transmission by fine infiltrated effect. Capillary pumping ability is the important factor in heat pipe design, and those general applications on wick structure are manufactured with groove type or screen type. Gravity affects capillary of these two types more than a sintered wick structure does, and mass heat transfer through vaporized working fluid determines the thermal performance of a vapor chamber. First of all, high density of porous wick supports high transmission ability of working fluid. The wick porosity is sintered in micro scale, which limits the bubble size while working fluid vaporizing on vapor section. Maximum heat transfer capacity increases dramatically as thermal resistance of wick decreases. This study on permeability design of wick structure is 0.5 - 0.7, especially permeability (R) = 0.5 can have the best performance, and its heat conductivity is 20 times to a heat pipe with diameter (Phi) = 10mm. Test data of this vapor chamber shows thermal performance increases over 33 %.Comment: Submitted on behalf of TIMA Editions (http://irevues.inist.fr/tima-editions

Design, Fabrication and Characterization of a Piezoelectric Microgenerator Including a Power Management Circuit

We report in this paper the design, fabrication and experimental characterization of a piezoelectric MEMS microgenerator. This device scavenges the energy of ambient mechanical vibrations characterized by frequencies in the range of 1 kHz. This component is made with Aluminum Nitride thin film deposited with a CMOS compatible process. Moreover we analyze two possible solutions for the signal rectification: a discrete doubler-rectifier and a full custom power management circuit. The ASIC developed for this application takes advantage of diodes with very low threshold voltage and therefore allows the conversion of extremely low input voltages corresponding to very weak input accelerations. The volume of the proposed generator is inferior to 1mm3 and the generated powers are in the range of 1$\mu$W. This system is intended to supply power to autonomous wireless sensor nodes.Comment: Submitted on behalf of EDA Publishing Association (http://irevues.inist.fr/EDA-Publishing

Mechanical Fatigue on Gold MEMS Devices: Experimental Results

The effect of mechanical fatigue on structural performances of gold devices is investigated. The pull-in voltage of special testing micro-systems is monitored during the cyclical load application. The mechanical collapse is identified as a dramatic loss of mechanical strength of the specimen. The fatigue limit is estimated through the stair-case method by means of the pull-in voltage measurements. Measurements are performed by means of the optical interferometric technique.Comment: Submitted on behalf of EDA Publishing Association (http://irevues.inist.fr/handle/2042/16838

The Hot-Spot Phenomenon and its Countermeasures in Bipolar Power Transistors by Analytical Electro-Thermal Simulation

This communication deals with a theoretical study of the hot spot onset (HSO) in cellular bipolar power transistors. This well-known phenomenon consists of a current crowding within few cells occurring for high power conditions, which significantly decreases the forward safe operating area (FSOA) of the device. The study was performed on a virtual sample by means of a fast, fully analytical electro-thermal simulator operating in the steady state regime and under the condition of imposed input base current. The purpose was to study the dependence of the phenomenon on several thermal and geometrical factors and to test suitable countermeasures able to impinge this phenomenon at higher biases or to completely eliminate it. The power threshold of HSO and its localization within the silicon die were observed as a function of the electrical bias conditions as for instance the collector voltage, the equivalent thermal resistance of the assembling structure underlying the silicon die, the value of the ballasting resistances purposely added in the emitter metal interconnections and the thickness of the copper heat spreader placed on the die top just to the aim of making more uniform the temperature of the silicon surface.Comment: Submitted on behalf of TIMA Editions (http://irevues.inist.fr/tima-editions

Model Based Sensor System for Temperature Measurement in R744 Air Conditioning Systems

The goal is the development of a novel principle for the temperature acquisition of refrigerants in CO2 air conditioning systems. The new approach is based on measuring the temperature inside a pressure sensor, which is also needed in the system. On the basis of simulative investigations of different mounting conditions functional relations between measured and medium temperature will be derived.Comment: Submitted on behalf of EDA Publishing Association (http://irevues.inist.fr/handle/2042/16838

Nanostructures, Magnetic Semiconductors and Spinelectronics

A short overview is given of recent advances in the field of nanosemiconductors, which are suitable as materials for spin polarized transport of charge carriers. On the basis of last theoretical and experimental achievements it is shown that development of diluted and wide forbidden zone semiconductors with controlled disorders as well as their molecular structures is the very prospective way for magnetic semiconductors preparation.Comment: Submitted on behalf of TIMA Editions (http://irevues.inist.fr/tima-editions

Electromechanical Reliability Testing of Three-Axial Silicon Force Sensors

This paper reports on the systematic electromechanical characterization of a new three-axial force sensor used in dimensional metrology of micro components. The siliconbased sensor system consists of piezoresistive mechanicalstress transducers integrated in thin membrane hinges supporting a suspended flexible cross structure. The mechanical behavior of the fragile micromechanical structure isanalyzed for both static and dynamic load cases. This work demonstrates that the silicon microstructure withstands static forces of 1.16N applied orthogonally to the front-side of the structure. A statistical Weibull analysis of the measured data shows that these values are significantly reduced if the normal force is applied to the back of the sensor. Improvements of the sensor system design for future development cycles are derived from the measurement results.Comment: Submitted on behalf of TIMA Editions (http://irevues.inist.fr/tima-editions

Development of EHD Ion-Drag Micropump for Microscale Electronics Cooling Systems

In this investigation, the numerical simulation of electrohydrodynamic (EHD) ion-drag micropumps with micropillar electrode geometries have been performed. The effect of micropillar height and electrode spacing on the performance of the micropumps was investigated. The performance of the EHD micropump improved with increased applied voltage and decreased electrode spacing. The optimum micropillar height for the micropump with electrode spacing of 40$\mu$m and channel height of 100$\mu$m at 200V was 40$\mu$m, where a maximum mass flow rate of 0.18g/min was predicted. Compared to that of planar electrodes, the 3D micropillar electrode geometry enhanced the overall performance of the EHD micropumps.Comment: Submitted on behalf of TIMA Editions (http://irevues.inist.fr/tima-editions