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Novel 3-D IC technology
textFor many decades silicon based CMOS technology has made continual increase in drive current to achieve higher speed and lower power by scaling the gate length and the gate insulator thickness. The scaling becomes increasingly challenging because the devices are approaching physical quantum limits. Three-dimensional electronic devices, such as double gate, tri-gate and nanowire field-effect-transistors (FETs) provide an alternative solution because the ultra-thin fin or nanowire provides better electrostatic control of the device channel. Also high-[kappa] oxides lower the gate leakage current significantly, due to larger thickness for the same equivalent oxide thickness (EOT) compared with SiO₂ beyond the 22 nm node. Moreover, metal gate that avoids the poly-depletion effect in poly-Si gate has become mainstream semiconductor technology. The enabler technologies for high-[kappa] / metal gate 3D transistors include fabrication of high quality, vertical nanowire arrays, conformal metal and dielectric deposition and vertical patterning. One of the main focuses of this dissertation is developing a fabrication process flow to realize high performance MOSFETs with high-[kappa] oxide and metal gate on vertical silicon nanowire arrays. A variety of approaches to fabricating highly ordered silicon nanowire arrays have been achieved. Deep silicon etching process was developed and optimized for nanowire FETs. Process integration and patterning mythologies for high-[kappa] / metal gate were investigated and accomplished. 3-D electronic devices including nanowire capacitors, nanowire FETs and double gate MOSFETs for power applications were fabricated and characterized. The second part of this dissertation is about flexible electronics. Mechanically flexible integrated circuits (ICs) have gained increasing attention in recent years with emerging markets in portable electronics. Although a number of thin-film-transistor (TFT) IC solutions have been reported, challenges still remain for fabrication of inexpensive, high performance flexible devices. We report a simple and straightforward solution: mechanically exfoliating a thin Si film containing ICs. Transistors and circuits can be pre-fabricated on bulk silicon wafer with conventional CMOS process flow without additional temperature or process limitations. The short channel MOSFETs exhibit similar electrical performance before and after exfoliation. This exfoliation process also provides a fast and economical approach to produce thinned silicon wafers, which is a key enabler for three-dimensional (3D) silicon integration based on Through Silicon Vias (TSVs).Electrical and Computer Engineerin
Water Quality Analysis and Recommendations through Comprehensive Pollution Index Method
Recently, the quality of surface water has become one of significant environmental planning and management issues in China. To investigate the quality of surface water, three monitoring sites, such as Majiawan Site, Huxin Site and Huguan Site, have been established by Qilu Lake, located in the north of Tonghai County, Yuxi Region, Yunnan Province, by Chinese government. In this paper, we applied comprehensive pollution index method to analyze and monitor water quality, obtained a series of determination factors which could be used to differentiate V class and Interior V class of the water quality of Qilu Lake. Accordingly, we suggest relevant recommendations from the aspects of engineering measures, chemical and biological methods
Five-Linear Singular Integral Estimates of Brascamp-Lieb Type
We prove the full range of estimates for a five-linear singular integral of
Brascamp-Lieb type. The study is methodology-oriented with the goal to develop
a sufficiently general technique to estimate singular integral variants of
Brascamp-Lieb inequalities that do not obey H\"older scaling. The invented
methodology constructs localized analysis on the entire space from local
information on its subspaces of lower dimensions and combines such tensor-type
arguments with the generic localized analysis. A direct consequence of the
boundedness of the five-linear singular integral is a Leibniz rule which
captures nonlinear interactions of waves from transversal directions.Comment: 66 pages, 2 figures, to appear, Analysis & PDE. This is the final
version of the article taking into account referees' suggestion
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