Phonon transport in periodic silicon nanoporous films with feature sizes greater than 100 nm

<p>The thermal conductivities of solid silicon thin films and silicon thin films with periodic pore arrays are predicted using a Monte Carlo technique to include phonon-boundary scattering and the Boltzmann transport equation. The bulk phonon properties required as input are obtained from harmonic and anharmonic lattice dynamics calculations. The force constants required for the lattice dynamics calculations are obtained from forces calculated using density functional theory. For both solid and porous films, the in-plane thermal conductivity predictions capture the magnitudes and trends of previous experimental measurements. Because the prediction methodology treats the phonons as particles with bulk properties, the results indicate that coherent phonon modes associated with the secondary periodicity of the pores do not contribute to thermal transport in porous films with feature sizes greater than 100 nm.</p

Electrocaloric characterization of a poly(vinylidene fluoridetrifluoroethylene-chlorofluoroethylene) terpolymer by infrared imaging

<p>The electrocaloric effect in thin films of a poly(vinylidene fluoride-trifluoroethylene chlorofluoroethylene) terpolymer (62.6/29.4/8 mol. %, 11–12 μm thick) is directly measured by infrared imaging at ambient conditions. The adiabatic temperature change is estimated to be 5.2 K for an applied electric field of 90 V/μm. The temperature change is independent of the operating frequency in the range of 0.03–0.3 Hz and is stable over a testing period of 30 min. Application of this terpolymer is promising for micro-scale refrigeration</p

Design and modeling of a fluid-based micro-scale electrocaloric refrigeration system

<p>A refrigeration system composed of silicon MEMS cooling elements is designed based on the electrocaloric (EC) effect in a P(VDF–TrFE–CFE) terpolymer, poly(vinylidene fluoride–trifluoroethylene–chlorofluoroethylene) 59.2/33.6/7.2 mol%. Each cooling element includes two diaphragm actuators fabricated in the plane of a silicon wafer, which drive a heat transfer fluid back and forth across terpolymer layers that are placed between them. In the EC effect, reversible temperature and entropy changes related to polarization changes appear in a material under the application and removal of an electric field. Finite element simulations are performed to explore the system performance. The effect of the applied electric field is studied, and the time lag between the electric field and the diaphragm motion is found to significantly affect the cooling power. A parametric study of the operating frequency, externally-applied temperature span, and the electric field amplitude are conducted. The results indicate that when the system is operated at a temperature span of 15 K, a cooling power density of 3 W/cm²and a percent of Carnot <em>COP</em> of 31% are achieved for one element.</p