13 research outputs found
Improved Performance of Flip Chip assembled MMIC Amplifiers on LTCC using a Photonic Bandgap Structure
Get PDFFurther cost reduction in today’s microwave
frontends is strongly related to assembly technology as well
as module technology. Depending on the particular mix of
technologies, specific problems and chances can be
addressed. In case of flip-chip on LTCC, various effects of
performance degradation of the MMICs can be observed,
some of which can be related to unwanted internal coupling
of the microstrip IC due to the floating groundplane. For
some MMICs a periodic structure below the chip can help to
improve the characteristics of the assembled chip due to its
ability to suppress a particular class of unwanted modes
between the chip groundplane and the module ground. The
periodic structure is proposed and measured results are
given and discussed
The C-O stretch as a probe of adsorbate-induced structural changes on surfaces: Ir{100}-CO
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Narrow-band YBCO superconducting parallel-coupled coplanar waveguide band-pass filters at 10 GHz
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Circuit model based predistortion technique for linear frequency modulation of voltage controlled oscillator
No full textInvestigations on the radiocaesium contamination of wild boar (Sus scrofa) meat in Rhineland-Palatinate: a stomach content analysis
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