2 research outputs found

    Effects of Surface Band Bending and Scattering on Thermoelectric Transport in Suspended Bismuth Telluride Nanoplates

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    A microdevice was used to measure the in-plane thermoelectric properties of suspended bismuth telluride nanoplates from 9 to 25 nm thick. The results reveal a suppressed Seebeck coefficient together with a general trend of decreasing electrical conductivity and thermal conductivity with decreasing thickness. While the electrical conductivity of the nanoplates is still within the range reported for bulk Bi<sub>2</sub>Te<sub>3</sub>, the total thermal conductivity for nanoplates less than 20 nm thick is well below the reported bulk range. These results are explained by the presence of surface band bending and diffuse surface scattering of electrons and phonons in the nanoplates, where pronounced n-type surface band bending can yield suppressed and even negative Seebeck coefficient in unintentionally p-type doped nanoplates

    Sub-10 nm Carbon Nanotube Transistor

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    Although carbon nanotube (CNT) transistors have been promoted for years as a replacement for silicon technology, there is limited theoretical work and no experimental reports on how nanotubes will perform at sub-10 nm channel lengths. In this manuscript, we demonstrate the first sub-10 nm CNT transistor, which is shown to outperform the best competing silicon devices with more than four times the diameter-normalized current density (2.41 mA/μm) at a low operating voltage of 0.5 V. The nanotube transistor exhibits an impressively small inverse subthreshold slope of 94 mV/decadenearly half of the value expected from a previous theoretical study. Numerical simulations show the critical role of the metal–CNT contacts in determining the performance of sub-10 nm channel length transistors, signifying the need for more accurate theoretical modeling of transport between the metal and nanotube. The superior low-voltage performance of the sub-10 nm CNT transistor proves the viability of nanotubes for consideration in future aggressively scaled transistor technologies
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