A CMOS Smart Pixel for Active 3D Vision Applications

required in a growing number of applications like robotic guidance, security and automotive. Scannerless Time-Of-Flight (TOF) based active 3D vision systems are capable of collecting depth profiles of entire scenes in fraction of seconds but have the disadvantage of using high voltage and expensive electronic components. In this contribution we describe the design and test of an integrated smart pixel with 3D vision capability, which attempts to address this kind of problems. The pixel, fabricated in standard 0.6μm CMOS technology, is suitable to be used in scan-nerless ranging systems. By means of a pulsed laser source, distance estimation is obtained by integrating the back-reflected signal in successive time windows

A CMOS test chip for 3D vision applications with high dynamic range

This paper presents a CMOS smart pixel designed for scannerless, real-time, three-dimensional measurement systems, based on Indirect Time-Of-Flight technique. The proposed architecture allows for a high dynamic range which represents an essential requisite in range finding system. A test chip consisting of two 8x8-pixel arrays, with Correlated-Double-Sampling and Double-Delta-Sampling pixel read-out for Fixed-Pattern-Noise suppression has been fabricated in a 0.35-um, 3.3-V, CMOS technology. Circuit simulations validating the design approach and the sensor performance are presented. Preliminary results from electrical test confirm the correct operation of the chip and extensive electro-optical characterization is currently underwa

A CMOS test chip for 3D vision applications with high dynamic range

This paper presents a CMOS smart pixel designed for scannerless, real-time, three-dimensional measurement systems, based on Indirect Time-Of-Flight technique. The proposed architecture allows for a high dynamic range which represents an essential requisite in range finding systems. A test chip consisting of two 8x8-pixel arrays, with Correlated-Double-Sampling and Double-Delta-Sampling pixel read-out for Fixed-Pattern-Noise suppression has been fabricated in a 0.35-um, 3.3-V, CMOS technology. Circuit simulations validating the design approach and the sensor performance are presented. Preliminary results from electrical test confirm the correct operation of the chip and extensive electro-optical characterization is currently underway

A Novel Fully Differential Pixel Concept for Indirect TOF 3D Measurement

This paper describes the design of a CMOS image sensor for real time three-dimensional measurements based on multiple-pulse indirect Time Of Flight technique. A novel fully differential active pixel architecture, which allows for the detection of very short and low intensity light pulses, is presented. Circuit simulations allowed the design approach to be validated and the electrical performance of the circuit to be predicted. The photodiode and the required read-out and processing electronics are successfully implemented in a 80x80mm2 pixel with an expected power consumption of about 100mW. A preliminary test-chip, consisting of 16x16-pixel array with column read-out and digital control logic has been designed and fabricated in a 0.35mm, 3.3V, CMOS technolog

A novel 3D staring system for driver assistance

This paper reports the development of an intelligent electro-optical device for drive scenarios detection and object recognition, finalised to automotive functions, such as pre-crash, in which the obstacles classification is very important. The system is based on a new CMOS image sensor able to enhance the passive vision by integration on pixel of the distance information. The scene detection is based on a new active 3D imaging techniqu