4 research outputs found

    Capillary Microfluidics-Assembled Virus-like Particle Bionanoreceptor Interfaces for Label-Free Biosensing

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    A capillary microfluidics-integrated sensor system is developed for rapid assembly of bionanoreceptor interfaces on-chip and label-free biosensing. Genetically engineered <i>Tobacco mosaic virus</i> (TMV) virus-like particles (VLPs), displaying thousands copies of identical receptor peptides FLAG-tags, are utilized as nanoceptors for antibody sensing. Controlled and accelerated assembly of VLP receptor layer on impedance sensor has been achieved using capillary action and surface evaporation from an open-channel capillary microfluidic system. VLPs create a dense and localized receptor monolayer on the impedance sensor using only 5 μL of VLP sample solution (0.2 mg/mL) in only 6 min at room temperature. The VLP-functionalized impedance sensor is capable of label-free detection of target antibodies down to 55 pM concentration within 5 min. These results highlight the significant potentials of an integrated microsystem for rapid and controlled receptor–transducer interface creation and the nanoscale VLP-based sensors for fast, accurate, and decentralized pathogen detection

    Hierarchical Three-Dimensional Microbattery Electrodes Combining Bottom-Up Self-Assembly and Top-Down Micromachining

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    The realization of next-generation portable electronics and integrated microsystems is directly linked with the development of robust batteries with high energy and power density. Three-dimensional micro- and nanostructured electrodes enhance energy and power through higher surface area and thinner active materials, respectively. Here, we present a novel approach for the fabrication of hierarchical electrodes that combine benefits of both length scales. The electrodes consist of self-assembled, virus-templated nanostructures conformally coating three-dimensional micropillars. Active battery material (V<sub>2</sub>O<sub>5</sub>) is deposited using atomic layer deposition on the hierarchical micro/nanonetwork. Electrochemical characterization of these electrodes indicates a 3-fold increase in energy density compared to nanostructures alone, in agreement with the surface area increase, while maintaining the high power characteristics of nanomaterials. Investigation of capacity scaling for varying active material thickness reveals underlying limitations in nanostructured electrodes and highlights the importance of our method in controlling both energy and power density with structural hierarchy

    Three-Dimensional Solid-State Lithium-Ion Batteries Fabricated by Conformal Vapor-Phase Chemistry

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    Three-dimensional thin-film solid-state batteries (3D TSSB) were proposed by Long <i>et al</i>. in 2004 as a structure-based approach to simultaneously increase energy and power densities. Here, we report experimental realization of fully conformal 3D TSSBs, demonstrating the simultaneous power-and-energy benefits of 3D structuring. All active battery componentselectrodes, solid electrolyte, and current collectorswere deposited by atomic layer deposition (ALD) onto standard CMOS processable silicon wafers microfabricated to form arrays of deep pores with aspect ratios up to approximately 10. The cells utilize an electrochemically prelithiated LiV<sub>2</sub>O<sub>5</sub> cathode, a very thin (40–100 nm) Li<sub>2</sub>PO<sub>2</sub>N solid electrolyte, and a SnN<sub><i>x</i></sub> anode. The fabrication process occurs entirely at or below 250 °C, promising compatibility with a variety of substrates as well as integrated circuits. The multilayer battery structure enabled all-ALD solid-state cells to deliver 37 μAh/cm<sup>2</sup>·μm (normalized to cathode thickness) with only 0.02% per-cycle capacity loss. Conformal fabrication of full cells over 3D substrates increased the areal discharge capacity by an order of magnitude while simulteneously improving power performance, a trend consistent with a finite element model. This work shows that the exceptional conformality of ALD, combined with conventional semiconductor fabrication methods, provides an avenue for the successful realization of long-sought 3D TSSBs which provide power performance scaling in regimes inaccessible to planar form factor cells
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