A 77 GHz on-chip strip dipole antenna integrated with balun circuits for automotive radar

In this paper, design and implementation of a 77 GHz on-chip strip dipole antenna integrated with both lumped and transmission line based balun circuits are presented. The on-chip antenna is realized by using IHP’s 0.25 μm SiGe BiCMOS technology with localized back-side etch (LBE) module to decrease substrate loss. The strip dipole antenna is fed by both a lumped LC circuit and strip line tapered baluns integrated on the same substrate and occupies an area of 1x1.2 mm2 including the RF pads. For increased directivity, the antenna sits on a grounded silicon substrate. Experimental results show that antenna is well matched around the design frequency and achieves 7 GHz impedance bandwidth (minimum return loss of 17 dB) for the LC balun circuit. The antenna and its feeding structure are well suited for 77 GHz single chip automotive radar applications

SiGe process integrated on-chip dipole antenna on finite size ground plane

This letter investigates the effect of a finite-size ground plane on the radiation pattern and reflection coefficient of a SiGe process integrated on-chip antenna. A flat 77-GHz on-chip strip dipole antenna integrated with a lumped balun circuit is designed and implemented. For increased directivity, the etched silicon substrate is placed on a metal ground plate. The on-chip antenna with the balun circuit is connected to GSG pads for measurement purposes. The antenna is well matched at the original resonance frequency band with 7-12 GHz impedance bandwidth and 4 dBi measured gain at 85 GHz

A77 GHz on-chip dipole antenna with etched silicon substrate

In this paper, a 77 GHz microstrip dipole antenna is integrated on a layered 11.4 m SiO2 and a silicon substrate with thickness of 670 m. The unbalanced microstrip line is balanced by using a lumped LC circuit balun to feed both of the dipole arms. To decrease the substrate loss and hence increase the antenna gain, Localized Backside Etch (LBE) module offered by IHP is utilized to etch the area under the dipole antenna. For mechanical robustness, two walls of silicon substrate are left at the end of the dipole arms inside the etched area. The simulation results show a 3.2 dBi gain and 15 GHz bandwidth at 77 GHz

Realization of a single-chip, SiGe:C-based power amplifier for multi-band WiMAX applications

A fully-integrated Multi-Band PA using 0.25 μm SiGe:C process with an output power of above 25 dBm is presented. The behaviour of the amplifier has been optimized for multi-band operation covering, 2.4 GHz, 3.6 GHz and 5.4 GHz (UWB-WiMAX) frequency bands for higher 1-dB compression point and efficiency. Multi-band operation is achieved using multi-stage topology. Parasitic components of active devices are also used as matching components, in turn decreasing the number of matching component. Measurement results of the PA provided the following performance parameters: 1-dB compression point of 20.5 dBm, gain value of 23 dB and efficiency value of %7 operation for the 2.4 GHz band; 1-dB compression point of 25.5 dBm, gain value of 31.5 dB and efficiency value of %17.5 for the 3.6 GHz band; 1-dB compression point of 22.4 dBm, gain value of 24.4 dB and efficiency value of %9.5 for the 5.4 GHz band. Measurement results show that using multi-stage topologies and implementing each parasitic as part of the matching network component has provided a wider-band operation with higher output power levels, above 25 dBm, with SiGe:C process

Wideband 94 GHz on-chip dipole antennas for imaging applications

Microstrip on-chip dipole antennas with L and T shapes are designed and implemented to operate at W band with large bandwidths for imaging applications. On-chip antennas are manufactured using IHP SiGe BiCMOS run and localized back etching technique for removal of lossy silicon under the antenna. Measured return losses are in good agreement with simulated ones and antennas operate at 95.5 GHz with 15 GHz and 25 GHz (or more) 10dB-bandwidth for L and T antennas, respectively

Realization of a low noise amplifier using 0.35 um SiGe-BicMOS Technology for IEEE 802.11a applications /

The trend demand for towards interactive multimedia services has forced the development of new wireless systems that has greater bandwidths. The evolution of current wireless communication systems has been very rapid. The main goal has been small-size and low-cost transceivers that can be designed for different applications. Data communication systems in compliant with IEEE 802.11a wireless local area network (WLAN) standard has found widespread use, meeting the market demands, for the last few years. Next generation WLAN operates in the 5-6 GHz frequency range. A front-end receiver capable of operating within this frequency range is essential to meet the current and future of products. One of the critical components, allowing the common use of the technology can be attributed to the high performance Low Noise Amplifiers (LNA) in the receiver chain of the 802.11a transceivers. In IEEE 802.11a, there are three frequency bands; 5.15GHz - 5.25GHz, 5.25GHz - 5.35GHz and 5.725GHz - 5.825GHz. In this thesis, we designed and fabricated a single-stage cascode amplifier with emitter inductive degeneration using 0.35 ´m-SiGe BiCMOS process for IEEE 802.11a receivers. The electromagnetic (EM) simulations of the passive components are performed by using Agilent MOMENTUM® tool and all the parasitic components are extracted and compensated, a crucial step for optimizing the performance parameters of the LNA. The simulation results are very similar to measurement results, confirming the effectiveness of design methodology provided in this work

RF-MEMS Switch Module in a 0.25 µm SiGe:C BiCMOS Process

Drahtlose Kommunikationstechnologien im Frequenzbereich bis 6 GHz wurden in der Vergangenheit in Bezug auf Leistungsfaehigkeit und Frequenzbereich kontinuierlich verbessert. Aufgrund der Skalierung nach dem Mooreschen Gesetz koennen heutzutage mm-Wellen Schaltkreise in CMOS-Technologien hergestellt werden. Durch die Einfuehrung von SiGe zur Realisierung einer leistungsfaehigen BiCMOS-Technologie wurde ebenfalls eine Verbesserung der Frequenzeigenschaften und Ausgangsleistungen erreicht, wodurch aktive CMOS- oder BiCMOS-Bauelemente vergleichbare Leistungsparameter zu III-V Technologien bei geringeren Kosten bereitstellen koennen. Bedingt durch das niederohmige Silizium-Substrat der BiCMOS-Technologie weisen vor allem passive Komponenten hoehere Verluste auf und weder III-V- noch BiCMOS-Technologien bieten hochlineare Schaltkomponenten mit geringen Verlusten und geringen Leistungsaufnahmen im mm-Wellen Bereich. RF-MEMS Schalter sind bekannt fuer ihre ausgezeichneten HF-Eigenschaften. Die Leistungsaufnahme von elektrostatisch angetriebenen RF-MEMS Schaltern ist vernachlaessigbar und es koennen im Vergleich zu halbleiter-basierten Schaltern hoehere Leistungen verarbeitet werden. Nichtsdestotrotz wurden RF-MEMS Schalter hauptsaechlich als eigenstaendige Komponenten entwickelt. Zur Systemintegration wird meist ein System-in-Package (SiP) Ansatz angewandt, der fuer niedrige Frequenzen geeignet ist, aber bei mm-Wellenanwendungen durch parasitaere Verluste an seine Grenzen stoesst. In dieser Arbeit wird ein in eine BiCMOS-Technologie integrierter RF-MEMS Schalter fuer mm-Wellen Anwendungen gezeigt. Das Design, die Integration und die experimentellen Ergebnisse sowie verschiedene Packaging-Konzepte werden beschrieben Zur Bereitstellung der hohen Auslenkungs-Spannungen wurde eine Ladungspumpe auf dem Chip integriert. Zum Schluss werden verschiedene, rekonfigurierbare mm-Wellen Schaltkreise zur Demonstration der Leistungsfaehigkeit des Schalters gezeigt.Wireless communication technologies have continuously advanced for both performance and frequency aspects, mainly for the frequencies up to 6 GHz. The results of Moore’s law now also give the opportunity to design mm-wave circuits using advanced CMOS technologies. The introduction of SiGe into CMOS, providing high performance BiCMOS, has also enhanced both the frequency and the power performance figures. The current situation is that the active devices of both CMOS and BiCMOS technologies can provide performance figures competitive with III-V technologies while having still the advantage of low cost. However, similar competition cannot be pronounced for the passive components considering the low-resistive substrates of BiCMOS technologies. Moreover, both III-V and BiCMOS technologies have the lack of low-loss and low-power consumption, as well as highly linear switching and tuning components at mm-wave frequencies. RF-MEMS switch technologies have been well-known with excellent RF- performance figures. The power consumption of electrostatic RF-MEMS switches is negligible and they can handle higher power levels compared to their semiconductor counterparts. However, RF-MEMS switches have been mostly demonstrated as standalone processes and have started to be used as commercial off-the-shelf (COTS) devices recently. The full system integration is typically done by a System-in-Package (SiP) approach. Although SiP is suitable for lower frequencies, the packaging parasitics limit the use of this approach for the mm-wave frequencies. In this thesis, a fully BiCMOS embedded RF-MEMS switch for mm-wave applications is proposed. The design, the implementation and the experimental results of the switch are provided. The developed RF-MEMS switch is packaged using different packaging approaches. To actuate the RF-MEMS switch, an on-chip high voltage generation circuit is designed and characterized. The robustness and the reliability performance of the switch are also presented. Finally, the developed RF-MEMS switch is successfully demonstrated in re-configurable mm-wave circuits