Wire insulation defect detector

Wiring defects are located by detecting a reflected signal that is developed when an arc occurs through the defect to a nearby ground. The time between the generation of the signal and the return of the reflected signal provides an indication of the distance of the arc (and therefore the defect) from the signal source. To ensure arcing, a signal is repeated at gradually increasing voltages while the wire being tested and a nearby ground are immersed in a conductive medium. In order to ensure that the arcing occurs at an identifiable time, the signal whose reflection is to be detected is always made to reach the highest potential yet seen by the system

Improved Method of Locating Defects in Wiring Insulation

An improved method of locating small breaches in insulation on electrical wires combines aspects of the prior dielectric withstand voltage (DWV) and time-domain reflectometry (TDR) methods. The method was invented to satisfy a need for reliably and quickly locating insulation defects in spacecraft, aircraft, ships, and other complex systems that contain large amounts of wiring, much of it enclosed in structures that make it difficult to inspect. In the DWV method, one applies a predetermined potential (usually 1.5 kV DC) to the wiring and notes whether the voltage causes any arcing between the wiring and ground. The DWV method does not provide an indication of the location of the defect (unless, in an exceptional case, the arc happens to be visible). In addition, if there is no electrically conductive component at ground potential within about 0.010 in. (approximately equal to 0.254 mm) of the wire at the location of an insulation defect, then the DWV method does not provide an indication of the defect. Moreover, one does not have the option to raise the potential in an effort to increase the detectability of such a defect because doing so can harm previously undamaged insulation. In the TDR method as practiced heretofore, one applies a pulse of electricity having an amplitude of less than 25 V to a wire and measures the round-trip travel time for the reflection of the pulse from a defect. The distance along the wire from the point of application of the pulse to the defect is then calculated as the product of half the round-trip travel time and the characteristic speed of a propagation of an electromagnetic signal in the wire. While the TDR method as practiced heretofore can be used to locate a short or open circuit, it does not ordinarily enable one to locate a small breach in insulation because the pulse voltage is too low to cause arcing and thus too low to induce an impedance discontinuity large enough to generate a measurable reflection. The present improved method overcomes the weaknesses of both the prior DWV and the prior TDR method

Layered Pressure Vessels (LPV) Validating an Aging, Non-compliant Product

General information regarding efforts by NASA to validate continued use of fifty to sixty-five year old passive pressure containing vessels, to assess and reduce risks associated with LPV. With the goal of developing a standard Agency process for continued usage, maintenance, and inspection of LPV

Toughness Testing for Liquid Hydrogen And Helium Temperatures - Validation of Austenitic Stainless Steels for 4K (-452F) Use

This presentation is an Existing Code Requirement: Charpy impact test at a temperature no higher than the design minimum temperature. The Current Practice: is not clear, the indications are that testing is sometimes performed at -320F (liquid nitrogen or "LN2") for that and all lower temperatures. In some cases testing is probably not performed and CGA indicated successful operation of systems at -453F without required test. The Ballot activity: C&S Connect Record 13-341, Ballot 13-1746, initially proposed Charpy testing (lateral expansion criteria) at -320F to validate use at -425 (liquid helium or "LHe"). and PTCS Proposal.