161 research outputs found
Experimental study of the Sb-Sn-Zn alloy system
experimental description of the SbSn-Zn system by methods scanning electron microskope and differetial scanning calorimetryexperimentálnà popis ternárnà soustavy Sb-Sn-Zn metodami skenovacà elektronové mikroskopie a diferenčnà skenovacà kalorimetrieexperimental description of the SbSn-Zn system by methods scanning electron microskope and differetial scanning calorimetr
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MICROSTRUCTURAL OBSERVATIONS OF THE Sn-Pb SOLDER/Cu SYSTEM AND THERMAL FATIGUE OF THE SOLDER JOINT
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MICROSTRUCTURAL OBSERVATIONS OF THE Sn-Pb SOLDER/Cu SYSTEM AND THERMAL FATIGUE OF THE SOLDER JOINT
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THE EFFECT OF PRECIPITATED AUSTENITE ON THE FRACTURE OF A FERRITIC CRYOGENIC STEEL
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OBSERVATIONS ON THE MECHANISMS OF FATIGUE IN EUTECTIC PB-SN SOLDER JOINTS
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SNL initiatives in electronic fluxless soldering
Conventional soldering of electronic components generally requires the application of a chemical flux to promote solder wetting and flow. Chlorofluorocarbons (CFC) and halogenated solvents are normally used to remove the resulting flux residues. While such practice has been routinely accepted throughout the electronics industry, the environmental impact of hazardous solvents on ozone depletion will eventually limit or prevent their use. Solvent substitution or alternative technologies must be developed to meet these goals. Sandia National Laboratories, Albuquerque has a comprehensive environmentally conscious electronics manufacturing program underway that is funded by the DOE Office of Technology Development. Primary elements of the integrated task are the characterization and development of alternative fluxless soldering technologies that would eliminate circuit board cleaning associated with flux residue removal. Storage and handling of hazardous solvents and mixed solvent-flux waste would be consequently reduced during electronics soldering. This paper will report on the progress of the SNL fluxless soldering initiative. Emphasis is placed on the use of controlled atmospheres, laser heating, and ultrasonic soldering
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