Road traffic injury prevention in Malaysia: Research and practice

Road traffic injuries (RTIs) are a major cause of mortality, morbidity and disability in Malaysia contributing more than 23 per 100,000 people die and additional 71 per 100,000 people are injured or disabled every year. Though the upward trend of RTIs dropped slowly but the road traffic deaths have been increasing from 2,303 in 1974 to 6,872 in 2010. This article is an attempt to review the current impact of road safety initiatives carried out by the Malaysian Government and other organizations through published literature

LNF Micro-Contact using MEMS and EFF Technology

Enable the design of a small contact spring for applications requiring high density, high speed and high durability. A low normal force (LNF) contact spring with high performance is fabricated using a unique combined MEMS photo resist lithography and electro fine forming (EFF) technology. Reducing a total contact material cost of a connector, a high-Hertz stress with LNF contact will be a key technology in the future. Only radius r5m tip with 0.1N force contact provides an excellent electrical performance which is much sharper than conventional contact. 0.30million cycles durability test was passed at 300m displacement and the contact resistance was ≦50mΩ

1×2 optical switch for indoor LAN

Polymer optical fiber (POF) is suitable for indoor local area network (LAN), because of its flexibility and its ease of connection due to its relatively large core diameter. A 1×2 optical switch for indoor LAN using POF and a shape memory alloy (SMA) coil actuator with magnetic latches was successfully fabricated and tested. To achieve switching by the movement of a POF, large displacement is necessary because the core diameter is large (e.g., 0.486mm). A SMA coil actuator is used for large displacement and a magnetic latching system is used for fixing the position of the shifted POF. The insertion loss is 0.40 to 0.50dB and crosstalk is more than 50dB without index-matching oil. Switching speed is less than 0.5s at a driving current of 80mA. A cycling test was performed 1.4 million times. Polymer clad fiber optical (PCF) switch also fabricated and tasted

MEMS and EFF technology based micro connector for future miniature devices

The development of a miniature; size, light and high performance electronic devices; has been accelerated for further development. In commercial stamping method, connector pitch size (radius) is more than 300μm due to its size limitation. Therefore, the stamped contact hertz stress becomes lower and less suitable for fine pitch connector. To overcome this pitch size problem a narrow pitch Board-to-Board (BtoB) interface connectors are in demand for the current commercial design. Therefore, this paper describes a fork type micro connector design with high Hertz-Stress using MEMS and Electro Fine Forming (EFF) fabrication techniques. The connector is designed high aspect ratio and high-density packaging using UV thick resist and electroforming. In this study a newly fabricated micro connector’s maximum aspect ratio is 50μm and pitch is 80μm is designed successfully which is most compact fork-type connector in the world. When these connectors are connected, a contact resistance of less than 50mΩ has been attained by using four-point probe technique

Development of a high hertz-stress contact for conventional batch production using a unique scribing technology

Gradually the electronic devices are getting more compact dimension with respect to the width and thickness. As a result, the contacts are becoming thinner and which leads the contact to be loose and unstable contact. In comercial stamping methode, connector tip diameter should be more than 300μm due to its size limitation. Consequently, the connector contact resistance is becoming higher due to weak contact force. To overcome this problem there were few more basic research using MEMS and Electro Fine Forming (EFF) technology to make high Hertz-Stress Contact (5μm) due to the limitation in the commercial stamping process and the result was in satisfactory level. However, since the MEMS and EFF fabrication is costly therefore, a new method is introduced in this paper using the commercial Phosphor Bronze stamping method to reduce the production cost. Moreover, scribing method is used to make tip on the contact. Accordingly, more compact fine pitch contact is successfully fabricated and tested with 5μm High Hertz Stress without using the MEMS and EFF technology. Hence the manufactured contact resistance becomes less than 20mΩ ±5mΩ

Optimizing POF/PCF based optical switch for indoor LAN

For indoor local area network (LAN) the Polymer optical fiber (POF) is mostly appropriate, because of its large core diameter and flexible material. A 1×2 optical switch for indoor LAN using POF and a shape memory alloy (SMA) coil actuator with magnetic latches was successfully fabricated and tested. To achieve switching by the movement of a POF, large displacement is necessary because the core diameter is large (e.g., 0.486mm). A SMA coil actuator is used for large displacement and a magnetic latching system is used for fixing the position of the shifted POF. The insertion loss is 0.40 to 0.50dB and crosstalk is more than 50dB without index-matching oil. Switching speed is less than 1s at a driving current of 80mA. A cycling test was performed 1.4 million times. Polymer clad fiber optical (PCF) switch also fabricated and tasted

Design and fabrication stable LNF contact for future IC application

Enable the design of a small contact spring for applications requiring high density, high speed and high durability. A low normal force (LNF) contact spring with high performance is fabricated using a unique combined MEMS photo resist lithography and electro fine forming (EFF) technology. Reducing a total contact material cost of a connector, a high-Hertz stress with LNF contact will be a key technology in the future. Only radius R 5m tip with 0.1N force contact provides an excellent electrical performance which is much sharper than conventional contact. 0.30million cycle’s durability test was passed at 300m displacement and the contact resistance was ≦50mΩ

Optimizing POF/PCF based optical switch for indoor LAN

For indoor local area network (LAN) the Polymer optical fiber (POF) is mostly appropriate, because of its large core diameter and flexible material. A 1×2 optical switch for indoor LAN using POF and a shape memory alloy (SMA) coil actuator with magnetic latches was successfully fabricated and tested. To achieve switching by the movement of a POF, large displacement is necessary because the core diameter is large (e.g., 0.486mm). A SMA coil actuator is used for large displacement and a magnetic latching system is used for fixing the position of the shifted POF. The insertion loss is 0.40 to 0.50dB and crosstalk is more than 50dB without index-matching oil. Switching speed is less than 1s at a driving current of 80mA. A cycling test was performed 1.4 million times. Polymer clad fiber optical (PCF) switch also fabricated and tasted

MEMS and EFF Technology based micro connector for future miniature devices

The development of a miniature; size, light and high performance electronic devices; has been accelerated for further development. In commercial stamping method, connector pitch size (radius) is more than 300μm due to its size limitation. Therefore, the stamped contact hertz stress becomes lower and less suitable for fine pitch connector. To overcome this pitch size problem a narrow pitch Board-to-Board (BtoB) interface connectors are in demand for the current commercial design. Therefore, this paper describes a fork type micro connector design with high Hertz-Stress using MEMS and Electro Fine Forming (EFF) fabrication techniques. The connector is designed high aspect ratio and high-density packaging using UV thick resist and electroforming. In this study a newly fabricated micro connector’s maximum aspect ratio is 50μm and pitch is 80μm is designed successfully which is most compact fork-type connector in the world. When these connectors are connected, a contact resistance of less than 50mΩ has been attained by using four-point probe technique

Development of a High Hertz-Stress Contact for conventional batch production using a unique scribing technology

Gradually the electronic devices are getting more compact dimension with respect to the width and thickness. As a result, the contacts are becoming thinner and which leads the contact to be loose and unstable contact. In comercial stamping methode, connector tip diameter should be more than 300μm due to its size limitation. Consequently, the connector contact resistance is becoming higher due to weak contact force. To overcome this problem there were few more basic research using MEMS and Electro Fine Forming (EFF) technology to make high Hertz-Stress Contact (5μm) due to the limitation in the commercial stamping process and the result was in satisfactory level. However, since the MEMS and EFF fabrication is costly therefore, a new method is introduced in this paper using the commercial Phosphor Bronze stamping method to reduce the production cost. Moreover, scribing method is used to make tip on the contact. Accordingly, more compact fine pitch contact is successfully fabricated and tested with 5μm High Hertz Stress without using the MEMS and EFF technology. Hence the manufactured contact resistance becomes less than 20mΩ ±5mΩ