Large displacement optical switching mechanism using SMA microactuator and magnetic latch

POF (Plastic Optical Fiber) is more suitable than the quartz optical fiber for indoor LAN (Local Area Network), for example in-home or office networks because of its flexibility and ease of connection by relatively large core diameter.1 x 2 optical switches for indoor LAN using POF have been developed. For switching by movement of a POF, large displacement is necessary as core diameter is large (e.g.0.486mm). A SMA (shape memory alloy) coil actuator is used for large displacement and a magnetic latching system is used for fixing the position of the shifted POF. Switching speed is less than 0.5 second and the insertion loss of the fabricated switch is 0.40 to 0.50dB. The insertion loss is 0.06 to 0.09dB using index-matching oil. PCF (Plastic Clad Fiber)has also large core diameter (e.g. 0.20mm) and an optical switches using PCF will be useful for short distance network between buildings

Application of stand-by switching large core diameter optical fiber switch

A l x 2 optical switch using POFIPCF and an SMA coil actuator with magnetic latches is fabricated and tested. A stand-by switch using the fabricated fiber switches is assembled and its operation is confirmed

Optimizing POF/PCF based optical switch for indoor LAN

For indoor local area network (LAN) the Polymer optical fiber (POF) is mostly appropriate, because of its large core diameter and flexible material. A 1×2 optical switch for indoor LAN using POF and a shape memory alloy (SMA) coil actuator with magnetic latches was successfully fabricated and tested. To achieve switching by the movement of a POF, large displacement is necessary because the core diameter is large (e.g., 0.486mm). A SMA coil actuator is used for large displacement and a magnetic latching system is used for fixing the position of the shifted POF. The insertion loss is 0.40 to 0.50dB and crosstalk is more than 50dB without index-matching oil. Switching speed is less than 1s at a driving current of 80mA. A cycling test was performed 1.4 million times. Polymer clad fiber optical (PCF) switch also fabricated and tasted

Development and optimization of a low normal force contact

Throughout the technological advancements, electronic devices are getting high dense and less expensive in day by bay. Thus, significantly reducing the production cost is the vital issue in order to produce more competitive device with maintaining its standard in all expect. Therefore, introducing new compact contact in high-Hertz stress with low normal force (LNF) will be a key technology to achieve the future goal. In this research, it is identified that only a 5μm radial tip with 0.1N force contact provides an excellent electrical performance which is much sharper than conventional connectors. This invention gives a big hope to produce less expensive and high dense Low Normal Force contact. The contacts durability test were also successfully passed 0.30 million cycles of uses while the contact resistance were ≦50m�-ohm

Development of a High Hertz-Stress Contact for conventional batch production using a unique scribing technology

Gradually the electronic devices are getting more compact dimension with respect to the width and thickness. As a result, the contacts are becoming thinner and which leads the contact to be loose and unstable contact. In comercial stamping methode, connector tip diameter should be more than 300μm due to its size limitation. Consequently, the connector contact resistance is becoming higher due to weak contact force. To overcome this problem there were few more basic research using MEMS and Electro Fine Forming (EFF) technology to make high Hertz-Stress Contact (5μm) due to the limitation in the commercial stamping process and the result was in satisfactory level. However, since the MEMS and EFF fabrication is costly therefore, a new method is introduced in this paper using the commercial Phosphor Bronze stamping method to reduce the production cost. Moreover, scribing method is used to make tip on the contact. Accordingly, more compact fine pitch contact is successfully fabricated and tested with 5μm High Hertz Stress without using the MEMS and EFF technology. Hence the manufactured contact resistance becomes less than 20mΩ ±5mΩ

Development of optical switch using SMA coil and magnetic latch

家庭内またはオフィスにおける小規模 LAN では接続および敷設の容易さから、石英光ファイバよりもプラスチック光ファイバ(POF)が適している。家庭及びオフィス内で膨大な情報を扱う時代は目の前に来ており、近い将来、屋外からの情報を情報コンセントを通して光ファイバ経由で各種情報端末・AV 機器へ伝送されると予測される。情報をそれぞれの情報端末・AV 機器へ個別に伝送するためには分岐部ごとに光スイッチが必要とされる。上記の要求を満たす、POF を用いた光スイッチ（１×２）の開発を行った

MEMS and EFF Technology based micro connector for future miniature devices

The development of a miniature; size, light and high performance electronic devices; has been accelerated for further development. In commercial stamping method, connector pitch size (radius) is more than 300μm due to its size limitation. Therefore, the stamped contact hertz stress becomes lower and less suitable for fine pitch connector. To overcome this pitch size problem a narrow pitch Board-to-Board (BtoB) interface connectors are in demand for the current commercial design. Therefore, this paper describes a fork type micro connector design with high Hertz-Stress using MEMS and Electro Fine Forming (EFF) fabrication techniques. The connector is designed high aspect ratio and high-density packaging using UV thick resist and electroforming. In this study a newly fabricated micro connector’s maximum aspect ratio is 50μm and pitch is 80μm is designed successfully which is most compact fork-type connector in the world. When these connectors are connected, a contact resistance of less than 50mΩ has been attained by using four-point probe technique

Micro connector fabricated by micro process technology

A fork - type micro connector with high aspect ratio and high - package density was fabricated using UV thick photoresist and Ni electroforming. A negative photoresist (THB - 138N) was used as a mold of Ni electroforming. The tips of plug terminal of the micro connector were formed as movable portions using Cu sacrificial layer etching. In order to make iinn contact and precise connection of the micro connector, two-step guidance was adopted. The size of the tenninal of fabricated micro connector was 50 p - thickness and 15 pm - width (minimum). The maximum aspect ratio of the fabricated micro connector is 3.3 and the terminal pitch is 80 pn. A contact ?&stance of approximately 50 & was obtained by using four - point probe method