Badania nad opracowaniem wymagań dotyczących fizycznej i psychicznej przydatności strażaków i kandydatów na strażaków

This report was compiled for the Belgian Federal Office for Internal Affairs. It contains a discussion of the creation and subsequent application of a test battery and questionnaires for assessing the physical and mental capacity of firemen. There are currently no uniform criteria for these in Belgium. They are coupled to a scientifically-based training programme.Autorzy zamieszczonego poniżej artykułu udowadniają, że kwestia predyspozycji psychofizycznych strażaków ma wymiar uniwersalny . podobny w każdym kraju. Fakt, iż przydatność do służby determinowana jest w jednakowym stopniu sprawnością i wytrzymałością fizyczną oraz cechami psychiki, potwierdza zarówno praktyka, jak i badania naukowe. Na zlecenie rządu Belgii (Federalnego Biura Spraw Wewnętrznych), grupa naukowców pod kierunkiem prof., prof. Lode Godderis'a i Veerle Hermans'a, opracowała jednolite kryteria oceny przydatności strażaków i kandydatów na strażaków. Ciekawy jest sposób podejścia do problemu. Diagnoza dokonana przez belgijską administrację rządową była jednoznaczna - brakuje jednolitych kryteriów oceny predyspozycji do pełnienia odpowiedzialnej i związanej z szeregiem ryzyk, służby w straży pożarnej. Celowo piszę "służby", a nie "pracy", bo nawet laik zdaje sobie sprawę, że strażak - to nie jest zawód podobny do innych. Wielu twierdzi wręcz, że trzeba mieć do niego powołanie. Zostawmy metafizyczne rozważania. Nie sposób jednak zaprzeczyć, że w tej służbie sprawdzą się ludzie, którzy charakteryzują się odpowiednimi cechami ciała, umysłu i psychiki. Jakimi? Aby odpowiedzieć na to pytanie, wybrano najprostszy i najskuteczniejszy, moim zdaniem, sposób - zlecono wybitnym specjalistom (naukowcom i wspierającym ich praktykom) zrealizowanie projektu naukowo-badawczego. Jak im się to udało

Demonstrator Testbed for Intra-Chip Optical Interconnections: Combining Multi-Channel Free-Space Plastic Micro-Optical Modules and VCSEL Based OE-FPGAs.

We fabricated and replicated in semiconductor compatible plastics a multi-channel free-space optical interconnection module designed to establish intra-chip interconnections on an Opto-Electronic Field Programmable Gate Array (OEFPGA). The micro-optical component is an assembly of a refractive lenslet-array and a high-quality microprism. Both components were prototyped using deep lithography with protons and were monolithically integrated using a vacuum casting replication technique. The resulting 16 channel module shows optical transfer efficiencies of 50% and inter-channel cross-talks as low as -22 dB. These characteristics are sufficient to establish multi-channel intra-chip interconnects with OE-FPGA's. The OE-FPGA we used was designed within a European co-founded MEL-ARI consortium working towards a manufacturable solution for optical interconnects between CMOS IC's. The optoelectronic chip combines fully functional FPGA digital logic with the drivers, receivers and flip-chipped optoelectronic components. It features 2 optical inputs an 2 optical outputs per FPGA cell, amounting to 256 photonic I/O links based on multi-mode 980 nm VCSELs and InGaAs detectors. With a careful alignment of the micro-optical free-space module above the OE-VLSI chip, we demonstrated for the first time to our knowledge a multi-channel free-space intra-chip optical interconnection. Data-communication was achieved with 4 simultaneous channels working at 10Mb/s. The bitrate was limited by the chiptester. Notwithstanding the use of non-aggressive 0.6 mum CMOS technology the FPGA will provide an 80 Mbit/s information rate per channel using manchester encoded links. The whole chip therefore has in principle a peak aggregate signalling rate of approximately 20 GBit/s. This first demonstration paves the way for a practical solution to solve the electronic intra-chip, interconnect bottleneck with low-cost mass-producible chip-compatible plastic micro-optical modules

Multi-channel free-space intra-chip optical interconnections: combining plastic micro-optical modules and VCSEL based OE-FPGA

We fabricated and replicated in semiconductor compatible plastics a multi-channel free-space optical interconnection module designed to establish intra-chip interconnections on an Opto-Electronic Field Programmable Gate Array (OEFPGA). The micro-optical component is an assembly of a refractive lenslet-array and a high-quality microprism. Both components were prototyped using deep lithography with protons and were monolithically integrated using a vacuum casting replication technique. The resulting 16 channel module shows optical transfer efficiencies of 50% and inter-channel cross-talks as low as -22 dB. These characteristics are sufficient to establish multi-channel intra-chip interconnects with OE-FPGA's. The OE-FPGA we used was designed within a European co-founded MEL-ARI consortium working towards a manufacturable solution for optical interconnects between CMOS IC's. The optoelectronic chip combines fully functional FPGA digital logic with the drivers, receivers and flip-chipped optoelectronic components. It features 2 optical inputs an 2 optical outputs per FPGA cell, amounting to 256 photonic I/O links based on multi-mode 980 nm VCSELs and InGaAs detectors. With a careful alignment of the micro-optical free-space module above the OE-VLSI chip, we demonstrated for the first time to our knowledge a multi-channel free-space intra-chip optical interconnection. Data-communication was achieved with 4 simultaneous channels working at 10Mb/s. The bitrate was limited by the chiptester. Notwithstanding the use of non-aggressive 0.6 mum CMOS technology the FPGA will provide an 80 Mbit/s information rate per channel using manchester encoded links. The whole chip therefore has in principle a peak aggregate signalling rate of approximately 20 GBit/s. This first demonstration paves the way for a practical solution to solve the electronic intra-chip, interconnect bottleneck with low-cost mass-producible chip-compatible plastic micro-optical modules

Enhancing the transmission efficiency of parallel optical interconnection systems using drop-on-demand microlenses

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Demonstration of manufacturable free-space modules for multi-channel intra-chip optical interconnects

We investigate the combination of a replicated plastic optical micro-component with an opto-electronic field programmable gate array for multi-channel intra-chip interconnects. Multichannel operation at 10 Mbit/s per channel has been demonstrated

Photonic interconnects to silicon chips

A multi-channel free-space micro-optical module for dense MCM-level optical interconnections has been designed and fabricated. Extensive modeling proves that the module is scalable with a potential for multi-Tb/s.cm2 aggregate bit rate capacity while alignment and fabrication tolerances are compatible with present-day mass replication techniques. The micro-optical module is an assembly of refractive lenslet-arrays and a high-quality micro-prism. Both components are prototyped using deep lithography with protons and are monolithically integrated using vacuum casting replication technique. The resulting 16-channel high optical-grade plastic module shows optical transfer efficiencies of 46% and inter-channel cross talks as low as -22 dB, sufficient to establish workable multi-channel MCM-level interconnections. This micro-optical module was used in a feasibility demonstrator to establish intra-chip optical interconnections on a 0.6gm CMOS opto-electronic field programmable gate array. This opto-electronic chip combines fully functional digital logic, driver and receiver circuitry and flip-chipped VCSEL and detector arrays. With this test-vehicle multichannel on-chip data-communication has been achieved for the first time to our knowledge. The bit rate per channel was limited to 10Mb/s because of the limited speed of the chip tester