过滤电弧沉积的TiN/TiCrN/CrN/CrTiN多层膜

用过滤电弧技术在高速钢表面沉积了TiN/TiCrN/CrN/CrTiN多层膜 ,用扫描电镜 (SEM )观察了截面和断口形貌及划痕后的形貌。使用俄歇电子谱仪进行剥层成分分析 ,用纳米压痕仪测试了多层膜和单层膜的显微硬度和弹性模量。结果表明 ,在调制周期大于 10 0nm时 ,多层膜的显微硬度符合Hall Petch关系 ,在 80nm时 ,则脱离线性关系。划痕法测试多层膜的结合力达到 80N

SEM analysis of Particles and its effects in arc ion plating

用扫描电镜对比分析了电弧离子镀增加直线磁场过滤对沉积TiN和TiAlN薄膜中颗粒的密度和尺寸的影响，，结果表明，TIN薄膜中颗粒的最大直径，从14μm减小到3μm，颗粒密度从lO~9／cm~2。降低到10~5／cm~2.TilN薄膜由于靶材中含有低熔点金属Al，因而发射出更大的颗粒，有的颗粒集团达到20μm，磁场过滤后颗粒尺寸减小，颗粒密度降低到10~6／cm~2。分析了脉冲叠加直流偏压对TiCrZrN复合薄膜相组成的影响。颗粒可使电弧离子镀rriN／crN多层膜的结合力降低，并使针孔产生遗传。使用直线型磁场过滤及脉冲叠加直流偏压不仅使颗粒密度和尺寸显著降低和减小，而且多层化对小颗粒产生了包覆作用

Effects of superimposed pulse bias on TiN coating in cathodic arc deposition

Orthogonal designs are used to investigate the main factors when doing experiments in which pulse bias is superimposed on d.c. bias during cathodic are deposition of TiN. Pulse peak, duty cycle, frequency, direct voltage, are current and pressure all are investigated when coating TiN on HSS substrates. Roughness, surface micrograph, microhardness and thickness are tested. By analysis of variance, it is shown that pressure and frequency are the main factors. R-a and droplet density of the film with (d.c. + pulse) bias decrease. A simple explanation for the result is suggested