A DC-coupled RF Amplifier in CMOS with DC-feedback

A CMOS multistage RF amplifier with DC coupling is presented. A complete optimisation of the various stages is done to maximize the RF gain for a given power budget. To decrease the effects of offsets and tolerances in high gain multistage amplifiers usually (lossy) AC coupling is used. The presented circuit employs DC coupling and DC control circuitry to avoid coupling-induced\ud losses. Compared to existing competing AC-coupled designs the presented one has much more gain at the same power consumption with a lower die area. For the 3-stage design vehicle, with Rsrc = 500Ω and Cout = 400fF, the maximal signal power gain at 4mA supply current is 33dB at 1.9GHz

Magnetic fields at the periphery of UCHII regions from carbon recombination line observations

Several indirect evidences indicate a magnetic origin for the non-thermal width of spectral lines observed toward molecular clouds. In this letter, I suggest that the origin of the non-thermal width of carbon recombination lines (CRLs) observed from photo-dissociation regions (PDRs) near ultra-compact \HII\ regions is magnetic and that the magnitude of the line width is an estimate of the \alfven speed. The magnetic field strengths estimated based on this suggestion compare well with those measured toward molecular clouds with densities similar to PDR densities. I conclude that multi-frequency CRL observations have the potential to form a new tool to determine the field strength near star forming regions.Comment: To appear in ApJ Letter

Een jaar luzerne op Cranendonck

Luzerne is een voedergewas dat in veel landen in de wereld, zoals de VS, Canada en Australië, een belangrijk deel van het rantsoen voor melkvee uitmaakt

Importance of transboundary transport of biomass burning emissions to regional air quality in Southeast Asia during a high fire event

10.5194/acp-15-363-2015Atmospheric Chemistry and Physics151363-37

MOD/R : A knowledge assisted approach towards top-down only CMOS VLSI design

MOD/R models all views on the design space in relations. This is achieved by eliminating the package constraints, as are apparent in PCB oriented hardware description languages. Assisted by knowledge engineering it allows for a top-down, mostly hierarchical decomposition, virtually eliminating the need for bottom-up assembly