30 research outputs found

    Cracking pressure control of parylene checkvalve using slanted tensile tethers

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    MEMS check valves with fixed cracking pressures are important in micro-fluidic applications where the pressure, flow directions and flow rates all need to be carefully controlled. This work presents a new surface-micromachined parylene check valve that uses residual thermal stress in the parylene to control its cracking pressure. The new check valve uses slanted tethers to allow the parylene tensile stress to apply a net downward force on the valving seat against the orifice. The angle of the slanted tethers is made using a gray-scale mask to create a sloped sacrificial photoresist with the following tether parylene deposition. The resulted check valves have both the cracking pressures and flow profiles agreeable well with our theoretical analysis

    Parylene stiction

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    This paper presents a preliminary study into stiction between parylene C and substrate surfaces for biocompatible check-valve applications. During fabrication, parylene C is used as the structural material for the check-valve. The substrate surfaces studied include Au, Al, Si, parylene C, XeF_2 treated Si, and silicon dioxide. Stiction between different surfaces is created after sacrificial photoresist etching. Then, the stiction is measured using blister tests, and stiction mechanisms for different materials are investigated. The devices are released with different recipes to examine their effects. Finally, the results of the study reveal methods to control the cracking pressure of parylene check-valves

    Stiction of parylene C to silicon surface measured using blister tests

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    Micro-fabricated biocompatible check valves are integral parts of many implantable micro-fluidic devices. The cracking pressure of check valves is usually controlled by stiction between polymeric films and the underlying substrate. The following paper presents the first comprehensive study of stiction between parylene and silicon surfaces. The valves are fabricated using surface micromachining with parylene C as the structural material. Deep Reactive Ion Etching (DRIE) is used to create through holes in the wafer for the passage of fluids. Blister test is employed to calculate stiction. From experimental results, stiction between parylene C and silicon surfaces is found to be 2.59 J/m2, which is comparable to the stiction between silicon and other polymeric thin films
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