Field experience with various slicing methods

Wafer slicing using internal diameter (ID) saw, multiblade slurry (MBS) saw and multiwire slurry (MWS) saw techniques were evaluated. Wafer parameters such as bow, taper, and roughness which may not be important factors for solar cell fabrication, were considerably better for ID saw than those of the MBS and MWS saw. Analysis of add-on slicing cost indicated that machine productivity seems to be a major limiting factor for ID saw, while expendible material costs are a major factor for both MBS and MWS saw. Slicing experience indicated that the most important factors controling final wafer cost are: (1) silicon cost (wafer thickness + kerf loss); (2) add-on slicing cost, and (3) mechanical yield. There is a very strong interaction between these parameters, suggesting a necessity of optimization of these parameters

Element-specific modal formulations for large-displacement multibody dynamics

Large dispacement assumed-mode modeling techniques are examined in the context of multibody elastodynamics. The range of both general and element-specific approaches are studied with the aid of examples involving beams, plates, and shells. For systems undergoing primarily structural bending and twisting with little or no membrane distortion, it is found that fully-linear, element-specific, modal formulations provide the most accurate time history solutions at the least expense. When membrane effects become dominant in structural problems due to loading and boundary conditions, one must naturally resort to a formulation involving a nonlinear stress-strain relationship in addition to nonlinear terms associated with large overall system motion. Such nonlinear models were investigated using assumed modes and found to lead to modal convergence difficulties when standard free-free structural modes are employed. A constrained mode formulation aimed at addressing the convergence problem is proposed

Multimodal Affective Feedback: Combining Thermal, Vibrotactile, Audio and Visual Signals

In this paper we describe a demonstration of our multimodal affective feedback designs, used in research to expand the emotional expressivity of interfaces. The feedback leverages inherent associations and reactions to thermal, vibrotactile, auditory and abstract visual designs to convey a range of affective states without any need for learning feedback encoding. All combinations of the different feedback channels can be utilised, depending on which combination best conveys a given state. All the signals are generated from a mobile phone augmented with thermal and vibrotactile stimulators, which will be available to conference visitors to see, touch, hear and, importantly, feel

Making Commuting Satisfying for the Employees by Allocating Them to the Proximate Jobsite

Building a structure is a long process and it is the construction manager’s job to verify and be prepared for any curve balls that can occur. However, construction managers can often get busy and get carried away by their responsibilities and inevitably pay less attention for employee\u27s life after work. For my Senior Project, I have put together a website that can be used by the construction managers to allocate work not only based the skillset but also based on proximity. The name of the website is ✦Proximate and it uses Google Earth Outreach (free tool) to make allocation possible. With Proximate pre-construction managers and superintendents can improve the commuting time of the craftsmen and allow fathers to participate at the dinner table and ✦Proximate exists for this reason. Keywords: Proximate, managers, tool, website, busy, allocate, commut

Highly stacked 3D organic integrated circuits with via-hole-less multilevel metal interconnects

Multilevel metal interconnects are crucial for the development of large-scale organic integrated circuits. In particular, three-dimensional integrated circuits require a large number of vertical interconnects between layers. Here, we present a novel multilevel metal interconnect scheme that involves solvent-free patterning of insulator layers to form an interconnecting area that ensures a reliable electrical connection between two metals in different layers. Using a highly reliable interconnect method, the highest stacked organic transistors to date, a three-dimensional organic integrated circuits consisting of 5 transistors and 20 metal layers, is successfully fabricated in a solvent-free manner. All transistors exhibit outstanding device characteristics, including a high on/off current ratio of similar to 10(7), no hysteresis behavior, and excellent device-to-device uniformity. We also demonstrate two vertically-stacked complementary inverter circuits that use transistors on 4 different floors. All circuits show superb inverter characteristics with a 100% output voltage swing and gain up to 35 V per V.11Ysciescopu

Monolithic arrays of surface emitting laser NOR logic devices

Monolithic, cascadable, laser-logic-device arrays have been realized and characterized. The monolithic surface-emitting laser logic (SELL) device consists of an AlGaAs superlattice lasing around 780 nm connected to a heterojunction phototransistor (HPT) in parallel and a resistor in series. Arrays up to 8×8 have been fabricated, and 2×2 arrays show uniform characteristics. The optical logic output is switched off with 40 μW incident optical input

Silicon solar cell process development, fabrication, and analysis

Two large cast ingots were evaluated. Solar cell performance versus substrate position within the ingots was obtained and the results are presented. Dendritic web samples were analyzed in terms of structural defects, and efforts were made to correlate the data with the performance of solar cells made from the webs