Fabrication of super-hydrophobic nickel film on copper substrate with improved corrosion inhibition by electrodeposition process

Inspired by the famous “lotus effect”, we have fabricated the super-hydrophobic surfaces with nickel film on copper substrates using a one-step electrodeposition method. By adjusting processing time, water contact angle of as-prepared surfaces can reach as high as 160.3 ± 1.5° with small rolling angle of 3.0 ± 0.5°, showing excellent super-hydrophobicity. After the deposition of nickel coating, the pristine copper surfaces became much rough with packed cauliflower-/thorn-like clusters. This unique surface texture contributed to trapping large amount of air and forming the air cushion underneath the water droplet, which can prevent the liquids contacting the copper substrate. The examination of surface chemical compositions implied that the deposited super-hydrophobic coating consisted of nickel crystals and nickel myristate. In this research, the formation mechanism of the electrodeposited super-hydrophobicity was extensively explained based on the analyses of surface texture and surface chemistry. Moreover, the corrosion resistance of the as-fabricated super-hydrophobic surface was estimated by the potentiodynamic polarization tests as well as the electrochemical impedance spectroscopy (EIS) measurements. The results demonstrate that the super-hydrophobic nickel coating showed excellent corrosion inhibition in simulated seawater solution. The existence of the super-hydrophobic coating could be regarded as a barrier and thus provide a perfect air-liquid interface that inhibits the penetration of the corrosive ions. This facile and effective method of electrodeposition process offers a promising approach for mass production of super-hydrophobic surfaces on various metals

Insights into the wettability transition of nanosecond laser ablated surface under ambient air exposure

Super-hydrophobic surfaces are attractive due to self-cleaning and anti-corrosive behaviors in harsh environments. Laser texturing offers a facile method to produce super-hydrophobic surfaces. However, the results indicated that the fresh laser ablated surface was generally super-hydrophilic and then gradually reached super-hydrophobic state when exposed to ambient air for certain time. Investigating wettability changing mechanism could contribute to reducing wettability transition period and improving industrial productivity. To solve this problem, we have studied the bare aluminum surface, fresh laser ablated super-hydrophilic surface, 15-day air exposed surface, and the aged super-hydrophobic surface by time-dependent water contact angle (WCA) and rolling angle (RA), scanning electron microscopy (SEM), 3D profile and X-ray photoelectron spectroscopy (XPS). The origins of super-hydrophilicity of the fresh laser ablated surface are identified as (1) the formation of hierarchical rough structures and (2) the surface chemical modifications (the decrease of nonpolar carbon, the formation of hydrophilic alumina and residual unsaturated atoms). The chemisorbed nonpolar airborne hydrocarbons from air moisture contributed to the gradual super-hydrophobic transition, which can be proved by the thermal annealing experiment. Particularly, to clearly explore the wettability transition mechanism, we extensively discussed why the laser-induced freshly outer layer was super-hydrophilic and how the airborne hydrocarbons were chemisorbed. This work not only provides useful insights into the formation mechanism of laser ablated super-hydrophobic surfaces, but also further guides industry to effectively modify surface chemistry to reduce wettability transition period and rapidly produce stable and durable super-hydrophobic surfaces. [Abstract copyright: Copyright © 2018. Published by Elsevier Inc.

Modification of wetting property of Inconel 718 surface by nanosecond laser texturing

Topographic and wetting properties of Inconel 718 (IN718) surfaces were modified via nanosecond laser treatment. In order to investigate surface wetting behavior without additional post treatment, three kinds of microstructures were created on IN718 surfaces, including line pattern, grid pattern and spot pattern. From the viewpoint of surface morphology, the results show that laser ablated grooves and debris significantly altered the surface topography as well as surface roughness compared with the non-treated surfaces. The effect of laser parameters (such as laser scanning speed and laser average power) on surface features was also discussed. We have observed the treated surface of IN718 showed very high hydrophilicity just after laser treatment under ambient air condistion.And this hydrophicility property has changed rapidly to the other extreme; very high hydrophobicity over just about 20 days. Further experiments and analyses have been carried out in order to investigate this phenomena. Based on the XPS analysis, the results indicate that the change of wetting property from hydrophilic to hydrophobic over time is due to the surface chemistry modifications, especially carbon content. After the contact angles reached steady state, the maximum water contact angle (WCA) for line-patterned and grid-patterned surfaces increased to 152.3 1.2° and 156.8 1.1° with the corresponding rolling angle (RA) of 8.8 1.1° and 6.5 0.8°, respectively. These treated IN718 surfaces exhibited superhydrophobic property. However, the maximum WCA for the spot-patterned surfaces just increased to 140.8 2.8° with RA above 10°. Therefore, it is deduced that laser-inscribed modification of surface wettability has high sensitivity to surface morphology and surface chemical compositions. This work can be utilized to optimize the laser processing parameters so as to fabricate desired IN718 surfaces with hydrophobic or even superhydrophobic property and thus extend the applications of IN718 material in various fields

Lithography-induced hydrophobic surfaces of silicon wafers with excellent anisotropic wetting properties

In recent years, hydrophobic surfaces have attracted more and more attentions from many researchers. In this paper, we comprehensively discussed the effects of specific parameters of microstructures on the wetting properties by using the theoretical models, the effects of microstructures on two-dimensional anisotropic properties and the water droplet impact experiment. Firstly, the relationships between the CAs and variable parameters were explored after the formula derivation for three various patterns. Then three different patterns were fabricated successfully on the silicon wafers by lithography technology and the effects of microstructures (including LWD parameters and interval parameters) on surface wettability were studied based on the theoretical research. After that, the effects of microstructures on two-dimensional anisotropic properties were also studied. Finally, the water droplet impact experiment was carried out and the viscoelastic properties were simply investigated. Our research proposed a potential method for fabricating hydrophobic surfaces with excellent anisotropic properties. This method may be widely used in a variety of academic and industrial applications in the future

Thermal Analysis and Junction Temperature Estimation under Different Ambient Temperatures Considering Convection Thermal Coupling between Power Devices

The convection thermal coupling between adjacent power devices in power converters is dependent on the ambient temperature. When the ambient temperature changes, the convection thermal coupling also changes. This results in an inaccurate thermal model that causes errors in the prediction of the thermal distribution and junction temperature based on a fixed ambient temperature for power devices in converters application. To solve this variable-ambient-temperature-related issue, a thermal coupling experiment for semiconductor power devices (the MOSFET and diode) was performed to discuss the influence of the thermal coupling effect between adjacent devices and the FEM (Finite Element Method) thermal models for the power devices considering the convection thermal coupling are established. Through these simulations, the junction temperatures of devices under different ambient temperatures were obtained, and the relationships between the junction temperature and ambient temperatures were established. Moreover, the junction temperatures of power devices under different ambient temperatures were calculated and temperature distributions are analyzed in this paper. This method shows a strong significance and has potential applications for high-efficiency and high-power density converter designs