389 research outputs found

    A perturbative approach to predict eye diagram degradation in differential interconnects subject to asymmetry and nonuniformity

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    This paper proposes a novel framework for the signal integrity (SI) analysis of differential interconnects affected by nonuniformity and geometrical asymmetry. The pertinent nonuniform transmission-line (TL) equations are solved in the frequency domain by means of a perturbation technique, which allows interpreting the resulting response degradation as a perturbation with respect to the response of a reference uniform differential line (DL) with averaged per-unit-length (p.u.l.) parameters. Following this interpretation, the problem is recast as a standard TL equation for the reference uniform line with additional equivalent distributed sources that account for the perturbative effect of asymmetric nonuniformity. This equivalent perturbation problem is solved iteratively in the frequency domain, and the corresponding time-domain behavior is obtained via inverse Fourier transform. Moreover, upon consideration that local perturbations negligibly impact on far-end differential mode (DM) quantities, the uniform DL model with averaged p.u.l. parameters is used for the SI performance evaluation of transmitted DM voltages in SPICE, showing that comparable results can be obtained while avoiding the cumbersome implementation of a nonuniform transmission line topology. The methodology is applied to the prediction of the eye diagram degradation for a 20 Gbps transmission through a microstrip DL subject to geometrical asymmetry and nonuniformity

    Compensating mode conversion due to bend discontinuities through intentional trace asymmetry

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    In this letter, a comparative analysis is carried out between the mechanism of mode conversion in differential microstrip lines due to bend discontinuities on one side and trace asymmetry on the other side. With the help of equivalent modal circuits, a theoretical basis is provided for the idea to compensate the undesired common mode (CM), due to the presence of the bend, by intentionally designing asymmetric traces. As an application example, the proposed CM-reduction strategy is used in conjunction with another recently-presented wideband CM suppression filter for differential microstrip lines. It is shown that the proposed solution enhances the overall CM-reduction performance of the filter by some decibels, while preserving its transmission properties

    Signal Order Optimization of Interconnects Enabling High Electromagnetic Compatibility Performance in Modern Electrical Systems

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    Flexible flat cables (FFCs) are a typical form of interconnect in modern electrical and electronic systems that facilitate signal transmission between components while minimizing harness volume. FFCs offer a practical connectivity solution in energy management applications, where sensors and displays are essential for monitoring power consumption and performing advanced digital control. In FFCs, signal lines run parallel to each other, and the proximity between lines can cause interference among adjacent signals. Therefore, the arrangement of signals along different lines can significantly influence the overall transmission performance. In this paper, the order of signals within the FFC is optimized to ensure optimal transmission performance, avoiding electromagnetic compatibility (EMC) and signal integrity (SI) issues. The problem is tackled by implementing a multi-objective optimization (MOO) approach, whose aim is to minimize near-end and far-end crosstalk, namely NEXT and FEXT. The effectiveness of the proposed approach is verified by considering a minimized interconnection system involving an FFC. The Pareto-optimal solutions are identified, and worst-case and best-case conditions are highlighted. The results show improvements in EMC and SI, underlining the relevance of the proposed optimization strategy. The proposed strategy provides a valuable tool for designing high-performance interconnections in electrical and electronic systems

    Review of Mode Conversion and Modal Analysis in Electromagnetic Compatibility

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    Undesired conversion between common-mode (CM) and differential-mode (DM) noise often occurs in modern electronic and electrical systems, posing challenges in terms of Electromagnetic Compatibility (EMC). Modal analysis represents a crucial tool in EMC investigation and provides insight into the mechanism underlying mode conversion. By inspecting CM and DM behaviors and their interconversion, it allows for understanding of conducted emission propagation mechanisms, drives electromagnetic interference (EMI) filter design towards optimal/tailored solutions, and enables the possibility to identify the main contributors to the radiated emission phenomenon. This paper offers a comprehensive review of mathematical methodologies and modelling strategies for EMC-oriented modal analysis, with particular emphasis on mode conversion phenomena. To this end, modal decomposition techniques and standard parameters for quantifying mode conversion are summarized and compared. Additionally, the paper provides an overview and in-depth discussion of different scenarios and test cases in which mode conversion occurs, with the final goal to achieve a systematic comprehension of its root causes and consequences within power and communication systems. Eventually, a survey of circuit modelling approaches for mode conversion is presented, offering insights into addressing this phenomenon effectively

    Modeling of imbalance in differential lines targeted to SPICE simulation

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    partially_open5siIn this paper, a SPICE model representative for the mode conversion occurring in differential lines affected by imbalance either of the line cross-section and the terminal networks is developed. The model is based on the assumption of weak imbalance and allows approximate prediction of modal quantities, through separate modeling of the contributions due to line and termination imbalance by controlled sources with (possibly) frequency dependent gain. The proposed SPICE model is used to perform worst-case prediction of undesired modal voltages induced at line terminals by mode conversion.openGrassi, Flavia; Wu, Xinglong; Yang, Yuehong; Spadacini, Giordano; Pignari, Sergio A.Grassi, Flavia; Wu, Xinglong; Yang, Yuehong; Spadacini, Giordano; Pignari, SERGIO AMEDE
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