The use of phase diagrams and thermodynamic databases for electronic materials

Phase diagrams and a themodynamic database constructed by the Calculation of Phase Diagrams approach offer powerful tools for alloy design and materials development. This article presents recent progress on the themodynamic database for microsolders and copper-based alloys, which is useful for the development of lead-free solders and prediction of intetfacial phenomena between solders and the copper substrate in electronic packaging technology. In addition, examples of phase diagram applications are presented to facilitate the development of Co-Cr-based magnetic recording media in hard disks and twit, ferromagnetic shape-memory alloys