2,009 research outputs found

    High-efficiency Silicon Heterojunction Solar Cells: A Review

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    Silicon heterojunction solar cells consist of thin amorphous silicon layers deposited on crystalline silicon wafers. This design enables energy conversion efficiencies above 20% at the industrial production level. The key feature of this technology is that the metal contacts, which are highly recombination active in traditional, diffused-junction cells, are electronically separated from the absorber by insertion of a wider bandgap layer. This enables the record open-circuit voltages typically associated with heterojunction devices without the need for expensive patterning techniques. This article reviews the salient points of this technology. First, we briefly elucidate device characteristics. This is followed by a discussion of each processing step, device operation, and device stability and industrial upscaling, including the fabrication of solar cells with energy-conversion efficiencies over 21%. Finally, future trends are pointed ou

    Kinetics of a-Si:H bulk defect and a-Si:H/c-Si interface-state reduction

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    Low-temperature annealing of hydrogenated amorphous silicon (a-Si:H) is investigated. An identical energy barrier is found for the reduction of deep defects in the bulk of a-Si:H films and at the interface such layers form with crystalline Si (c-Si) surfaces. This finding gives direct physical evidence that the defects determining a-Si:H/c-Si interface recombination are silicon dangling bonds and that also kinetically this interface has no unique features compared to the a-Si:H bulk

    Impact of the TCO Microstructure on the Electronic Properties of Carbazole-Based Self-Assembled Monolayers

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    Carbazole-based self-assembled monolayers (PACz-SAMs), anchored via their phosphonic acid group on a transparent conductive oxide (TCO), have demonstrated excellent performance as hole-selective layers in perovskite/silicon tandem solar cells. Yet, whereas different PACz-SAMs have been explored, the role of the TCO, and specifically its microstructure, on the hole transport properties of the TCO/PACz-SAMs stack has been largely overlooked. Here, we demonstrate that the TCO microstructure directly impacts the work function (WF) shift after SAM anchoring and is responsible for WF variations at the micro/nanoscale. Specifically, we studied Sn-doped In2O3 (ITO) substrates with amorphous and polycrystalline (featuring either nanoscale- or microscale-sized grains) microstructures before and after 2PACz-SAMs and NiOx/2PACz-SAMs anchoring. With this, we established a direct correlation between the ITO crystal grain orientation and 2PACz-SAMs local potential distribution, i.e., the WF. Importantly, these variations vanish for amorphous oxides (either in the form of amorphous ITO or when adding an amorphous NiOx buffer layer), where a homogeneous surface potential distribution is found. These findings highlight the importance of TCO microstructure tuning, to enable both high mobility and broadband transparent electrodes while ensuring uniform WF distribution upon application of hole transport SAMs, both critical for enhanced device performance.</p

    Impact of TCO Microstructure on the Electronic Properties of Carbazole-based Self-Assembled Monolayers

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    Carbazole-based self-assembled monolayers (PACz-SAMs), anchored via their phosphonic acid group on a transparent conductive oxide (TCO) have demonstrated excellent performance as hole-selective layers in inverted perovskite solar cells. However, the influence of the TCO microstructure on the work function (WF) shift after SAM anchoring as well as the WF variations at the micro/nanoscale have not been extensively studied yet. Herein, we investigate the effect of the Sn-doped In2O3 (ITO) microstructure on the WF distribution upon 2PACz-SAMs and NiOx/2PACz-SAMs application. For this, ITO substrates with amorphous and polycrystalline (featuring either nanoscale or microscale-sized grains) microstructures are studied. A correlation between the ITO grain orientation and 2PACz-SAMs local potential distribution was found via Kelvin probe force microscopy and electron backscatter diffraction. These variations vanish for amorphous ITO or when adding an amorphous NiOx buffer layer, where a homogeneous surface potential distribution is mapped. Ultraviolet photoelectron spectroscopy confirmed the ITO WF increase after 2PACz-SAMs deposition. Considering the importance of polycrystalline TCOs as high mobility and broadband transparent electrodes, we provide insights to ensure uniform WF distribution upon application of hole transport SAMs, which is critical towards enhanced device performance.Comment: 18 pages, 5 figure

    Very fast light-induced degradation of a-Si:H/c-Si(100) interfaces

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    Light-induced degradation (LID) of crystalline silicon (c-Si) surfaces passivated with hydrogenated amorphous silicon (a-Si:H) is investigated. The initial passivation decays on polished c-Si(100) surfaces on a time scale much faster than usually associated with bulk a-Si:H LID. This phenomenon is absent for the a-Si:H/c-Si(111) interface. We attribute these differences to the allowed reconstructions on the respective surfaces. This may point to a link between the presence of so-called "fast" states and (internal) surface reconstruction in bulk a-Si:H

    Cs-Doped and Cs-S Co-Doped CuI p-Type Transparent Semiconductors with Enhanced Conductivity

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    One hindrance in transparent electronics is the lack of high-performance p-type transparent conductors (TCs). The state-of-the-art p-type TC, CuI, has a conductivity two orders of magnitude lower than n-type TCs like ITO. While doping strategies have shown promise in enhancing the hole carrier density in CuI, they often come at the expense of hole mobility. Therefore, understanding how extrinsic dopants affect the mobility of CuI is critical to further improve the performance of CuI-based TCs. Here the structural and electronic properties of Cs-doped CuI are investigated. It is demonstrated that ≈4 at.% Cs doping in CuI increases the carrier density from 2.1 × 1019 to 3.8 × 1020 cm−3 while preserving the film microstructure and local coordination of Cu, as confirmed by HRTEM and XAS analysis. Introducing S as a co-dopant in Cs:CuI boosts the carrier density to 8.2 × 1020 cm−3, reaching a stable conductivity of ≈450 S cm−1. In all cases, the enhanced carrier density negatively affects the hole mobility with ionized impurity scattering and increased Seebeck hole effective mass as mobility limiting mechanisms. Nonetheless, the new Cs, S co-doped CuI exhibits high p-type conductivity, Vis–NIR transparency, and stability, presenting an attractive candidate for future transparent electronic devices.</p

    Amorphous silicon passivated contacts for diffused junction silicon solar cells

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    Carrier recombination at the metal contacts is a major obstacle in the development of high-performance crystalline silicon homojunction solar cells. To address this issue, we insert thin intrinsic hydrogenated amorphous silicon [a-Si:H(i)] passivating films between the dopant-diffused silicon surface and aluminum contacts. We find that with increasing a-Si:H(i) interlayer thickness (from 0 to 16 nm) the recombination loss at metal-contacted phosphorus (n +) and boron (p+) diffused surfaces decreases by factors of ∼25 and ∼10, respectively. Conversely, the contact resistivity increases in both cases before saturating to still acceptable values of ∼ 50 mΩ cm2 for n+ and ∼100 mΩ cm2 for p+ surfaces. Carrier transport towards the contacts likely occurs by a combination of carrier tunneling and aluminum spiking through the a-Si:H(i) layer, as supported by scanning transmission electron microscopy-energy dispersive x-ray maps. We explain the superior contact selectivity obtained on n+ surfaces by more favorable band offsets and capture cross section ratios of recombination centers at the c-Si/a-Si:H(i) interface

    Damage at hydrogenated amorphous/crystalline silicon interfaces by indium tin oxide overlayer sputtering

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    Damage of the hydrogenated amorphous/crystalline silicon interface passivation during transparent conductive oxide sputtering is reported. This occurs in the fabrication process of silicon heterojunction solar cells. We observe that this damage is at least partially caused by luminescence of the sputter plasma. Following low-temperature annealing, the electronic interface properties are recovered. However, the silicon-hydrogen configuration of the amorphous silicon film is permanently changed, as observed from infra-red absorbance spectra. In silicon heterojunction solar cells, although the as-deposited film’s microstructure cannot be restored after sputtering, no significant losses are observed in their open-circuit voltag

    Analysis of lateral transport through the inversion layer in amorphous silicon/crystalline silicon heterojunction solar cells

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    In amorphous/crystalline silicon heterojunction solar cells, an inversion layer is present at the front interface. By combining numerical simulations and experiments, we examine the contribution of the inversion layer to lateral transport and assess whether this layer can be exploited to replace the front transparent conductive oxide (TCO) in devices. For this, heterojunction solar cells of different areas (2 x 2, 4 x 4, and 6 x 6 mm(2)) with and without TCO layers on the front side were prepared. Laser-beam-induced current measurements are compared with simulation results from the ASPIN2 semiconductor simulator. Current collection is constant across millimeter distances for cells with TCO; however, carriers traveling more than a few hundred microns in cells without TCO recombine before they can be collected. Simulations show that increasing the valence band offset increases the concentration of holes under the surface of n-type crystalline silicon, which increases the conductivity of the inversion layer. Unfortunately, this also impedes transport across the barrier to the emitter. We conclude that the lateral conductivity of the inversion layer may not suffice to fully replace the front TCO in heterojunction devices. (C) 2013 AIP Publishing LLC
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