Electron-Shading Characterization in a HDP Contact Etching Process Using a Patterned CHARM Wafer

In this work, a CHARM-2 wafer with high aspect ratio resist patterns has been used to quantitatively I. Introduction To understand the origin of plasma-induced damage, useful plasma parameters such as floating potentials and J-V characteristics can be measured using the non-invasive CHARM method To study this effect, we have designed different resist patterns on a 200 mm CHARM™-2 wafer with an e-beam lithography. This allows to obtain realistic variable aspect ratio as high as 4, contrary to previous studie

Characterization of Wafer Charging Mechanisms and Oxide Survival Prediction Methodology

Unipolar, EEPROM-based peak potential sensors and current sensors have been used to characterize the I-V relationship of charging transients which devices normally experience during the course of ion implantation. The results indicate that the charging sources may appear to behave like current-sources or voltage-sources, depending on the impedance of the load. This behavior may be understood in terms of plasma concepts. The ability to empirically characterize the I-V characteristics of charging sources using the CHARM-2 monitor wafers opens the way for prediction of failure rates of oxides subjected to specific processes, if the oxide Q{sub bd} distributions are known

Surface charge control during high-current ion implantation: Characterization with CHARM-2 sensors

Studies of the charging effects during implantation with 9200 and 9500 tools using EEPROM-based sensors, CHARM-2, are reported for 60keV As beams

Mitchell Building and Elder Conservatorium

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