High-performance silver-dielectric interference filters for RGBIR imaging

International audienceNew architectures of interference silver-dielectric multilayer filters inspired from induced transmission designs are investigated with the prospect of high-performance red-greenblue (RGB) complementary metal oxide semiconductor imaging. The optimized designs provide combined colorimetric, signal-to-noise ratio and sensitivity performances similar to the traditional organic color filters, but without the equirement of an external infrared (IR)-cut filter, which enables the integration of additional channels such as white or IR, in addition to RGB. Due to the sub-micrometer thickness of the stacks, this is a unique solution for fully integrated, high-performance multispectral filters patterned in very small pixels. The concept is demonstrated by a wafer-scale prototype with RGBIR filters patterned down to 1.4 mu m adjacent pixels with up to 80% transmission

Ultra Wide Micro Bumps Interconnection Matrix for High Energy Particle Detection: Process and Assembly

International audienceMicro pillars and micro bumps interconnections are considered as mature technology for 3-D integration and chip stacking. However, in the framework of high-energy particles detection as ATLAS Large Hadron Collider new tracker project at CERN, very large area array of dense interconnections with an aggressive specification of total thickness variation (TTV) of +/-2μm are required to grant successful detectors assembly process. This paper will first describe the test vehicle that has been designed on purpose for this study. The studies undertaken including lithography mapping, seed layer and electrochemical deposition (ECD) process will then be detailed introducing a model of anode intensity contribution to the overall TTV. To conclude, daisy chain electrical test results and yields after stacking using dieto-wafer approaches will be discussed with respects to process parameters