Poly(arylene ether imidazole) surfacing films for flat and parabolic structures

Films of thermoplastic poly(arylene ether imidazole)s (PAEIs) are used as surface modifiers for neat resin panels and composite resin panels. The PAEI polymer contains imidazole groups along the backbone which co-cure, i.e., react chemically, with epoxies or bismaleimides during processing and thereby provide excellent adhesion between the PAEI film and an epoxy or bismaleimide neat resin or composite resin facesheet. The film provides good adhesion and a smooth surface to the finished part and acts as a release agent from the mold. The as-processed integral structures have very smooth (specular) surfaces, and since the film releases readily from a glass mold, no release agent is necessary. The PAEI film is thermally stable, resistant to electron radiation, and adheres tenaciously to the facesheet. The film maintains good adhesion even after thermal cycling from room temperature to approximately -196 C

Preparing polymeric matrix composites using an aqueous slurry technique

An aqueous process was developed to prepare a consolidated composite laminate from an aqueous slurry. An aqueous poly(amic acid) surfactant solution was prepared by dissolving a poly(amic acid) powder in an aqueous ammonia solution. A polymeric powder was added to this solution to form a slurry. The slurry was deposited on carbon fiber to form a prepreg which was dried and stacked to form a composite laminate. The composite laminate was consolidated using pressure and was heated to form the polymeric matrix. The resulting composite laminate exhibited high fracture toughness and excellent consolidation

Poly(arylene ether imidazole) surfacing films for flat and parabolic structures

Films of thermoplastic poly(arylene ether imidazole)s (PAEI)s are used as surface modifiers for neat resin panels and composite resin panels. The PAEI polymer contains imidazole groups along the backbone which co-cure, i.e., react chemically, with epoxies or bismaleimides during processing and thereby provide excellent adhesion between the PAEI film and an epoxy or bismaleimide neat resin or composite resin facesheet. The film provides good adhesion and a smooth surface to the finished part and acts as a release agent from the mold. The as-processed integral structures have very smooth (specular) surfaces, and since the film releases readily from a glass mold, no release agent is necessary. The PAEI film is thermally stable, resistant to electron radiation, and adheres tenaciously to the facesheet. The film maintains good adhesion even after thermal cycling from room temperature to .about. -196.degree. C

Polyimide Matrix composites: Polyimidesulfone/LARC-TPI (1:1) blend

Polyimide matrix composites were fabricated from unidirectional unsized AS-4 carbon fiber and a doped 1:1 blend of two polyimides: benzophenone dianhydride-3,3'-diamino diphenylsulfone (PISO2) and benzophenone dianhydride-3,3'-diamino benzophenone (LARC-TPI). To enhance melt flow properties, the molecular weight of the PISO2 was controlled by end-capping with phthalic anhydride and addition of 5 percent by weight p-phenylene diamine-phthalic anhydride bisamic acid dopant. Prepreg was drum-wound using a diglyme slurry comprised of the soluble polyamideacid of PISO2, the soluble bisamideacid of the dopant, and the insoluble imidized LARC-TPI powder. Melt flow studies with a rotary rheometer and parallel plate plastometer on neat resin and prepreg helped develop an optimum cure cycle. Composite mechanical properties at room and elevated temperatures, dry and moisture-saturated, were evaluated, including short beam shear strength and flexure, tensile, shear, and compression properties. Two 18 in. x 24 in. skin-stringer panels were fabricated, one of which was tested in compression to failure

Clumping factor B promotes adherence of <i>Staphylococcus aureus </i>to corneocytes in atopic dermatitis

Staphylococcus aureus skin infection is a frequent and recurrent problem in children with the common inflammatory skin disease atopic dermatitis (AD). S. aureus colonizes the skin of the majority of children with AD and exacerbates the disease. The first step during colonization and infection is bacterial adhesion to the cornified envelope of corneocytes in the outer layer, the stratum corneum. Corneocytes from AD skin are structurally different from corneocytes from normal healthy skin. The objective of this study was to identify bacterial proteins that promote the adherence of S. aureus to AD corneocytes. S. aureus strains from clonal complexes 1 and 8 were more frequently isolated from infected AD skin than from the nasal cavity of healthy children. AD strains had increased ClfB ligand binding activity compared to normal nasal carriage strains. Adherence of single S. aureus bacteria to corneocytes from AD patients ex vivo was studied using atomic force microscopy. Bacteria expressing ClfB recognized ligands distributed over the entire corneocyte surface. The ability of an isogenic ClfB-deficient mutant to adhere to AD corneocytes compared to that of its parent clonal complex 1 clinical strain was greatly reduced. ClfB from clonal complex 1 strains had a slightly higher binding affinity for its ligand than ClfB from strains from other clonal complexes. Our results provide new insights into the first step in the establishment of S. aureus colonization in AD patients. ClfB is a key adhesion molecule for the interaction of S. aureus with AD corneocytes and represents a target for interventio