16 research outputs found

    Latest results from the SEMATECH Berkeley extreme ultraviolet microfield exposure tool

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    Microfield exposure tools (METs) continue to play a dominant role in the development of extreme ultraviolet (EUV) resists. One of these tools is the 0.3 numerical aperture SEMATECH Berkeley MET operating as a resist and mask test center. Here they present an update on the tool summarizing some of the latest test and characterization results. they provide an update on the long-term aberration stability of the tool and present line-space imaging in chemically amplified photoresist down to the 20-nm half-pitch level. Although resist development has shown substantial progress in the area of resolution, line-edge-roughness (LER) remains a significant concern. Here we present a summary of recent LER performance results and consider the effect of mask contributors to the LER observed from the SEMATECH Berkeley microfield tool

    Double exposure using 193nm negative tone photoresist

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    ABSTRACT Double exposure is one of the promising methods for extending lithographic patterning into the low k 1 regime. In this paper, we demonstrate double patterning of k 1-effective =0.25 with improved process window using a negative resist. Negative resist (TOK N-series) in combination with a bright field mask is proven to provide a large process window in generating 1:3 = trench:line resist features. By incorporating two etch transfer steps into the hard mask material, frequency doubled patterns could be obtained
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