Symbolic QED Pre-silicon Verification for Automotive Microcontroller Cores: Industrial Case Study

We present an industrial case study that demonstrates the practicality and effectiveness of Symbolic Quick Error Detection (Symbolic QED) in detecting logic design flaws (logic bugs) during pre-silicon verification. Our study focuses on several microcontroller core designs (~1,800 flip-flops, ~70,000 logic gates) that have been extensively verified using an industrial verification flow and used for various commercial automotive products. The results of our study are as follows: 1. Symbolic QED detected all logic bugs in the designs that were detected by the industrial verification flow (which includes various flavors of simulation-based verification and formal verification). 2. Symbolic QED detected additional logic bugs that were not recorded as detected by the industrial verification flow. (These additional bugs were also perhaps detected by the industrial verification flow.) 3. Symbolic QED enables significant design productivity improvements: (a) 8X improved (i.e., reduced) verification effort for a new design (8 person-weeks for Symbolic QED vs. 17 person-months using the industrial verification flow). (b) 60X improved verification effort for subsequent designs (2 person-days for Symbolic QED vs. 4-7 person-months using the industrial verification flow). (c) Quick bug detection (runtime of 20 seconds or less), together with short counterexamples (10 or fewer instructions) for quick debug, using Symbolic QED

CLEAR: Cross-Layer Exploration for Architecting Resilience - Combining Hardware and Software Techniques to Tolerate Soft Errors in Processor Cores

We present a first of its kind framework which overcomes a major challenge in the design of digital systems that are resilient to reliability failures: achieve desired resilience targets at minimal costs (energy, power, execution time, area) by combining resilience techniques across various layers of the system stack (circuit, logic, architecture, software, algorithm). This is also referred to as cross-layer resilience. In this paper, we focus on radiation-induced soft errors in processor cores. We address both single-event upsets (SEUs) and single-event multiple upsets (SEMUs) in terrestrial environments. Our framework automatically and systematically explores the large space of comprehensive resilience techniques and their combinations across various layers of the system stack (586 cross-layer combinations in this paper), derives cost-effective solutions that achieve resilience targets at minimal costs, and provides guidelines for the design of new resilience techniques. We demonstrate the practicality and effectiveness of our framework using two diverse designs: a simple, in-order processor core and a complex, out-of-order processor core. Our results demonstrate that a carefully optimized combination of circuit-level hardening, logic-level parity checking, and micro-architectural recovery provides a highly cost-effective soft error resilience solution for general-purpose processor cores. For example, a 50x improvement in silent data corruption rate is achieved at only 2.1% energy cost for an out-of-order core (6.1% for an in-order core) with no speed impact. However, selective circuit-level hardening alone, guided by a thorough analysis of the effects of soft errors on application benchmarks, provides a cost-effective soft error resilience solution as well (with ~1% additional energy cost for a 50x improvement in silent data corruption rate).Comment: Extended version of paper published in Proceedings of the 53rd Annual Design Automation Conferenc

X-Codes: Theory and Applications of Unknowable Inputs

Coordinated Science Laboratory was formerly known as Control Systems LaboratoryNSF / ACI-99-84492-CAREE

Editorial

In recent years, we have observed spectacular advancements in the area of nano-circuits and systems at several levels, from the fabrication material and device levels to the system and application levels. New emerging materials provide us with a wealth of new devices such as (silicon) nanowires, graphene, and carbon nanotubes fabricated in various technologies. Applications of these devices are vast and include, but are not limited to, new computing and memory structures, super-capacitors, as well as nano-bio-sensors based on the molecular combination of molecular probes to electronic devices. This special issue of the Journal on Emerging and Selected Topics in Circuits and Systems (JETCAS) has the purpose to collect some selected contributions to the workshop as well as other works in this domain, all subject to peer review. In particular, this issue focuses on two specific topics: biomedical circuits and systems, and 3-D integrated circuits and systems. This choice is motivated by a synergy of the spontaneous contributions in these areas as well as by the importance of these fields. We will review these two areas at large before briefly summarizing the contributions

Characterization and Implementation of Fault-Tolerant Vertical Links for 3-D Networks-on-Chip

Through silicon vias (TSVs) provide an efficient way to support vertical communication among different layers of a vertically stacked chip, enabling scalable 3-D networks-on-chip (NoC) architectures. Unfortunately, low TSV yields significantly impact the feasibility of high-bandwidth vertical connectivity. In this paper, we present a semi-automated design flow for 3-D NoCs including a defect-tolerance scheme to increase the global yield of 3-D stacked chips. Starting from an accurate physical and geometrical model of TSVs: 1) we extract a circuit-level model for vertical interconnections; 2) we use it to evaluate the design implications of extending switch architectures with ports in the vertical direction; moreover, 3) we present a defect-tolerance technique for TSV-based multi-bit links through an effective use of redundancy; and finally, 4) we present a design flow allowing for post-layout simulation of NoCs with links in all three physical dimensions. Experimental results show that a 3-D NoC implementation yields around 10% frequency improvement over a 2-D one, thanks to the propagation delay advantage of TSVs and the shorter links. In addition, the adopted fault tolerance scheme demonstrates a significant yield improvement, ranging from 66% to 98%, with a low area cost (20.9% on a vertical link in a NoC switch, which leads a modest 2.1% increase in the total switch area) in 130 nm technology, with minimal impact on very large-scale integrated design and test flows

New Logic Synthesis As Nanotechnology Enabler (invited paper)

Nanoelectronics comprises a variety of devices whose electrical properties are more complex as compared to CMOS, thus enabling new computational paradigms. The potentially large space for innovation has to be explored in the search for technologies that can support large-scale and high- performance circuit design. Within this space, we analyze a set of emerging technologies characterized by a similar computational abstraction at the design level, i.e., a binary comparator or a majority voter. We demonstrate that new logic synthesis techniques, natively supporting this abstraction, are the technology enablers. We describe models and data-structures for logic design using emerging technologies and we show results of applying new synthesis algorithms and tools. We conclude that new logic synthesis methods are required to both evaluate emerging technologies and to achieve the best results in terms of area, power and performance