An introduction to InP-based generic integration technology

Photonic integrated circuits (PICs) are considered as the way to make photonic systems or subsystems cheap and ubiquitous. PICs still are several orders of magnitude more expensive than their microelectronic counterparts, which has restricted their application to a few niche markets. Recently, a novel approach in photonic integration is emerging which will reduce the R&D and prototyping costs and the throughput time of PICs by more than an order of magnitude. It will bring the application of PICs that integrate complex and advanced photonic functionality on a single chip within reach for a large number of small and larger companies and initiate a breakthrough in the application of Photonic ICs. The paper explains the concept of generic photonic integration technology using the technology developed by the COBRA research institute of TU Eindhoven as an example, and it describes the current status and prospects of generic InP-based integration technology

An introduction to InP-based generic integration technology

Photonic integrated circuits (PICs) are considered as the way to make photonic systems or subsystems cheap and ubiquitous. PICs still are several orders of magnitude more expensive than their microelectronic counterparts, which has restricted their application to a few niche markets.Recently, a novel approach in photonic integration is emerging which will reduce the R&D and prototyping costs and the throughput time of PICs by more than an order of magnitude. It will bring the application of PICs that integrate complex and advanced photonic functionality on a single chip within reach for a large number of small and larger companies and initiate a breakthrough in the application of Photonic ICs. The paper explains the concept of generic photonic integration technology using the technology developed by the COBRA research institute of TU Eindhoven as an example, and it describes the current status and prospects of generic InP-based integration technology.Funding is acknowledged by the EU-projects ePIXnet, EuroPIC and PARADIGM and the Dutch projects NRC Photonics, MEMPHIS, IOP Photonic Devices and STW GTIP. Many others have contributed and the authors would like to thank other PARADIGM and EuroPIC partners for their help in discussions, particularly Michael Robertson (CIP).This is the final published version distributed under a Creative Commons Attribution License. It can also be viewed on the publisher's website at: http://iopscience.iop.org/0268-1242/29/8/08300

Integrated optical serializer fabricated in a multi-project wafer run

We present an integrated optical serializer designed and fabricated in a multi-project wafer run on indium-phosphide(InP)-based materials. The circuit is designed for a frontend unit in a data readout system. The InP-based technology platform enables monolithic integration of passive and active components. The serialization is provided by means of on-chip optical delay lines. The circuit makes use of electro-optic phase shifters to build amplitude modulators, multimode interference couplers for signal distribution, semiconductor optical amplifiers for signal loss compensation and on-chip reflectors. In this work we present the design and first experimental results of the fabricated device

Data readout system utilizing photonic integrated circuit

We describe a novel optical solution for data readout systems. The core of the system is an Indium-Phosphide photonic integrated circuit performing as a front-end readout unit. It functions as an optical serializer in which the serialization of the input signal is provided by means of on-chip optical delay lines. The circuit employs electro-optic phase shifters to build amplitude modulators, power splitters for signal distribution, semiconductor optical amplifiers for signal amplification as well as on-chip reflectors. We present the concept of the system, the design and first characterization results of the devices that were fabricated in a multi-project wafer run

Integrated optical serializer designed and fabricated in a generic InP based technology

This work presents design and characterization results of an optical pulse serializer, realized as an Application Specific Photonic Integrated Circuit (ASPIC) in a novel, generic InPbased technology and fabricated in a multi-project wafer run. The measurement results show high-speed (32 Gbit/s) output signal as a result of optical time domain multiplexing of parallel input signals. The on-off modulation of independent data channels is provided by means of electro-optical amplitude modulators with extinction ratio better than 20 dB

Integrated photonic data read-out unit utilizing WDM scheme

We present two photonic integrated circuits for application as a front-end data read-out unit. The PICs have been designed and fabricated in a generic, InP-based technology. The circuits make use of WDM scheme to read-out the digital data in parallel with a sam- pling frequency of 1 GHz in each channel. The PICs are built with AWGs as wavelength (de-)multiplexers, electro-optical amplitude modulators (using phase shifter sections in interferometer configuration) and SOAs for loss compensation. In this work we present the design and the measurement results of the fabricated devices. Two solutions of the circuits, in reflecting and transmitting configuration, are discussed

Integrated optical delay lines for time-division multiplexers

In this paper, we present a study of integrated optical delay lines (DLs) for application in optical time-division multiplexers. The investigated DLs are formed by spirally folded waveguides. The components were designed in a generic approach and fabricated in multi-project wafer runs on an InP-based platform. The design process and rules, together with characterization results of test structures, are discussed. Static and dynamic measurements were performed for verification of the DLs' performance in the wavelength and time domain. Additionally, a comparison between the simulation and characterization results is given, which confirms good agreement between measured and designed values

Photonic integrated multichannel WDM modulators for data read-out units

This study presents the recently developed monolithic photonic-integrated circuits that provide efficient amplitude modulation for wavelength division multiplexed optical channels. The circuits were designed for application as a read-out unit in a high-energy physics experiment, and are sufficiently general to be applied in various types of high-speed photonic transmitters. They were constructed using basic building blocks provided in an indium phosphide-based generic integration technology process and fabricated in a multi-project wafer run. Two variants of the circuits, utilizing modulators in Mach-Zehnder and Michelson interferometer configuration, are discussed. A modulation bandwidth of 18.6 GHz was measured and error-free transmission of a 10-Gb/s signal through 85 km of optical fiber was achieved